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Create the page "H01L23/60" on this wiki! See also the search results found.

  • FUJITSU LIMITED Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {() * [[:Category:CPC_H01L23/3733|H01L23/3733]] ({having a heterogeneous or anisotropic structure, e.g. powder or fi
    24 KB (3,233 words) - 08:00, 29 July 2024
  • KABUSHIKI KAISHA TOSHIBA patent applications on March 14th, 2024
    .../872]] (4), [[:Category:H01L23/492|H01L23/492]] (4), [[:Category:H01L23/13|H01L23/13]] (4), [[:Category:H01L29/78|H01L29/78]] (4), [[:Category:H01L29/66068|H IPC Code(s): G01S13/56, G01S7/41, G01S13/60, G01S13/87, G01S13/90
    50 KB (7,547 words) - 03:05, 19 March 2024
  • BOE TECHNOLOGY GROUP CO., LTD. patent applications on September 19th, 2024
    ..., [[:Category:CPC_G09G3/3233|G09G3/3233]] (2), [[:Category:CPC_H01L23/5386|H01L23/5386]] (2), [[:Category:CPC_G02F1/136286|G02F1/136286]] (2), [[:Category:CP IPC Code(s): H10K85/60, C07D235/18, C07D263/57, C07D277/66, C07D409/14, C07D413/12, C07D413/14, C0
    23 KB (3,504 words) - 07:28, 19 September 2024
  • SAMSUNG DISPLAY CO., LTD. patent applications on July 25th, 2024
    [[:Category:SAMSUNG DISPLAY CO., LTD.|SAMSUNG DISPLAY CO., LTD.]]: 60 patent applications[[Category:SAMSUNG DISPLAY CO., LTD.]] ...] (9), [[:Category:C09K11/06|C09K11/06]] (9), [[:Category:H10K85/60|H10K85/60]] (9)
    80 KB (12,588 words) - 07:05, 25 July 2024
  • Samsung Display Co., LTD. patent applications on April 18th, 2024
    IPC Code(s): C07F5/02, C07F7/08, C07F13/00, C09K11/06, H10K85/40, H10K85/60 ...y:C07F13/00]][[Category:C09K11/06]][[Category:H10K85/40]][[Category:H10K85/60]][[Category:samsung display co., ltd.]]
    80 KB (12,618 words) - 03:18, 26 April 2024
  • LG INNOTEK CO., LTD. Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/49894|H01L23/49894]] (Leads, {i.e. metallisations or lead-frames} on insulating substrat [[Category:CPC_F21K9/60]]
    22 KB (3,092 words) - 05:54, 21 July 2024
  • Micron Technology, Inc. patent applications on April 18th, 2024
    IPC Code(s): H01L23/48, H01L21/306, H01L21/324, H01L21/48, H01L23/00 ...tegory:H01L21/306]][[Category:H01L21/324]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:micron technology, inc.]]
    42 KB (6,492 words) - 04:18, 26 April 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
    ...423]] (16), [[:Category:H01L29/78|H01L29/78]] (13), [[:Category:H01L23/522|H01L23/522]] (12), [[:Category:H01L29/06|H01L29/06]] (12) ...[[:Category:CPC_H01L23/5226|H01L23/5226]] (2), [[:Category:CPC_H01L23/481|H01L23/481]] (2)
    88 KB (12,873 words) - 04:27, 14 June 2024
  • Patent Applications Report for 5th Apr 2024
    ...Category:H01L27/088|H01L27/088]] (19 applications), [[:Category:H01L23/498|H01L23/498]] (18 applications), [[:Category:H01L21/48|H01L21/48]] (15 applications ...[[:Category:H04W72/23|H04W72/23]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:H04L5/00|H04L5/00]] (7 applications), [[
    48 KB (5,854 words) - 07:18, 12 April 2024
  • Patent Applications Report for 9th Feb 2024
    ...[:Category:H10B80/00|H10B80/00]] (12 applications), [[:Category:H01L23/498|H01L23/498]] (12 applications), [[:Category:H04W72/232|H04W72/232]] (12 applicatio ...[[:Category:H01L29/66|H01L29/66]] (19 applications), [[:Category:H01L23/00|H01L23/00]] (15 applications), [[:Category:H01L29/06|H01L29/06]] (14 applications)
    46 KB (5,558 words) - 04:10, 9 February 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
    .../31]] (10), [[:Category:H01L21/78|H01L21/78]] (10), [[:Category:H01L23/522|H01L23/522]] (9) IPC Code(s): G01R31/28, H01L23/522, G01R1/04
    94 KB (13,938 words) - 04:25, 2 February 2024
  • Lam Research Corporation Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/53295|H01L23/53295]] (No explanation available) [[Category:CPC_C25D3/60]]
    16 KB (2,093 words) - 08:19, 16 July 2024
  • Patent Applications Report for 28th Apr 2023
    ...:Category:H01L51/00|H01L51/00]] (9 applications), [[:Category:H01L23/49838|H01L23/49838]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (9 applications ...[[:Category:H01L29/78|H01L29/78]] (5 applications), [[:Category:H01L23/00|H01L23/00]] (4 applications)
    35 KB (4,354 words) - 01:42, 3 January 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
    IPC Code(s): H01L21/56, H01L21/306, H01L21/768, H01L21/78, H01L23/522, H01L23/538 ...tegory:H01L21/768]][[Category:H01L21/78]][[Category:H01L23/522]][[Category:H01L23/538]][[Category:taiwan semiconductor manufacturing company, ltd.]]
    93 KB (13,424 words) - 08:20, 11 April 2024
  • Patent Applications Report for 2nd Nov 2023
    ...ategory:G06V20/52|G06V20/52]] (7 applications), [[:Category:G06T7/60|G06T7/60]] (6 applications), [[:Category:G06T7/00|G06T7/00]] (6 applications), [[:Ca [[:Category:H01L23/00|H01L23/00]]: 84
    24 KB (3,027 words) - 02:35, 4 December 2023
  • Intel Corporation patent applications on May 30th, 2024
    ...8]] (7), [[:Category:H04W72/0446|H04W72/0446]] (6), [[:Category:H01L23/538|H01L23/538]] (5) IPC Code(s): G01R31/28, H01L23/467
    61 KB (9,294 words) - 07:57, 31 May 2024
  • Patent Applications Report for 5th Jan 2024
    ...[:Category:H01L23/00|H01L23/00]] (11 applications), [[:Category:H01L23/498|H01L23/498]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 applicatio Intel Corporation has filed patents in the areas of [[:Category:H01L23/498|H01L23/498]] (21 applications), [[:Category:H01L21/48|H01L21/48]] (18 applications
    38 KB (4,598 words) - 11:03, 5 January 2024
  • Patent Applications Report for 19th Jul 2024
    .../00]] (4), [[:Category:H01L23/538|H01L23/538]] (3), [[:Category:H01L23/522|H01L23/522]] (3), [[:Category:G06F9/4401|G06F9/4401]] (3) [[:Category:CPC_H01L24/14|H01L24/14]] (2), [[:Category:CPC_G03F1/60|G03F1/60]] (1), [[:Category:CPC_H01Q9/0414|H01Q9/0414]] (1), [[:Category:CPC_G09G5/0
    84 KB (10,559 words) - 09:01, 19 July 2024
  • Patent Applications Report for 7th Apr 2023
    ...[[:Category:H01L51/00|H01L51/00]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (7 applications), [[:Category:H04W76/15|H04W76/15]] (6 applications), ...[:Category:H01L21/768|H01L21/768]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (7 applications)
    35 KB (4,315 words) - 17:46, 2 January 2024
  • NEC Corporation patent applications on July 18th, 2024
    IPC Code(s): A61B5/11, G16H10/60, G16H20/30, G16H50/30 ...the posture condition of the person.[[Category:A61B5/11]][[Category:G16H10/60]][[Category:G16H20/30]][[Category:G16H50/30]][[Category:CPC_A61B5/1121]][[C
    37 KB (5,618 words) - 03:56, 19 July 2024

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