17823162. SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD simplified abstract (Micron Technology, Inc.)

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

Organization Name

Micron Technology, Inc.

Inventor(s)

Hidenori Yamaguchi of Higashihiroshima (JP)

Keizo Kawakita of Higashi Hiroshima City (JP)

Bang-Ning Hsu of Tainan (TW)

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17823162 titled 'SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

Simplified Explanation

• • Simplified Explanation:**

The patent application describes stacked die devices and systems with interconnect pillars of varying heights, mapped to a known warpage profile.

• • Explanation:**
• Stacked die devices have an array of interconnect pillars with different heights.
• The pillar height distribution is correlated to a known warpage profile.
• This design allows for better alignment and connection between stacked die devices.
• The interconnect pillars provide structural support and electrical connections within the stacked die devices.

• • Potential Applications:**
• Semiconductor industry for integrated circuits
• Electronics manufacturing for compact devices
• Automotive industry for advanced sensors and processors

• • Problems Solved:**
• Improved alignment and connection in stacked die devices
• Enhanced structural support for stacked configurations
• Minimization of warpage issues in stacked die systems

• • Benefits:**
• Increased reliability and performance of stacked die devices
• Enhanced efficiency in manufacturing processes
• Potential for smaller and more compact electronic devices

Original Abstract Submitted

Apparatus and methods are disclosed, including stacked die devices and systems. Example stacked die devices and methods include an array of interconnect pillars that includes more than one pillar height. Example stacked die devices and methods include an array of interconnect pillars that includes a pillar height distribution mapped to a known warpage profile.