Samsung electronics co., ltd. (20250006606). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

HYUNJU Lee of Suwon-si KR

GYUHO Kang of Suwon-si KR

SUNG KEUN Park of Suwon-si KR

KWANGOK Jeong of Suwon-si KR

JAEMOK Jung of Suwon-si KR

JU-IL Choi of Suwon-si KR

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250006606 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package may include: a substrate; a seed layer on a first surface of the substrate; a pad on the seed layer and including a first metal layer and a second metal layer on the first metal layer; an insulating layer on the first surface and including a side surface in contact with the second metal layer; and a semiconductor chip above a second surface of the substrate. an interface between the side surface of the insulating layer and the second metal layer may be nonplanar.