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  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
    ...acturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 46 patent applications[[Category:Taiwan Semiconductor Manufacturing Company, L .../02]] (9), [[:Category:H01L21/768|H01L21/768]] (9), [[:Category:H01L23/522|H01L23/522]] (7)
    65 KB (9,346 words) - 04:20, 26 April 2024
  • Patent Applications Report for 6th Jan 2023
    ...egory:H01L27/11565|H01L27/11565]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications) ...[:Category:H01L27/108|H01L27/108]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:G11C29/42|G11C29/42]] (8 applications)
    38 KB (4,652 words) - 00:59, 2 January 2024
  • IMEC VZW Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/5286|H01L23/5286]] ({Geometry or} layout of the interconnection structure {() * [[:Category:CPC_H01L23/5222|H01L23/5222]] ({Capacitive arrangements or effects of, or between wiring layers (
    15 KB (2,042 words) - 07:57, 19 July 2024
  • Patent Applications Report for 24th Mar 2023
    ...[[:Category:H04W72/12|H04W72/12]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (6 applications) ...Category:H01L23/498|H01L23/498]] (14 applications), [[:Category:H01L23/538|H01L23/538]] (12 applications), [[:Category:G02B6/42|G02B6/42]] (11 applications)
    37 KB (4,520 words) - 11:04, 2 January 2024
  • Patent Applications Report for 5th Jan 2024
    ...[:Category:H01L23/00|H01L23/00]] (11 applications), [[:Category:H01L23/498|H01L23/498]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 applicatio Intel Corporation has filed patents in the areas of [[:Category:H01L23/498|H01L23/498]] (21 applications), [[:Category:H01L21/48|H01L21/48]] (18 applications
    38 KB (4,598 words) - 11:03, 5 January 2024
  • Patent Applications Report for 31st Mar 2023
    ...f [[:Category:G06F1/16|G06F1/16]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H04W72/04|H04W72/04]] (9 applications), ...[[:Category:H01L29/66|H01L29/66]] (16 applications), [[:Category:H01L23/00|H01L23/00]] (14 applications), [[:Category:H01L29/786|H01L29/786]] (14 application
    36 KB (4,396 words) - 17:07, 2 January 2024
  • Patent Applications Report for 17th Mar 2023
    ...IKI KAISHA TOSHIBA has filed patents in the areas of [[:Category:H01L23/00|H01L23/00]] (7 applications), [[:Category:H01L29/78|H01L29/78]] (6 applications), ...nagement Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 46 patent applications[[Category:Panasonic Intellectual Property Management Co
    37 KB (4,476 words) - 06:16, 2 January 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
    ...(2), [[:Category:CPC_C12M41/38|C12M41/38]] (1), [[:Category:CPC_H01L23/562|H01L23/562]] (1), [[:Category:CPC_H01L24/05|H01L24/05]] (1) IPC Code(s): F24F11/46, G05B13/02
    58 KB (8,547 words) - 03:19, 19 July 2024
  • Honor Device Co., Ltd. patent applications on July 25th, 2024
    IPC Code(s): H01L23/498, C25D5/48, C25D7/12, H01L21/48, H01L23/00 CPC Code(s): H01L23/49894
    24 KB (3,895 words) - 08:03, 25 July 2024
  • Intel Corporation patent applications on September 12th, 2024
    ...327]] (2), [[:Category:H01L21/768|H01L21/768]] (2), [[:Category:H01L23/498|H01L23/498]] (2) [[:Category:CPC_G03H1/02|G03H1/02]] (1), [[:Category:CPC_H01L23/49838|H01L23/49838]] (1), [[:Category:CPC_H04W12/06|H04W12/06]] (1), [[:Category:CPC_H04
    33 KB (4,872 words) - 06:31, 12 September 2024
  • Mitsubishi Electric Corporation patent applications on August 8th, 2024
    ...Corporation has applied for patents in the areas of [[:Category:H01L23/00|H01L23/00]] (3), [[:Category:H04Q11/00|H04Q11/00]] (2), [[:Category:A61L9/12|A61L9 IPC Code(s): B03C3/68, A61L9/22, B01D46/00, B01D46/42, B01D46/44, B01D46/46, B03C3/011, B03C3/04, B03C3/155, B03C3/36, B03C3/38, B03C3/41
    33 KB (4,905 words) - 06:45, 11 August 2024
  • Patent Applications Report for 26th May 2023
    ...egory:H01L27/11582|H01L27/11582]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H01L27/11556|H01L27/11556]] (10 applica ...naktiebolaget LM Ericsson (publ)|Telefonaktiebolaget LM Ericsson (publ)]]: 46 patent applications[[Category:Telefonaktiebolaget LM Ericsson (publ)]]
    36 KB (4,410 words) - 03:45, 4 January 2024
  • Patent Applications Report for 15th Mar 2024
    ...[[:Category:H10B43/27|H10B43/27]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (12 applications), [[:Category:H01L24/16|H01L24/16]] (11 applications) ...Category:H01L27/092|H01L27/092]] (23 applications), [[:Category:H01L23/522|H01L23/522]] (23 applications)
    47 KB (5,694 words) - 03:06, 19 March 2024
  • Patent Applications Report for 29th Dec 2023
    ...[[:Category:H10B80/00|H10B80/00]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H10B43/27|H10B43/27]] (10 applications) ...[:Category:H01L23/00|H01L23/00]] (17 applications), [[:Category:H01L23/498|H01L23/498]] (17 applications), [[:Category:H01L29/06|H01L29/06]] (16 applications
    37 KB (4,537 words) - 05:46, 2 January 2024
  • Murata Manufacturing Co., Ltd. patent applications on August 8th, 2024
    IPC Code(s): H01L23/31, H01L21/56, H01L23/00, H01L23/544, H01L23/552, H01L25/065, H01L25/16, H03H3/02, H03H3/08, H03H9/02, H03H9/05, H03H9/0 CPC Code(s): H01L23/3185
    32 KB (4,812 words) - 06:49, 11 August 2024
  • Patent Applications Report for 31st May 2024
    ...8]] (7), [[:Category:H04W72/0446|H04W72/0446]] (6), [[:Category:H01L23/538|H01L23/538]] (5) ...the areas of [[:Category:H04W72/23|H04W72/23]] (14), [[:Category:H01L23/00|H01L23/00]] (13), [[:Category:H10B80/00|H10B80/00]] (13), [[:Category:H10B43/27|H1
    55 KB (6,817 words) - 03:50, 10 June 2024
  • Patent Applications Report for 1st Mar 2024
    ...[:Category:H01L24/16|H01L24/16]] (17 applications), [[:Category:H01L23/498|H01L23/498]] (17 applications), [[:Category:H10B43/27|H10B43/27]] (15 applications ...:Category:G06F3/0679|G06F3/0679]] (38 applications), [[:Category:H01L23/00|H01L23/00]] (28 applications), [[:Category:H01L27/11582|H01L27/11582]] (27 applica
    45 KB (5,535 words) - 03:18, 4 March 2024
  • Mitsubishi Electric Corporation patent applications on September 19th, 2024
    IPC Code(s): H01L23/495, H01L23/00, H01L23/053 CPC Code(s): H01L23/49544
    31 KB (4,621 words) - 09:20, 19 September 2024
  • Patent Applications Report for 3rd Mar 2023
    ...:Category:H01L21/768|H01L21/768]] (56 applications), [[:Category:H01L23/00|H01L23/00]] (54 applications), [[:Category:H01L29/423|H01L29/423]] (47 application ...ry:H01L27/11582|H01L27/11582]] (12 applications), [[:Category:H01L23/49816|H01L23/49816]] (12 applications)
    38 KB (4,639 words) - 04:49, 2 January 2024
  • TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
    ...2M1/00]] (5), [[:Category:H01L27/01|H01L27/01]] (5), [[:Category:H01L23/66|H01L23/66]] (4) IPC Code(s): H01L21/768, H01L23/522, H01L23/528
    55 KB (8,096 words) - 08:52, 11 April 2024

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