Category:Chen-Hua Yu

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 13 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Multilayer substrates ( (3 patents), {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (9 patents), Taiwan Semiconductor Manufacturing Company Limited (4 patents). Their most frequent collaborators include (7 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5383 ({Multilayer substrates (): 3 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• G02B6/4283 (Coupling light guides with opto-electronic elements): 2 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 2 patents
• H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 2 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/1228 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4291 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4293 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/266 (using masks {(): 1 patents
• H01L27/0688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/125 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B2006/12119 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/1215 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/405 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2023/4087 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4257 (Coupling light guides with opto-electronic elements): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 9 patents
• Taiwan Semiconductor Manufacturing Company Limited: 4 patents

Collaborators

• Chung-Shi Liu (7 collaborations)
• Hao-Yi Tsai (4 collaborations)
• Chung-Hao Tsai (2 collaborations)
• Chung-Ming Weng (2 collaborations)
• Cheng-Chieh Hsieh (2 collaborations)
• Hung-Yi Kuo (2 collaborations)
• Tsung-Yuan Yu (2 collaborations)
• Hua-Kuei Lin (2 collaborations)
• Tsung-Fu Tsai (2 collaborations)
• Szu-Wei Lu (2 collaborations)
• Jih-Churng Twu (2 collaborations)
• Tin-Hao Kuo (2 collaborations)
• Hsing-Kuo Hsia (2 collaborations)
• Chih-Chieh Chang (1 collaborations)
• Chuei-Tang Wang (1 collaborations)
• Hsiu-Jen Lin (1 collaborations)
• Ming-Che Ho (1 collaborations)
• Yu-Hsiang Hu (1 collaborations)
• Chewn-Pu Jou (1 collaborations)
• Cheng-Tse Tang (1 collaborations)
• Chao-Jen Wang (1 collaborations)
• Che-Hsiang Hsu (1 collaborations)
• Su-Chun Yang (1 collaborations)
• Jui Hsuan Tsai (1 collaborations)
• Ching-Ho CHIN (1 collaborations)
• Chuei-Tang WANG (1 collaborations)
• Chen-Chiang Yu (1 collaborations)
• Kuo-Chung Yee (1 collaborations)
• Yu-Chia Lai (1 collaborations)
• Po-Yuan Teng (1 collaborations)
• Chun-Hao Fann (1 collaborations)
• Ming Lee (1 collaborations)
• Wei-Heng Lin (1 collaborations)
• Wei-Chih Lai (1 collaborations)
• Chien-Chia Chiu (1 collaborations)
• Der-Chyang Yeh (1 collaborations)
• Cheng-Hsien Hsieh (1 collaborations)
• Li-Han Hsu (1 collaborations)
• Tsung-Shu Lin (1 collaborations)
• Wei-Cheng Wu (1 collaborations)
• Yu-Chen Hsu (1 collaborations)
• Chih-Wei Tseng (1 collaborations)
• Jiun Yi Wu (1 collaborations)