Apple inc. (20250014960). MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

Organization Name

apple inc.

Inventor(s)

Jiongxin Lu of San Jose CA (US)

Kunzhong Hu of Cupertino CA (US)

Jun Zhai of Cupertino CA (US)

MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

This abstract first appeared for US patent application 20250014960 titled 'MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES

Original Abstract Submitted

various embodiments of an integrated circuit (ic) die package are disclosed. an ic die package includes an ic die, an interposer structure electrically connected to the ic die, a first bonding structure, a second bonding structure, and a molding compound layer. the first bonding structure includes a first dielectric layer disposed on the ic die and a first conductive plug disposed in the first dielectric layer. the second bonding structure includes a second dielectric layer disposed on the interposer structure and a second conductive plug disposed in the second dielectric layer. the molding compound layer includes a mold region and a mold cavity.