SEUNGHOON YEON

SEUNGHOON YEON from Suwon-si KR has applied for patents in technology areas such as [[:Category:{Bonding areas (on insulating substrates, e.g. chip carriers, , , ); Manufacturing methods related thereto}|{Bonding areas (on insulating substrates, e.g. chip carriers, , , ); Manufacturing methods related thereto}]] with Samsung Electronics Co., Ltd..

Patents

• SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (20250167144)

[[Category:{Bonding areas (on insulating substrates, e.g. chip carriers, , , ); Manufacturing methods related thereto}]]