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  • Patent Applications Report for 15th Mar 2024
    Number of patent applications containing '3D Printing' or its variations: 13 ...[:Category:H01L24/16|H01L24/16]] (11 applications), [[:Category:H01L25/065|H01L25/065]] (11 applications)
    47 KB (5,694 words) - 03:06, 19 March 2024
  • Patent Applications Report for 19th Apr 2024
    ...9/775|H01L29/775]] (14 applications), [[:Category:H01L25/065|H01L25/065]] (13 applications) ...[:Category:H01L23/538|H01L23/538]] (8 applications), [[:Category:H01L25/18|H01L25/18]] (8 applications), [[:Category:H01L23/31|H01L23/31]] (6 applications),
    48 KB (5,918 words) - 04:18, 26 April 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
    ...:Category:H01L29/423|H01L29/423]] (16), [[:Category:H01L29/78|H01L29/78]] (13), [[:Category:H01L23/522|H01L23/522]] (12), [[:Category:H01L29/06|H01L29/06 IPC Code(s): H01L23/31, H01L21/56, H01L23/00, H01L23/48, H01L25/00, H01L25/065
    88 KB (12,873 words) - 04:27, 14 June 2024
  • Patent Applications Report for 17th Mar 2023
    ...7/11556|H01L27/11556]] (14 applications), [[:Category:H04L5/00|H04L5/00]] (13 applications), [[:Category:H01L27/11565|H01L27/11565]] (12 applications), [ ...[[:Category:H01L23/00|H01L23/00]] (7 applications), [[:Category:H01L25/065|H01L25/065]] (6 applications), [[:Category:H01L23/15|H01L23/15]] (6 applications),
    37 KB (4,476 words) - 06:16, 2 January 2024
  • Patent Applications Report for 8th Dec 2023
    ...:Category:G06F3/0482|G06F3/0482]] (28), [[:Category:G06F9/451|G06F9/451]] (13), [[:Category:G06F3/04817|G06F3/04817]] (12), [[:Category:G06F3/04845|G06F3 ...F3/0482|G06F3/0482]] (28 applications), [[:Category:G06F9/451|G06F9/451]] (13 applications), [[:Category:G06F3/04817|G06F3/04817]] (12 applications), [[:
    37 KB (4,531 words) - 10:00, 7 December 2023
  • Apple Inc. patent applications on April 25th, 2024
    IPC Code(s): H01L25/16, H01L23/31, H01L25/00, H01L25/075, H01L27/12, H01L33/00, H01L33/06, H01L33/42, H01L33/44, H01L33/54, H01L ...Category:H01L25/16]][[Category:H01L23/31]][[Category:H01L25/00]][[Category:H01L25/075]][[Category:H01L27/12]][[Category:H01L33/00]][[Category:H01L33/06]][[Ca
    42 KB (6,668 words) - 02:20, 26 April 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
    IPC Code(s): G02B6/122, G02B6/13 ...pler, or to an interposer substrate.[[Category:G02B6/122]][[Category:G02B6/13]][[Category:taiwan semiconductor manufacturing company, ltd.]]
    105 KB (15,276 words) - 04:53, 11 April 2024
  • Samsung Display Co., LTD. patent applications on May 30th, 2024
    ...ategory:H10K59/12|H10K59/12]] (13), [[:Category:H10K59/1201|H10K59/1201]] (13) IPC Code(s): H01L25/075, B82B3/00, C09D11/322, C09D11/38, C09D11/50, H01L27/12, H01L33/24, H01L
    84 KB (13,117 words) - 07:26, 31 May 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
    IPC Code(s): G02B6/122, G02B6/13, G02B6/136 ...ayer to reduce the maximum distance.[[Category:G02B6/122]][[Category:G02B6/13]][[Category:G02B6/136]][[Category:taiwan semiconductor manufacturing co., l
    173 KB (25,550 words) - 07:41, 22 March 2024
  • Hyundai Motor Company patent applications on April 25th, 2024
    ...omposition includes 0.5% by weight to 10.0% by weight of a sulfonate diol, 13% by weight to 60% by weight of an isocyanate, 30% by weight to 70% by weigh IPC Code(s): C08L67/06, C08K3/04, C08K3/32, C08K3/34, C08K5/00, C08K5/13, C08K5/205, C08K5/3412
    45 KB (6,978 words) - 04:48, 26 April 2024
  • BOE TECHNOLOGY GROUP CO., LTD. patent applications on June 27th, 2024
    ...:Category:H10K59/80|H10K59/80]] (13), [[:Category:H10K59/122|H10K59/122]] (13) [[:Category:CPC_G09G3/3233|G09G3/3233]] (13), [[:Category:CPC_H10K59/131|H10K59/131]] (6), [[:Category:CPC_H10K59/122|H
    73 KB (11,612 words) - 01:13, 28 June 2024
  • Patent Applications Report for 17th Feb 2023
    ...:Category:H01L24/08|H01L24/08]] (10 applications), [[:Category:H01L25/0657|H01L25/0657]] (10 applications) ...n M. Fiebig of Cincinnati OH (US)|Kevin M. Fiebig of Cincinnati OH (US)]]: 13 patent applications for [[:Category:Cilag GmbH International|Cilag GmbH Int
    39 KB (4,793 words) - 04:41, 2 January 2024
  • Patent Applications Report for 1st Mar 2024
    Number of patent applications containing '5G Technologies' or its variations: 13 ...G3/3233|G09G3/3233]] (15 applications), [[:Category:H10K59/80|H10K59/80]] (13 applications)
    45 KB (5,535 words) - 03:18, 4 March 2024
  • Patent Applications Report for 17th May 2024
    ...Category:H01L29/775|H01L29/775]] (12 applications), [[:Category:H01L25/065|H01L25/065]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (11 applications ...TD. has filed patents in the areas of [[:Category:H10K59/131|H10K59/131]] (13 applications), [[:Category:H10K59/80|H10K59/80]] (8 applications), [[:Categ
    47 KB (5,826 words) - 06:52, 24 May 2024
  • Intel Corporation patent applications on February 29th, 2024
    IPC Code(s): H01L23/498, H01L23/00, H01L23/13, H01L23/538, H01L25/065 ...ategory:H01L23/00]][[Category:H01L23/13]][[Category:H01L23/538]][[Category:H01L25/065]][[Category:intel corporation]]
    65 KB (9,904 words) - 04:59, 4 March 2024
  • International Business Machines Corporation patent applications on April 4th, 2024
    IPC Code(s): G06F16/16, G06F16/13, G06F16/172 ...ry file system, to a value of true.[[Category:G06F16/16]][[Category:G06F16/13]][[Category:G06F16/172]][[Category:international business machines corporat
    89 KB (12,726 words) - 08:06, 11 April 2024
  • Intel Corporation patent applications on April 18th, 2024
    ...he areas of [[:Category:H01L23/538|H01L23/538]] (8), [[:Category:H01L25/18|H01L25/18]] (8), [[:Category:H01L23/31|H01L23/31]] (6), [[:Category:G06N3/08|G06N3 IPC Code(s): H01L23/15, H01L21/48, H01L23/31, H01L23/538, H01L25/065
    87 KB (13,256 words) - 02:51, 26 April 2024
  • Samsung Display Co., LTD. patent applications on June 6th, 2024
    ...[[:Category:H10K59/12|H10K59/12]] (13), [[:Category:H10K59/80|H10K59/80]] (13), [[:Category:H10K59/40|H10K59/40]] (11), [[:Category:H10K59/1201|H10K59/12 IPC Code(s): H01L33/62, H01L25/075
    74 KB (11,667 words) - 02:36, 10 June 2024
  • Intel Corporation patent applications on January 25th, 2024
    IPC Code(s): H01L23/538, H01L25/065, H01L23/473, H01L25/00, H01L25/10, H01L21/48, H10B80/00, G02B6/12 ...tegory:H01L25/065]][[Category:H01L23/473]][[Category:H01L25/00]][[Category:H01L25/10]][[Category:H01L21/48]][[Category:H10B80/00]][[Category:G02B6/12]][[Cate
    82 KB (12,470 words) - 10:13, 30 January 2024
  • Intel Corporation patent applications on March 28th, 2024
    ...:Category:H01L23/528|H01L23/528]] (13), [[:Category:H01L29/06|H01L29/06]] (13), [[:Category:H01L29/0673|H01L29/0673]] (12), [[:Category:H01L29/775|H01L29 IPC Code(s): G02B6/12, H01L25/16
    130 KB (19,844 words) - 04:19, 11 April 2024

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