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Category:H01L25/10
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Pages in category "H01L25/10"
The following 200 pages are in this category, out of 409 total.
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- 18626388. SEMICONDUCTOR PACKAGE DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18630122. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18637664. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18651321. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18654268. Structure and Method of Forming a Joint Assembly simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18661700. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18733146. Optical Lithography System and Method of Using the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18733450. PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18747798. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18748765. SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
2
- 20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
- 20240087983.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
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- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on March 21st, 2024
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- Intel corporation (20240106139). CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240113088). INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract
- Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
- Intel corporation (20240321660). STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY simplified abstract
- Intel corporation (20240355792). REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on September 26th, 2024
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- Meta platforms technologies, llc (20240274587). 3D CHIPLET INTEGRATION USING FAN-OUT WAFER-LEVEL PACKAGING simplified abstract
- Meta platforms technologies, llc (20240332260). PACKAGE ARCHITECTURES FOR DIFFERENTIATED ARTIFICIAL-REALITY TASK-SPECIFIC CHIPLETS simplified abstract
- Meta Platforms Technologies, LLC patent applications on August 15th, 2024
- Meta Platforms Technologies, LLC patent applications on October 3rd, 2024
- Micron technology, inc. (20240258243). STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS OF MANUFACTURING STACKED DIE MODULES simplified abstract
- Micron technology, inc. (20240347413). THERMALLY REGULATED SEMICONDUCTOR DEVICE simplified abstract
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on October 17th, 2024
- Mitsubishi electric corporation (20240266715). ANTENNA simplified abstract
- Mitsubishi Electric Corporation patent applications on August 8th, 2024
- Murata manufacturing co., ltd. (20240250013). RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY MODULE simplified abstract
- Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
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- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract
- Qualcomm incorporated (20240243056). INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- QUALCOMM Incorporated patent applications on February 15th, 2024
- QUALCOMM Incorporated patent applications on July 18th, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
- QUALCOMM Incorporated patent applications on September 26th, 2024
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- Samsung electronics co., ltd. (20240096815). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105536). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105541). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240105567). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240105689). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240112974). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240120286). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240128176). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240130144). SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract
- Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136266). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136272). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240136329). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136340). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136341). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162132). FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178122). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178176). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240178202). SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240194553). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240194627). SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract
- Samsung electronics co., ltd. (20240203888). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203942). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240203958). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240203960). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240213174). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240213177). FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240222241). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240222244). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240222251). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240234274). SEMICONDUCTOR PACKAGE INCLUDING AN EDGE REGION HAVING A PLURALITY OF SOLDER BALLS THEREIN simplified abstract
- Samsung electronics co., ltd. (20240234276). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234279). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234286). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240234325). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234374). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240234388). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240243050). SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract
- Samsung electronics co., ltd. (20240243090). SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract
- Samsung electronics co., ltd. (20240243110). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240243111). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240250008). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240250011). FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240250066). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240258221). 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258242). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240258276). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240266248). SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240266269). SEMICONDUCTOR PACKAGE DEVICE simplified abstract
- Samsung electronics co., ltd. (20240274172). MEMORY PACKAGE, STORAGE DEVICE INCLUDING MEMORY PACKAGE, AND STORAGE DEVICE OPERATING METHOD simplified abstract
- Samsung electronics co., ltd. (20240274499). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240274553). INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274579). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240282672). SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT simplified abstract
- Samsung electronics co., ltd. (20240290702). INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290762). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240297122). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240319761). SEMICONDUCTOR DEVICE PERFORMING CLOCK GATING AND OPERATING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240321669). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321682). HEAT DISSIPATION STRUCTURES simplified abstract
- Samsung electronics co., ltd. (20240321700). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240321753). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321775). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321839). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321840). THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321841). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321842). PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240332268). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240347409). SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract
- Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract
- Samsung electronics co., ltd. (20240347437). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347468). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347508). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240355794). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240355796). SEMICONDUCTOR PACKAGE simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- SKYWORKS SOLUTIONS, INC. (20240250424). MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES simplified abstract
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- Taiwan semiconductor manufacturing co., ltd. (20240096642). METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096731). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096732). SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128122). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128157). Semiconductor Package and Method of Manufacturing the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194611). SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222339). Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240113032). PACKAGED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113089). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
