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Category:H01F27/02
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Pages in category "H01F27/02"
The following 17 pages are in this category, out of 17 total.
1
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17961244. TRANSFORMER DEVICE AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18465449. COIL DEVICE simplified abstract (TDK Corporation)
- 18529883. COIL COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
2
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I
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 4th, 2024