Category:Wei-Yu Chen

Wei-Yu Chen

Executive Summary

Wei-Yu Chen is an inventor who has filed 1 patents. Their primary areas of innovation include {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturning Company, Ltd. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

List of Technology Areas

• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02371 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Taiwan Semiconductor Manufacturning Company, Ltd.: 1 patents

Collaborators

• Hao-Jan Pei (1 collaborations)
• Hsiu-Jen Lin (1 collaborations)
• Philip Yu-Shuan Chung (1 collaborations)
• Chia-Shen Cheng (1 collaborations)
• Kuei-Wei Huang (1 collaborations)
• Ching-Hua Hsieh (1 collaborations)
• Chung-Shi Liu (1 collaborations)
• Chen-Hua Yu (1 collaborations)