SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Abstract: a semiconductor structure may include a first redistribution line, a first redistribution via that is positioned on the first redistribution line and has a width in the horizontal direction that decreases from a bottom end of the first redistribution via to a top end of the first redistribution via, a second redistribution line that is positioned on the first redistribution via, a dielectric that covers the first redistribution line, the first redistribution via, and the second redistribution line, and a first seed metal layer that is positioned between the lower surface of the first redistribution via and the first redistribution line, between the side surface of the first redistribution via and the dielectric, and between the lower surface of the second redistribution line and the dielectric.

Inventor(s): Junho Lee, JUHYEON KIM, SEUNGHOON YEON, SeungRyong Oh

CPC Classification: H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers, , , ); Manufacturing methods related thereto})

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