Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
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This category has only the following subcategory.
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Pages in category "H01L23/00"
The following 200 pages are in this category, out of 2,965 total.
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- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- Seiko epson corporation (20240312943). Channel Manufacturing Method simplified abstract
- SEIKO EPSON CORPORATION patent applications on September 19th, 2024
- Semiconductor energy laboratory co., ltd. (20240266378). IMAGING DEVICE AND ELECTRONIC DEVICE simplified abstract
- Semiconductor Energy Laboratory Co., Ltd. patent applications on August 8th, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. patent applications on January 25th, 2024
- Sk hynix inc. (20240119996). MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract
- Sk hynix inc. (20240120292). STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT simplified abstract
- Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract
- Sk hynix inc. (20240162148). SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Sk hynix inc. (20240162176). SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract
- Sk hynix inc. (20240178169). SEMICONDUCTOR DEVICE INCLUDING BONDING PAD simplified abstract
- Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
- Sk hynix inc. (20240179918). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract
- Sk hynix inc. (20240243081). SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICATING THE SAME simplified abstract
- Sk hynix inc. (20240243152). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Sk hynix inc. (20240249765). BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP simplified abstract
- Sk hynix inc. (20240266339). SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Sk hynix inc. (20240282756). SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract
- Sk hynix inc. (20240304467). METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM simplified abstract
- Sk hynix inc. (20240312509). BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE simplified abstract
- Sk hynix inc. (20240321710). SEMICONDUCTOR PACKAGE HAVING COMPENSATED ELECTRICAL CHANNEL PATHS simplified abstract
- Sk hynix inc. (20240324202). MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024
- SK hynix Inc. patent applications on August 22nd, 2024
- SK hynix Inc. patent applications on August 8th, 2024
- SK hynix Inc. patent applications on January 18th, 2024
- SK hynix Inc. patent applications on July 18th, 2024
- SK hynix Inc. patent applications on July 25th, 2024
- SK hynix Inc. patent applications on May 16th, 2024
- SK hynix Inc. patent applications on May 30th, 2024
- SK hynix Inc. patent applications on September 12th, 2024
- SK hynix Inc. patent applications on September 19th, 2024
- SK hynix Inc. patent applications on September 26th, 2024
- Sony group corporation (20240321927). IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract
- Sony Group Corporation patent applications on September 26th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240094282). CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096642). METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096647). HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096732). SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096760). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096781). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096787). SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096805). SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096811). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096816). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096822). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096827). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096837). PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096848). INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096849). SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128143). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128147). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128148). Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128157). Semiconductor Package and Method of Manufacturing the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128194). Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128217). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128218). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128231). Semiconductor Devices and Methods of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128635). SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162119). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162159). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162166). THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162171). METHOD FOR FABRICATING DEVICE DIE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162183). DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186235). INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186257). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186275). Semiconductor Devices and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186276). Honeycomb Pattern for Conductive Features simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186283). INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186308). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194556). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194569). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194588). SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194591). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194611). SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194619). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194644). VERTICALLY MOUNTED DIE GROUPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194730). Interconnect Layout for Semiconductor Device simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222194). PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222242). GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222247). SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222291). SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222292). Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222307). INTEGRATED CIRCUIT PACKAGES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222312). METHOD FOR FORMING A PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222318). METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222339). Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249994). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249999). Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250002). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250019). Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250020). VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250055). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250061). WAFER BONDING METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250067). MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312798). SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312836). INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312864). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312887). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312900). CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312904). METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312910). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312930). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312940). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312941). ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312952). Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313026). METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105530). Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105619). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105629). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105631). Three-Dimensional Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105632). Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105642). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105644). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105654). METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105701). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240107780). SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240107781). Optical Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112983). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113032). PACKAGED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113034). METHODS FOR FORMING SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113056). SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113089). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113159). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240114703). STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120207). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120257). Layer-By-Layer Formation Of Through-Substrate Via simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120277). CHIP STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120294). CHIP PACKAGE WITH LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120295). SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120313). CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120314). ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120315). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract