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  • Patent Applications Report for 12th Apr 2024
    ...areas of [[:Category:H02S40/34|H02S40/34]] (2), [[:Category:E04D1/30|E04D1/30]] (2), [[:Category:H02S20/25|H02S20/25]] (2), [[:Category:H02S40/36|H02S40/ ...CTRONICS CO., LTD. has filed patents in the areas of [[:Category:H10B43/27|H10B43/27]] (12 applications), [[:Category:H01L29/775|H01L29/775]] (12 application
    48 KB (5,904 words) - 09:33, 12 April 2024
  • Patent Applications Report for 24th Nov 2023
    ...[[:Category:H01L29/06|H01L29/06]] (7 applications), [[:Category:H10B43/27|H10B43/27]] (6 applications), [[:Category:H01L29/0673|H01L29/0673]] (6 application ...egory:H04W72/21|H04W72/21]] (4 applications), [[:Category:H04W76/30|H04W76/30]] (4 applications)
    36 KB (4,390 words) - 15:28, 6 December 2023
  • Patent Applications Report for 29th Dec 2023
    ...[[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H10B43/27|H10B43/27]] (10 applications), [[:Category:H04L5/00|H04L5/00]] (9 applications), [ ...ategory:H04L9/40|H04L9/40]] (6 applications), [[:Category:G06F40/30|G06F40/30]] (6 applications), [[:Category:G06F40/274|G06F40/274]] (4 applications)
    37 KB (4,537 words) - 05:46, 2 January 2024
  • Micron Technology, Inc. patent applications on June 20th, 2024
    ...L21/28, H01L29/423, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35 ...Category:H10B41/35]][[Category:H10B43/10]][[Category:H10B43/27]][[Category:H10B43/35]][[Category:CPC_G11C16/0483]][[Category:micron technology, inc.]]
    63 KB (9,877 words) - 16:53, 21 June 2024
  • Patent Applications Report for 15th Mar 2024
    ...[[:Category:H10B80/00|H10B80/00]] (13 applications), [[:Category:H10B43/27|H10B43/27]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (12 applications) ...egory:B60K35/00|B60K35/00]] (8 applications), [[:Category:G06Q50/30|G06Q50/30]] (6 applications), [[:Category:B60W30/09|B60W30/09]] (6 applications), [[:
    47 KB (5,694 words) - 03:06, 19 March 2024
  • Patent Applications Report for 19th Apr 2024
    ...[[:Category:H01L23/00|H01L23/00]] (17 applications), [[:Category:H10B43/27|H10B43/27]] (15 applications), [[:Category:H01L29/775|H01L29/775]] (14 application ...[[:Category:H10B41/27|H10B41/27]] (5 applications), [[:Category:H10B43/27|H10B43/27]] (4 applications), [[:Category:H01L33/62|H01L33/62]] (4 applications)
    48 KB (5,918 words) - 04:18, 26 April 2024
  • Micron Technology, Inc. patent applications on February 15th, 2024
    IPC Code(s): G06F1/30, G06F11/14 ...m one or more heroic data recovery processes on the block.[[Category:G06F1/30]][[Category:G06F11/14]][[Category:micron technology, inc.]]
    62 KB (9,556 words) - 04:36, 20 February 2024
  • Patent Applications Report for 12th Jan 2024
    ...] (2), [[:Category:H01F41/02|H01F41/02]] (2), [[:Category:H01F27/30|H01F27/30]] (1), [[:Category:H05K3/32|H05K3/32]] (1), [[:Category:H05K2203/101|H05K22 ...[[:Category:H01L24/16|H01L24/16]] (12 applications), [[:Category:H10B43/27|H10B43/27]] (10 applications), [[:Category:H01L23/498|H01L23/498]] (10 application
    40 KB (4,923 words) - 05:48, 12 January 2024
  • Micron Technology, Inc. patent applications on February 8th, 2024
    IPC Code(s): G06F9/30, G06F9/448, G06F15/78, G06F9/38 ...or stored in the memory for a current or next computation.[[Category:G06F9/30]][[Category:G06F9/448]][[Category:G06F15/78]][[Category:G06F9/38]][[Categor
    54 KB (8,372 words) - 04:09, 9 February 2024
  • Patent Applications Report for 17th May 2024
    ...[:Category:H01L23/528|H01L23/528]] (5 applications), [[:Category:H10B43/27|H10B43/27]] (5 applications) ...ategory:A61N2/02|A61N2/02]] (2 applications), [[:Category:C07K16/30|C07K16/30]] (2 applications)
    47 KB (5,826 words) - 06:52, 24 May 2024
  • Patent Applications Report for 14th Jun 2024
    ...(2), [[:Category:CPC_H10B51/20|H10B51/20]] (2), [[:Category:CPC_H10B43/27|H10B43/27]] (2) ...(1), [[:Category:G06F40/295|G06F40/295]] (1), [[:Category:G06F40/30|G06F40/30]] (1)
    60 KB (7,670 words) - 05:19, 14 June 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
    ...the areas of [[:Category:H01L23/00|H01L23/00]] (14), [[:Category:H10B43/27|H10B43/27]] (13), [[:Category:H01L29/775|H01L29/775]] (12), [[:Category:H01L24/16| IPC Code(s): A47L15/30, A47L15/42
    222 KB (34,040 words) - 07:20, 10 April 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
    ...the areas of [[:Category:H10B80/00|H10B80/00]] (13), [[:Category:H10B43/27|H10B43/27]] (12), [[:Category:H01L23/00|H01L23/00]] (12), [[:Category:H01L24/16|H0 IPC Code(s): D06F37/30, D06F21/06, F16H1/28, F16H57/00
    224 KB (34,908 words) - 03:03, 19 March 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
    IPC Code(s): G06N3/063, H10B41/30 ...region of the semiconductor device.[[Category:G06N3/063]][[Category:H10B41/30]][[Category:taiwan semiconductor manufacturing company, ltd.]]
    235 KB (34,158 words) - 03:03, 19 March 2024
  • Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
    ...0/00]] (18), [[:Category:H01L23/00|H01L23/00]] (17), [[:Category:H10B43/27|H10B43/27]] (15), [[:Category:H01L29/775|H01L29/775]] (14), [[:Category:H01L25/065 IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
    275 KB (42,441 words) - 17:01, 20 April 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
    IPC Code(s): G11C11/22, H10B51/30 ...ored data value of the memory cell.[[Category:G11C11/22]][[Category:H10B51/30]][[Category:taiwan semiconductor manufacturing co., ltd.]]
    173 KB (25,550 words) - 07:41, 22 March 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
    ...CS CO., LTD. has applied for patents in the areas of [[:Category:H10B43/27|H10B43/27]] (12), [[:Category:H01L29/775|H01L29/775]] (12), [[:Category:H01L29/423 IPC Code(s): C07F15/00, C09K11/06, H10K50/12, H10K85/30
    223 KB (34,353 words) - 07:34, 12 April 2024
  • Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
    ...0/00]] (13), [[:Category:H10B43/27|H10B43/27]] (12), [[:Category:H10B43/35|H10B43/35]] (8) ..., C09K11/02, C09K11/08, C09K11/62, C09K11/88, H01L33/06, H01L33/28, H01L33/30, H01L33/34, H10K50/115
    227 KB (34,901 words) - 06:32, 31 May 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
    IPC Code(s): A47L9/28, A47L5/30, A47L9/04, A46B13/00, A46B13/02 ...on a predetermined update condition.[[Category:A47L9/28]][[Category:A47L5/30]][[Category:A47L9/04]][[Category:A46B13/00]][[Category:A46B13/02]][[Categor
    244 KB (37,693 words) - 04:25, 2 February 2024
  • Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
    IPC Code(s): F24C15/20, G06T7/30, G06V10/20 ...the determined optimal venting size.[[Category:F24C15/20]][[Category:G06T7/30]][[Category:G06V10/20]][[Category:samsung electronics co., ltd.]]
    241 KB (37,041 words) - 08:06, 23 May 2024

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