Meta platforms technologies, llc (20250008656). WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
Organization Name
meta platforms technologies, llc
Inventor(s)
Andrew Matthew Bardagjy of Seattle WA US
Guangxun Liao of San Jose CA US
WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
This abstract first appeared for US patent application 20250008656 titled 'WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
Original Abstract Submitted
techniques are described for electrically connecting printed circuit modules using wire bonding. a first printed circuit module may have one or more bonding pads electrically coupled with one or more electrical components of the first printed circuit module, and a second printed circuit module may have one or more bonding pads electrically coupled with one or more electrical components of the second printed circuit module. one or more wire bonds may be used to electrically connect the one or more bonding pads of the first printed circuit module to the one or more bonding pads of the second printed circuit module. a protective structure may be used to cover at least a portion of the one or more wire bonds.
