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- =BUILD-SIDE SKEW HANDLING FOR HASH-PARTITIONING HASH JOINS= ==BUILD-SIDE SKEW HANDLING FOR HASH-PARTITIONING HASH JOINS - A simplified explanation o4 KB (494 words) - 00:11, 11 June 2024
- ...ody with a workpiece side that engages with the workpiece and a power tool side that engages with the power tool. - The power tool side of the guide has at least one elongate rail that is mounted on it. This rai3 KB (437 words) - 05:29, 5 December 2023
- =SEMICONDUCTOR DEVICE HAVING A LOW-K GATE SIDE INSULATING LAYER= ==SEMICONDUCTOR DEVICE HAVING A LOW-K GATE SIDE INSULATING LAYER - A simplified explanation of the abstract==3 KB (459 words) - 08:14, 24 May 2024
- ...e on one side, while the third and fourth extension parts are on the other side. ...f each other at a second side, the first side being opposite to the second side. The first AF cell is arranged at the first extension part, the second AF c2 KB (366 words) - 05:42, 4 December 2023
- ...and a sensor mounted on the cover. When the cover is attached to the first side wall, the sensor is partially received within the hollow space. * The work implement includes a collection member, first and second side walls, and a plate member.4 KB (580 words) - 10:37, 11 January 2024
- ...rst opening with a side wall that overlaps the light-shielding layer and a side wall that does not overlap the light-shielding layer. ...ng layer and is not arranged in at least part of an area that overlaps the side wall not overlapping the light-shielding layer.3 KB (394 words) - 07:05, 4 December 2023
- ...iconductor die, both with a body and a front-side pad structure. The front-side pad structure includes a seed layer and a pad pattern with three portions f * Each stack unit has a lower and upper semiconductor die with a front-side pad structure.4 KB (624 words) - 00:16, 11 June 2024
- 17838491. Semiconductor Wafer Dicing Method simplified abstract (Western Digital Technologies, Inc.)...applying tape lamination to the front side of the wafer, grinding the back side of the wafer, mounting it to a die attach film (DAF) layer, removing the ta * Tape lamination is applied to the front side of the wafer where integrated circuits are exposed4 KB (535 words) - 18:34, 1 January 2024
- ...he middle plate, and a second flange extending outwardly from the opposite side of the middle plate. ...e to the outer face of the middle plate. The fourth side opposes the third side along a second direction that intersects the first direction. The flow guid3 KB (469 words) - 10:26, 4 December 2023
- ...long body with one side designed to engage with a workpiece and the other side designed to engage with a power tool. * The power tool side of the guide has at least one elongate rail that fits into a reciprocal cha2 KB (384 words) - 05:29, 5 December 2023
- * The stand includes a neck that is attached to the rear side of the head. * The neck extends below the lower side of the head.2 KB (360 words) - 05:33, 4 December 2023
- [[20240134851.BUILD-SIDE SKEW HANDLING FOR HASH-PARTITIONING HASH JOINS_simplified_abstract_(snowfla ...row set is selected from the plurality of row sets. the partitioned build-side row set is distributed to a plurality of hash-join-build (hjb) instances ex5 KB (691 words) - 00:11, 11 June 2024
- ...odule is driven by a separate spin-drive unit located on the corresponding side of the body. The spin-drive units have rotational axes that are different f * The cleaner has a body with two spin-mop modules, one on each side.3 KB (517 words) - 01:28, 4 January 2024
- ...k portion. The distance between the base of the lugs and the ground-facing side varies depending on the load supported by the wheel. * The track system has a ground-facing side and a wheel-facing side.4 KB (561 words) - 03:11, 9 February 2024
- =SEMICONDUCTOR DEVICE HAVING A LOW-K GATE SIDE INSULATING LAYER= ==SEMICONDUCTOR DEVICE HAVING A LOW-K GATE SIDE INSULATING LAYER - A simplified explanation of the abstract==4 KB (511 words) - 02:04, 24 May 2024
- ...wer tool guide has an elongate body with a workpiece side and a power tool side. ...orkpiece side is designed to engage with a workpiece, while the power tool side is designed to engage with a power tool.3 KB (490 words) - 05:29, 5 December 2023
- ...in module package with a substrate and an electronic device mounted on one side. ...r more electronic devices mounted on one side and a cavity on the opposite side.3 KB (441 words) - 05:07, 4 March 2024
- ...ward and outward from above the outlet of the inlet stack to the outermost side wall of the lid assembly. * A float is positioned next to the curved side wall of the recovery tank.4 KB (560 words) - 10:40, 25 January 2024
- ...power tool guide has at least one elongate rail mounted on the power tool side. ...gage a power tool. At least one elongate rail is mounted on the power tool side. The at least one elongate rail is configured to engage a reciprocal channe2 KB (306 words) - 05:29, 5 December 2023
- * The mounting part is located on one side of the chamber and is used to mount the substrate at an inclined angle. * The magnet module is located on the opposite side of the substrate and helps with the assembly process.2 KB (319 words) - 14:59, 11 November 2023