Pages that link to "Category:Lin-Yu Huang of Hsinchu (TW)"
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The following pages link to Category:Lin-Yu Huang of Hsinchu (TW):
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- US Patent Application 17825678. METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH simplified abstract (← links)
- US Patent Application 18446326. GATE CONTACT STRUCTURE simplified abstract (← links)
- US Patent Application 17824329. SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (← links)
- US Patent Application 18361262. PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS simplified abstract (← links)
- US Patent Application 17825516. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (← links)
- US Patent Application 18360901. Contact Via Formation simplified abstract (← links)
- US Patent Application 18446183. Semiconductor Device with Air Gaps and Method of Fabrication Thereof simplified abstract (← links)
- US Patent Application 18446113. Semiconductor Structures And Methods Of Forming The Same simplified abstract (← links)
- 18186754. PROTECTION LAYER FOR SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17839127. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17836399. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17847863. METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 17849725. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 17849734. METHOD FOR FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 17892864. SEMICONDUCTOR DEVICE WITH REVERSE-CUT SOURCE/DRAIN CONTACT STRUCTURE AND METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 18047412. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)
- 18158036. AIR SPACER AND CAPPING STRUCTURES IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17815854. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 17885577. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)
- 17887487. SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)
- 18511102. ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- Taiwan semiconductor manufacturing co., ltd. (20240096997). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (← links)
- 18097249. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240178069). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240178132). VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract (← links)
- 18410016. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 18434077. VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- Taiwan semiconductor manufacturing co., ltd. (20240186179). Methods of Forming Spacers for Semiconductor Devices Including Backside Power Rails simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240204045). SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHOD THEREOF simplified abstract (← links)
- Taiwan semiconductor manufacturing co., ltd. (20240222507). SEMICONDUCTOR DEVICE WITH BACKSIDE POWER RAIL AND METHODS OF FABRICATION THEREOF simplified abstract (← links)
- 18610318. SEMICONDUCTOR DEVICE WITH BACKSIDE POWER RAIL AND METHODS OF FABRICATION THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- Taiwan semiconductor manufacturing co., ltd. (20240250017). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (← links)
- Taiwan semiconductor manufacturing co., ltd. (20240250151). AIR SPACERS FOR SEMICONDUCTOR DEVICES simplified abstract (← links)
- 18604557. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- 18628112. AIR SPACERS FOR SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240258158). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240290852). Source/Drain Contacts and Methods of Forming Same simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240304695). BACKSIDE GATE CONTACT simplified abstract (← links)
- 18670132. BACKSIDE GATE CONTACT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240321629). USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240321637). SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract (← links)
- 18679546. USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- 18652803. SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240347463). Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240347598). SELECTIVE LINER ON BACKSIDE VIA AND METHOD THEREOF simplified abstract (← links)
- Taiwan semiconductor manufacturing company, ltd. (20240347625). SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP simplified abstract (← links)
- 18753744. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)
- 18750589. SELECTIVE LINER ON BACKSIDE VIA AND METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)
- 18752172. SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (← links)