Meta platforms technologies, llc (20250008656). WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

Organization Name

meta platforms technologies, llc

Inventor(s)

Andrew Matthew Bardagjy of Seattle WA US

Guangxun Liao of San Jose CA US

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

This abstract first appeared for US patent application 20250008656 titled 'WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

Original Abstract Submitted

techniques are described for electrically connecting printed circuit modules using wire bonding. a first printed circuit module may have one or more bonding pads electrically coupled with one or more electrical components of the first printed circuit module, and a second printed circuit module may have one or more bonding pads electrically coupled with one or more electrical components of the second printed circuit module. one or more wire bonds may be used to electrically connect the one or more bonding pads of the first printed circuit module to the one or more bonding pads of the second printed circuit module. a protective structure may be used to cover at least a portion of the one or more wire bonds.