Samsung electronics co., ltd. (20250006606). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250006606 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package may include: a substrate; a seed layer on a first surface of the substrate; a pad on the seed layer and including a first metal layer and a second metal layer on the first metal layer; an insulating layer on the first surface and including a side surface in contact with the second metal layer; and a semiconductor chip above a second surface of the substrate. an interface between the side surface of the insulating layer and the second metal layer may be nonplanar.
