18965717. MICROELECTRONIC ASSEMBLIES (Intel Corporation)

MICROELECTRONIC ASSEMBLIES

Organization Name

Intel Corporation

Inventor(s)

Shawna M. Liff of Scottsdale AZ US

Adel A. Elsherbini of Tempe AZ US

Johanna M. Swan of Scottsdale AZ US

Arun Chandrasekhar of Chandler AZ US

MICROELECTRONIC ASSEMBLIES

This abstract first appeared for US patent application 18965717 titled 'MICROELECTRONIC ASSEMBLIES

Original Abstract Submitted

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.