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  • ...C16/34]] (5), [[:Category:H01L23/00|H01L23/00]] (4), [[:Category:H01L33/48|H01L33/48]] (4) ...13/14, F21V29/507, F21V29/74, F21V29/80, F21V29/83, F21Y115/10, H01L33/48, H01L33/60
    59 KB (9,250 words) - 04:24, 10 June 2024
  • IPC Code(s): G06F21/60, H04L67/52, G06F21/62 ...evice has left the secure location.[[Category:G06F21/60]][[Category:H04L67/52]][[Category:G06F21/62]][[Category:micron technology, inc.]]
    57 KB (8,878 words) - 10:13, 30 January 2024
  • ...[[:Category:H01L51/52|H01L51/52]] (14 applications), [[:Category:H01L33/62|H01L33/62]] (14 applications), [[:Category:G09G3/3266|G09G3/3266]] (12 application ...ory:G09G3/3266|G09G3/3266]] (8 applications), [[:Category:H01L51/52|H01L51/52]] (8 applications)
    38 KB (4,652 words) - 00:59, 2 January 2024
  • IPC Code(s): G02B30/52 ...ing light-emitting fibers to form a 3d network structure.[[Category:G02B30/52]][[Category:shenzhen china star optoelectronics semiconductor display techn
    39 KB (5,583 words) - 04:10, 9 February 2024
  • [[:Category:Samsung Display Co., LTD.|Samsung Display Co., LTD.]]: 52 patent applications[[Category:Samsung Display Co., LTD.]] ...06]] (12), [[:Category:G09G3/3233|G09G3/3233]] (12), [[:Category:H01L33/62|H01L33/62]] (10), [[:Category:H10K59/12|H10K59/12]] (8)
    67 KB (10,565 words) - 08:26, 11 April 2024
  • ...gory:H01L51/00|H01L51/00]] (16 applications), [[:Category:H01L51/52|H01L51/52]] (11 applications), [[:Category:G09G3/3233|G09G3/3233]] (11 applications) ...egory:G03G15/00|G03G15/00]] (7 applications), [[:Category:H04N19/52|H04N19/52]] (6 applications), [[:Category:H04N19/513|H04N19/513]] (6 applications), [
    35 KB (4,354 words) - 01:42, 3 January 2024
  • IPC Code(s): C09D5/44, C09D11/033, C09D11/037, G02F1/167, H01L25/075, H01L33/32 ...tegory:C09D11/037]][[Category:G02F1/167]][[Category:H01L25/075]][[Category:H01L33/32]][[Category:samsung display co., ltd.]]
    113 KB (17,933 words) - 07:41, 22 March 2024
  • IPC Code(s): H01L23/14, H01L21/52 ...semiconductor die during assembly.[[Category:H01L23/14]][[Category:H01L21/52]][[Category:micron technology, inc.]]
    54 KB (8,372 words) - 04:09, 9 February 2024
  • ...[[:Category:H01L33/62|H01L33/62]] (16 applications), [[:Category:H01L33/38|H01L33/38]] (13 applications)
    38 KB (4,639 words) - 04:49, 2 January 2024
  • [[:Category:Apple Inc.|Apple Inc.]]: 52 patent applications[[Category:Apple Inc.]] ...:Category:H10K59/122|H10K59/122]] (14 applications), [[:Category:H01L33/62|H01L33/62]] (12 applications), [[:Category:G09G3/32|G09G3/32]] (10 applications)
    38 KB (4,609 words) - 16:39, 1 January 2024
  • IPC Code(s): G09G3/32, H01L25/075, H01L33/62 ...mission detour line.[[Category:G09G3/32]][[Category:H01L25/075]][[Category:H01L33/62]][[Category:samsung display co., ltd.]]
    125 KB (19,820 words) - 07:51, 12 April 2024
  • ...acturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 52 patent applications[[Category:Taiwan Semiconductor Manufacturing Company, L ...ategory:A61B1/00|A61B1/00]] (4 applications), [[:Category:H04N23/52|H04N23/52]] (4 applications)
    37 KB (4,537 words) - 05:46, 2 January 2024
  • ...gory:H01L27/32|H01L27/32]] (28 applications), [[:Category:H01L51/52|H01L51/52]] (15 applications), [[:Category:H01L51/56|H01L51/56]] (14 applications), [ ...ry:G02F1/1368|G02F1/1368]] (10 applications), [[:Category:H01L51/52|H01L51/52]] (10 applications), [[:Category:H01L27/3276|H01L27/3276]] (9 applications)
    39 KB (4,888 words) - 04:21, 2 January 2024
  • ...Category:H01L27/3246|H01L27/3246]] (9 applications), [[:Category:H01L33/62|H01L33/62]] (8 applications) ...egory:G06V10/36|G06V10/36]] (2 applications), [[:Category:C12N15/52|C12N15/52]] (2 applications), [[:Category:C12N9/88|C12N9/88]] (2 applications), [[:Ca
    37 KB (4,509 words) - 00:28, 4 January 2024
  • ...Corporation has filed patents in the areas of [[:Category:G06V20/52|G06V20/52]] (61 applications), [[:Category:G06V40/20|G06V40/20]] (21 applications), [ ...:Category:H10K59/131|H10K59/131]] (18 applications), [[:Category:H01L33/62|H01L33/62]] (8 applications), [[:Category:H10K50/844|H10K50/844]] (7 applications)
    37 KB (4,531 words) - 10:00, 7 December 2023
  • [[:Category:HUAWEI TECHNOLOGIES CO., LTD.|HUAWEI TECHNOLOGIES CO., LTD.]]: 52 patent applications[[Category:HUAWEI TECHNOLOGIES CO., LTD.]] ...[[:Category:H10B43/27|H10B43/27]] (4 applications), [[:Category:H01L33/62|H01L33/62]] (4 applications)
    48 KB (5,918 words) - 04:18, 26 April 2024
  • ...:Category:G09G3/3233|G09G3/3233]] (22 applications), [[:Category:H01L33/62|H01L33/62]] (14 applications), [[:Category:G09G2300/0842|G09G2300/0842]] (10 appli ...CORPORATION has filed patents in the areas of [[:Category:G06V20/52|G06V20/52]] (39 applications), [[:Category:H04N7/18|H04N7/18]] (17 applications), [[:
    38 KB (4,611 words) - 06:09, 1 January 2024
  • ...gory:H01L27/32|H01L27/32]] (28 applications), [[:Category:H01L51/52|H01L51/52]] (18 applications), [[:Category:H01L51/56|H01L51/56]] (16 applications), [ [[:Category:H01L33/58|H01L33/58]] (2 applications), [[:Category:G02B1/00|G02B1/00]] (2 applications), [[
    37 KB (4,544 words) - 06:14, 2 January 2024
  • ...or Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]: 52 patent applications[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.] ...[[:Category:H01L27/12|H01L27/12]] (11 applications), [[:Category:H01L33/62|H01L33/62]] (10 applications), [[:Category:H10K59/80|H10K59/80]] (8 applications),
    45 KB (5,610 words) - 10:14, 30 January 2024
  • IPC Code(s): H01L27/15, H01L33/24, H01L33/40 ...ght emitting device.[[Category:H01L27/15]][[Category:H01L33/24]][[Category:H01L33/40]][[Category:lg electronics inc.]]
    71 KB (11,444 words) - 04:09, 9 February 2024

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