Tesla, inc. (20250006602). SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

Organization Name

tesla, inc.

Inventor(s)

William Thomas Chi of Fremont CA (US)

Utkarsh Raheja of Sunnyvale CA (US)

Sesha Sai Srikant Sarma Gandikota of San Jose CA (US)

Steven Thomas Embleton of Austin TX (US)

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

This abstract first appeared for US patent application 20250006602 titled 'SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

Original Abstract Submitted

the present disclosure relates to a semiconductor package. the semiconductor package includes a semiconductor die, molding material, and a conductive structure. the conductive structure is at least partly stacked with the semiconductor die, and the conductive structure includes a plurality of slots positioned around a point of the semiconductor die. the plurality of slots is configured to equalize thermal stresses during the operation of the semiconductor die about the point of the semiconductor die, where the thermal stresses are associated with coefficient of thermal expansion mismatches between the conductive structure and the molding material. in addition, at least a portion of the molding material is in contact with the conductive structure.