Intel corporation (20250022845). MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC ASSEMBLIES

Organization Name

intel corporation

Inventor(s)

Adel A. Elsherbini of Tempe AZ US

Feras Eid of Chandler AZ US

Johanna M. Swan of Scottsdale AZ US

Shawna M. Liff of Scottsdale AZ US

MICROELECTRONIC ASSEMBLIES

This abstract first appeared for US patent application 20250022845 titled 'MICROELECTRONIC ASSEMBLIES

Original Abstract Submitted

microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface embedded in a first dielectric layer, where the first surface of the first die is coupled to the second surface of the package substrate by first interconnects; a second die having a first surface and an opposing second surface embedded in a second dielectric layer, where the first surface of the second die is coupled to the second surface of the first die by second interconnects; and a third die having a first surface and an opposing second surface embedded in a third dielectric layer, where the first surface of the third die is coupled to the second surface of the second die by third interconnects.