Category:Thomas Wagner of Regelsbach DE
Thomas Wagner
Thomas Wagner from Regelsbach DE has applied for patents in technology areas such as H01L23/522, H01L23/00, H01L23/528 with intel corporation.
Patents
Pages in category "Thomas Wagner of Regelsbach DE"
The following 7 pages are in this category, out of 7 total.
1
I
- Intel corporation (20250006630). Routing and Passive Components in a Direct Bonding Layer
- Intel corporation (20250112139). VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE
- Intel corporation (20250112191). DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Intel corporation (20250112202). THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY