Samsung electronics co., ltd. (20250087646). SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
Organization Name
Inventor(s)
Hyunsoo Chung of Suwon-si (KR)
Kwang-Soo Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
This abstract first appeared for US patent application 20250087646 titled 'SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
Original Abstract Submitted
a semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a first mold layer at least partially covering the first redistribution substrate and the first semiconductor chip, a plurality of first conductive pillars at least partially penetrating the first mold layer and contacting the first redistribution substrate, a second redistribution substrate on the first mold layer, a second semiconductor chip on the second redistribution substrate, a second mold layer at least partially covering the second redistribution substrate and the second semiconductor chip, a plurality of second conductive pillars at least partially penetrating the second mold layer and contacting the second redistribution substrate, and a third redistribution substrate on the second mold layer. the first semiconductor chip includes a first through via. the second semiconductor chip includes a backside power delivery network layer.
