Category:H01L25/18
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Contents
H01L 25/18 - Overview
H01L 25/18 is a subsection of the International Patent Classification system, specifically within the category of H01L, which pertains to semiconductor devices; electric solid state devices not otherwise provided for. This particular code focuses on:
- Semiconductor Devices
- Aspects related to semiconductor devices which are structurally and functionally integrated.
- Electric Solid State Devices
- This involves devices that leverage the electrical properties of solid materials to control the flow of current.
- Multi-chip Modules (MCM)
- H01L 25/18 specifically addresses multi-chip modules (MCM). These are electronic components where multiple integrated circuits (ICs), semiconductor dies, or other discrete components are packaged onto a unifying substrate, enhancing performance and reducing size.
Key Innovations and Companies in H01L 25/18
Several companies have made significant contributions in the field covered by H01L 25/18:
- Intel Corporation
- Intel has been a leader in developing advanced multi-chip modules, integrating various functions like CPU, GPU, and memory in compact forms. Their innovations often involve high-speed interconnects and efficient heat dissipation technologies.
- Samsung Electronics
- Samsung's advancements in multi-chip module technology are notable, particularly in the integration of memory and logic components, which is crucial for mobile devices and high-performance computing systems.
- Lesser-Known Innovators
- Smaller companies like XYZ Semiconductors (fictional example) also contribute significantly to this field, often focusing on specialized applications or novel integration techniques.
IPC Classifications and Categories
The innovations in H01L 25/18 fall into several categories under the IPC system. These include:
- H01L29 - Semiconductor devices based on specific semiconductors
- H01L31 - Solid state devices using organic materials
See Also
Pages in category "H01L25/18"
The following 19 pages are in this category, out of 324 total.
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- 17458573. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17671969. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17703700. METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17743819. 3D LAMINATED CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE 3D LAMINATED CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17819231. SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17821646. WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES simplified abstract (Micron Technology, Inc.)
- 17823157. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17823162. SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD simplified abstract (Micron Technology, Inc.)
- 17823634. SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17825076. NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17826521. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17836711. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17843967. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)
- 17849300. SEMICONDUCTOR PACKAGING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)