DISCO CORPORATION Patent Application Trends in 2025
DISCO CORPORATION Patent Filing Activity
DISCO CORPORATION patent applications in 2025
Top 10 Technology Areas
- B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 7 patents
- Example: 20250001520. LASER PROCESSING METHOD (DISCO CORPORATION)
- H01L21/02013 ({Grinding, lapping})
- Count: 6 patents
- Example: 20250006484. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts)
- Count: 6 patents
- Example: 20250018531. WAFER GRINDING METHOD (DISCO CORPORATION)
- H01L21/02021 ({Edge treatment, chamfering})
- Count: 5 patents
- Example: 20250006484. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- Count: 5 patents
- Example: 20250073821. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies)
- Count: 4 patents
- Example: 20250069953. BREAKING METHOD (DISCO CORPORATION)
- H01L21/02016 ({Backside treatment})
- Count: 3 patents
- Example: 20250006484. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions)
- Count: 3 patents
- Example: 20250073820. WAFER PROCESSING METHOD (DISCO CORPORATION)
- H01L21/268 (Bombardment with radiation {()
- Count: 3 patents
- Example: 20250087489. CHIP MANUFACTURING METHOD (DISCO CORPORATION)
- B23K26/364 (Removing material ()
- Count: 2 patents
- Example: 20250033245. BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD (DISCO CORPORATION)
Emerging Technology Areas
- H01L21/0445 ({the devices having semiconductor bodies comprising crystalline silicon carbide (multistep processes for the manufacture of said devices)
- Count: 1 patents
- Example: 20250105167. METHOD OF PROCESSING WAFER (DISCO CORPORATION)
- G06T2207/30148 (Subject of image; Context of image processing)
- Count: 1 patents
- Example: 20250104213. METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS (DISCO CORPORATION)
- G06T2207/20212 (Special algorithmic details)
- Count: 1 patents
- Example: 20250104213. METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS (DISCO CORPORATION)
- H01L21/6704 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se)
- Count: 1 patents
- Example: 20250104213. METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS (DISCO CORPORATION)
- G06T7/0004 ({Industrial image inspection})
- Count: 1 patents
- Example: 20250104213. METHOD OF DETERMINING HYDROPHILICITY OF WAFER AND PROCESSING APPARATUS (DISCO CORPORATION)
- H01L22/24 ({Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change (voltage contrast)
- Count: 1 patents
- Example: 20250014949. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- H01L21/324 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250014889. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- H04N23/60 (Control of cameras or camera modules)
- Count: 1 patents
- Example: 20250013548. INFORMATION TRANSMISSION METHOD (DISCO CORPORATION)
- G06F11/321 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models)
- Count: 1 patents
- Example: 20250013548. INFORMATION TRANSMISSION METHOD (DISCO CORPORATION)
- G01N3/02 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms)
- Count: 1 patents
- Example: 20250012688. TEST APPARATUS (DISCO CORPORATION)
Top Inventors
- Akira MIZUTANI (6 patents)
- Kazuya HIRATA (3 patents)
- Norihisa ARIFUKU (2 patents)
- Yusuke OHTAKE (2 patents)
- Yoshikazu SUZUKI (2 patents)
- Yujiro UMEZAWA (2 patents)
- Taro ARAKAWA (2 patents)
- Atsushi KUBO (2 patents)
- Yuya SETO (1 patent)
- Shinya ARUGA (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- DISCO CORPORATION
- Companies
- CPC B28D5/0011
- CPC B23K26/364
- CPC B28D5/0052
- CPC H01L21/78
- CPC B23K26/066
- CPC B23K26/0622
- CPC B23K26/53
- CPC C30B25/14
- CPC C30B29/04
- CPC F25B49/022
- CPC F25B9/008
- CPC B24B55/02
- CPC F25B2600/0253
- CPC F25B2600/2513
- CPC F25B2700/1931
- CPC F25B2700/1933
- CPC F25B2700/2103
- CPC F25B2700/21151
- CPC F25B2700/21152
- CPC F25B2700/21161
- CPC F25B2700/21163
- CPC F25B2700/21172
- CPC F25B2700/21173
- CPC F25B2700/21175
- CPC H01L21/02021
- CPC H01L21/02013
- CPC H01L21/02016
- CPC H01L21/304
- CPC H01L21/561
- CPC H01L21/67092
- CPC H01L21/68764
- CPC B24B41/06
- CPC B24C9/00
- CPC B24B49/03
- CPC B24B7/228
- CPC B24B41/068
- CPC H01L22/12
- CPC B23K2101/40
- CPC H01L23/544
- CPC B23K26/0093
- CPC H01L2223/54493
- CPC C30B33/02
- CPC C30B29/36
- CPC H10N30/086
- CPC B24B51/00
- CPC B24B7/04
- CPC B26D3/02
- CPC B23Q1/03
- CPC B28D5/022
- CPC B28D5/0005
- CPC H01L21/268
- CPC H01L21/3043
- CPC B05B17/0669
- CPC B05B17/0615
- CPC B23K26/0624
- CPC B23K26/356
- CPC B23K2103/56
- CPC B28D7/04
- CPC H01L21/56
- CPC B28D5/047
- CPC B28D5/0082
- CPC B65G25/06
- CPC B65G2201/0297
- CPC G01N3/20
- CPC G01N3/02
- CPC G06F11/321
- CPC H04N23/60
- CPC H01L21/187
- CPC H01L21/324
- CPC H01L22/24
- CPC G06T7/0004
- CPC H01L21/6704
- CPC G06T2207/20212
- CPC G06T2207/30148
- CPC H01L21/0445
- Patent Trends by Company in 2025