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Create the page "H01L23/60" on this wiki! See also the search results found.

  • SK hynix Inc. patent applications on May 30th, 2024
    IPC Code(s): H01L23/00 ...plurality of second upper electrode bonding pads, respectively.[[Category:H01L23/00]][[Category:sk hynix inc.]]
    39 KB (6,167 words) - 08:20, 31 May 2024
  • Patent Applications Report for 31st Mar 2023
    ...f [[:Category:G06F1/16|G06F1/16]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H04W72/04|H04W72/04]] (9 applications), ...[[:Category:H01L29/66|H01L29/66]] (16 applications), [[:Category:H01L23/00|H01L23/00]] (14 applications), [[:Category:H01L29/786|H01L29/786]] (14 application
    36 KB (4,396 words) - 17:07, 2 January 2024
  • Patent Applications Report for 19th Apr 2024
    ...[[:Category:H10B80/00|H10B80/00]] (18 applications), [[:Category:H01L23/00|H01L23/00]] (17 applications), [[:Category:H10B43/27|H10B43/27]] (15 applications) ...:Category:G06N3/08|G06N3/08]] (6 applications), [[:Category:G06T1/60|G06T1/60]] (6 applications)
    48 KB (5,918 words) - 04:18, 26 April 2024
  • Patent Applications Report for 10th Nov 2023
    ...[[:Category:H01L23/00|H01L23/00]] (5 applications), [[:Category:H01L23/535|H01L23/535]] (4 applications), [[:Category:H01L21/768|H01L21/768]] (4 applications ...gory:H02J50/12|H02J50/12]] (44 applications), [[:Category:H02J50/60|H02J50/60]] (44 applications), [[:Category:H02J50/90|H02J50/90]] (38 applications), [
    28 KB (3,504 words) - 04:04, 4 December 2023
  • Patent Applications Report for 5th May 2023
    ...[[:Category:H01L25/18|H01L25/18]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:G06F3/06|G06F3/06]] (9 applications), [[ ...[[:Category:H01L25/18|H01L25/18]] (9 applications), [[:Category:H01L23/31|H01L23/31]] (8 applications), [[:Category:H01L24/16|H01L24/16]] (8 applications)
    38 KB (4,550 words) - 01:48, 3 January 2024
  • KABUSHIKI KAISHA TOSHIBA patent applications on March 14th, 2024
    .../872]] (4), [[:Category:H01L23/492|H01L23/492]] (4), [[:Category:H01L23/13|H01L23/13]] (4), [[:Category:H01L29/78|H01L29/78]] (4), [[:Category:H01L29/66068|H IPC Code(s): G01S13/56, G01S7/41, G01S13/60, G01S13/87, G01S13/90
    50 KB (7,547 words) - 03:05, 19 March 2024
  • Patent Applications Report for 2nd Nov 2023
    ...ategory:G06V20/52|G06V20/52]] (7 applications), [[:Category:G06T7/60|G06T7/60]] (6 applications), [[:Category:G06T7/00|G06T7/00]] (6 applications), [[:Ca [[:Category:H01L23/00|H01L23/00]]: 84
    24 KB (3,027 words) - 02:35, 4 December 2023
  • Micron Technology, Inc. patent applications on April 18th, 2024
    IPC Code(s): H01L23/48, H01L21/306, H01L21/324, H01L21/48, H01L23/00 ...tegory:H01L21/306]][[Category:H01L21/324]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:micron technology, inc.]]
    42 KB (6,492 words) - 04:18, 26 April 2024
  • Patent Applications Report for 5th Apr 2024
    ...Category:H01L27/088|H01L27/088]] (19 applications), [[:Category:H01L23/498|H01L23/498]] (18 applications), [[:Category:H01L21/48|H01L21/48]] (15 applications ...[[:Category:H04W72/23|H04W72/23]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:H04L5/00|H04L5/00]] (7 applications), [[
    48 KB (5,854 words) - 07:18, 12 April 2024
  • Patent Applications Report for 28th Apr 2023
    ...:Category:H01L51/00|H01L51/00]] (9 applications), [[:Category:H01L23/49838|H01L23/49838]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (9 applications ...[[:Category:H01L29/78|H01L29/78]] (5 applications), [[:Category:H01L23/00|H01L23/00]] (4 applications)
    35 KB (4,354 words) - 01:42, 3 January 2024
  • Patent Applications Report for 5th Jan 2024
    ...[:Category:H01L23/00|H01L23/00]] (11 applications), [[:Category:H01L23/498|H01L23/498]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 applicatio Intel Corporation has filed patents in the areas of [[:Category:H01L23/498|H01L23/498]] (21 applications), [[:Category:H01L21/48|H01L21/48]] (18 applications
    38 KB (4,598 words) - 11:03, 5 January 2024
  • Patent Applications Report for 9th Feb 2024
    ...[:Category:H10B80/00|H10B80/00]] (12 applications), [[:Category:H01L23/498|H01L23/498]] (12 applications), [[:Category:H04W72/232|H04W72/232]] (12 applicatio ...[[:Category:H01L29/66|H01L29/66]] (19 applications), [[:Category:H01L23/00|H01L23/00]] (15 applications), [[:Category:H01L29/06|H01L29/06]] (14 applications)
    46 KB (5,558 words) - 04:10, 9 February 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
    ...423]] (16), [[:Category:H01L29/78|H01L29/78]] (13), [[:Category:H01L23/522|H01L23/522]] (12), [[:Category:H01L29/06|H01L29/06]] (12) ...[[:Category:CPC_H01L23/5226|H01L23/5226]] (2), [[:Category:CPC_H01L23/481|H01L23/481]] (2)
    88 KB (12,873 words) - 04:27, 14 June 2024
  • SAMSUNG DISPLAY CO., LTD. patent applications on June 13th, 2024
    ...eas of [[:Category:H10K59/12|H10K59/12]] (9), [[:Category:H10K85/60|H10K85/60]] (9), [[:Category:H10K59/80|H10K59/80]] (8), [[:Category:H10K59/122|H10K59 IPC Code(s): C07F5/02, H10K50/11, H10K50/15, H10K50/16, H10K85/60
    85 KB (13,416 words) - 04:33, 14 June 2024
  • Intel Corporation patent applications on May 30th, 2024
    ...8]] (7), [[:Category:H04W72/0446|H04W72/0446]] (6), [[:Category:H01L23/538|H01L23/538]] (5) IPC Code(s): G01R31/28, H01L23/467
    61 KB (9,294 words) - 07:57, 31 May 2024
  • Patent Applications Report for 7th Apr 2023
    ...[[:Category:H01L51/00|H01L51/00]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (7 applications), [[:Category:H04W76/15|H04W76/15]] (6 applications), ...[:Category:H01L21/768|H01L21/768]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (7 applications)
    35 KB (4,315 words) - 17:46, 2 January 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
    .../31]] (10), [[:Category:H01L21/78|H01L21/78]] (10), [[:Category:H01L23/522|H01L23/522]] (9) IPC Code(s): G01R31/28, H01L23/522, G01R1/04
    94 KB (13,938 words) - 04:25, 2 February 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
    IPC Code(s): H01L21/56, H01L21/306, H01L21/768, H01L21/78, H01L23/522, H01L23/538 ...tegory:H01L21/768]][[Category:H01L21/78]][[Category:H01L23/522]][[Category:H01L23/538]][[Category:taiwan semiconductor manufacturing company, ltd.]]
    93 KB (13,424 words) - 08:20, 11 April 2024
  • Patent Applications Report for 12th Apr 2024
    ...[[:Category:H04W24/10|H04W24/10]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications) ...egory:B60L15/20|B60L15/20]] (5 applications), [[:Category:B60L50/60|B60L50/60]] (4 applications), [[:Category:B60L58/12|B60L58/12]] (4 applications), [[:
    48 KB (5,904 words) - 09:33, 12 April 2024
  • SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
    IPC Code(s): G02B9/60, G02B3/04, G02B7/38, G02B13/18 CPC Code(s): G02B9/60
    47 KB (7,324 words) - 02:48, 28 June 2024

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