METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

Abstract: methods and systems for improving fusion bonding are disclosed. plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. the residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. in the methods, the amount of residual voltage on a test silicon wafer is measured. if the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. this ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.

Inventor(s): Hong-Ta Kuo, Yen-Hao Huang, I-Shi Wang, Ming-Yi Shen, Tzu-Ping Yang, Hsing-Yu Wang, Huang-Liang Lin, Yin-Tung Chou, Yuan-Hsin Chi, Sheng-Yuan Lin

CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})

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