Category:Lin-Yu Huang of Hsinchu (TW)
Lin-Yu Huang
Lin-Yu Huang from Hsinchu (TW) has applied for patents in technology areas such as H01L27/02, H02H9/04 with taiwan semiconductor manufacturing company, ltd..
Patents
Pages in category "Lin-Yu Huang of Hsinchu (TW)"
The following 52 pages are in this category, out of 52 total.
1
- 17815854. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836399. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17839127. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17847863. METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17849725. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17849734. METHOD FOR FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17885577. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887487. SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17892864. SEMICONDUCTOR DEVICE WITH REVERSE-CUT SOURCE/DRAIN CONTACT STRUCTURE AND METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18047412. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18097249. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18158036. AIR SPACER AND CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18186754. PROTECTION LAYER FOR SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18348741. ELECTROSTATIC DISCHARGE IN GALLIUM NITRIDE DEVICES (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18410016. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18434077. VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18604557. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610318. SEMICONDUCTOR DEVICE WITH BACKSIDE POWER RAIL AND METHODS OF FABRICATION THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18628112. AIR SPACERS FOR SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18652803. SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18670132. BACKSIDE GATE CONTACT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18679546. USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18750589. SELECTIVE LINER ON BACKSIDE VIA AND METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18752172. SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18753744. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240096997). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186179). Methods of Forming Spacers for Semiconductor Devices Including Backside Power Rails simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222507). SEMICONDUCTOR DEVICE WITH BACKSIDE POWER RAIL AND METHODS OF FABRICATION THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250017). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250151). AIR SPACERS FOR SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429310). ELECTROSTATIC DISCHARGE CIRCUITRY FOR A HIGH-VOLTAGE SEMICONDUCTOR DEVICE
- Taiwan semiconductor manufacturing company, ltd. (20240178069). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178132). VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240204045). SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258158). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290852). Source/Drain Contacts and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304695). BACKSIDE GATE CONTACT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321629). USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321637). SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347463). Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347598). SELECTIVE LINER ON BACKSIDE VIA AND METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347625). SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379408). SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379422). FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379775). PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379852). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250063824). ELECTROSTATIC DISCHARGE PROTECTION DEVICE
U
- US Patent Application 18360901. Contact Via Formation simplified abstract
- US Patent Application 18446113. Semiconductor Structures And Methods Of Forming The Same simplified abstract
- US Patent Application 18446183. Semiconductor Device with Air Gaps and Method of Fabrication Thereof simplified abstract