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Create the page "H01L23/60" on this wiki! See also the search results found.
- ...egory:H01L27/11582|H01L27/11582]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H01L27/11556|H01L27/11556]] (10 applica ...[[:Category:F24F11/56|F24F11/56]] (4 applications), [[:Category:H01L23/31|H01L23/31]] (4 applications), [[:Category:H01L21/56|H01L21/56]] (4 applications),36 KB (4,410 words) - 03:45, 4 January 2024
- IPC Code(s): G11C11/412, H01L23/48, H10B10/00 ...cture of the second pull-down transistor.[[Category:G11C11/412]][[Category:H01L23/48]][[Category:H10B10/00]][[Category:taiwan semiconductor manufacturing com105 KB (15,276 words) - 04:53, 11 April 2024
- ...eas of [[:Category:B60L53/18|B60L53/18]] (2), [[:Category:B60L53/60|B60L53/60]] (2), [[:Category:B60L53/302|B60L53/302]] (2), [[:Category:H01M50/538|H01M ...ategory:H01L23/522|H01L23/522]] (13 applications), [[:Category:H01L23/5226|H01L23/5226]] (13 applications)37 KB (4,509 words) - 00:28, 4 January 2024
- ...CTRONICS CO., LTD. has filed patents in the areas of [[:Category:H01L23/00|H01L23/00]] (13 applications), [[:Category:H01L24/16|H01L24/16]] (12 applications) ...[:Category:G06N3/084|G06N3/084]] (6 applications), [[:Category:H01L23/5386|H01L23/5386]] (5 applications), [[:Category:H01L24/16|H01L24/16]] (5 applications)45 KB (5,610 words) - 10:14, 30 January 2024
- IPC Code(s): G06F21/78, G06F21/54, G06F21/60 ...t in the sid.[[Category:G06F21/78]][[Category:G06F21/54]][[Category:G06F21/60]][[Category:micron technology, inc.]]57 KB (8,986 words) - 08:03, 31 May 2024
- [[:Category:Apple Inc.|Apple Inc.]]: 60 patent applications[[Category:Apple Inc.]] ...:Category:H01L29/775|H01L29/775]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H04W72/23|H04W72/23]] (10 applications)39 KB (4,876 words) - 09:02, 30 January 2024
- IPC Code(s): G06F9/50, G06F9/445, G06F9/48, G06F21/60, G06F21/72 ...ory:G06F9/50]][[Category:G06F9/445]][[Category:G06F9/48]][[Category:G06F21/60]][[Category:G06F21/72]][[Category:intel corporation]]59 KB (9,008 words) - 01:21, 24 May 2024
- ...tegory:H01L27/11573|H01L27/11573]] (6 applications), [[:Category:H01L23/00|H01L23/00]] (6 applications) ...y:CHANGXIN MEMORY TECHNOLOGIES, INC.|CHANGXIN MEMORY TECHNOLOGIES, INC.]]: 60 patent applications[[Category:CHANGXIN MEMORY TECHNOLOGIES, INC.]]38 KB (4,677 words) - 01:14, 2 January 2024
- ...8]] (7), [[:Category:H04W72/0446|H04W72/0446]] (6), [[:Category:H01L23/538|H01L23/538]] (5) ...the areas of [[:Category:H04W72/23|H04W72/23]] (14), [[:Category:H01L23/00|H01L23/00]] (13), [[:Category:H10B80/00|H10B80/00]] (13), [[:Category:H10B43/27|H155 KB (6,817 words) - 03:50, 10 June 2024
- ...:Category:H01L29/423|H01L29/423]] (43 applications), [[:Category:H01L23/00|H01L23/00]] (43 applications) [[:Category:H01L23/00|H01L23/00]]: 10436 KB (4,390 words) - 15:28, 6 December 2023
- IPC Code(s): G06F21/60, H04L9/40, H04L67/10 ...ient device. other embodiments are described and claimed.[[Category:G06F21/60]][[Category:H04L9/40]][[Category:H04L67/10]][[Category:intel corporation]]48 KB (7,150 words) - 09:00, 12 April 2024
- IPC Code(s): G06F11/10, G06F11/07, G06F21/60, G06F21/64 ...he crc value.[[Category:G06F11/10]][[Category:G06F11/07]][[Category:G06F21/60]][[Category:G06F21/64]][[Category:micron technology, inc.]]62 KB (9,556 words) - 04:36, 20 February 2024
- .../31]] (6), [[:Category:G06N3/08|G06N3/08]] (6), [[:Category:G06T1/60|G06T1/60]] (6) IPC Code(s): G06F1/3234, G06T1/6087 KB (13,256 words) - 02:51, 26 April 2024
- ...he areas of [[:Category:H01L23/00|H01L23/00]] (11), [[:Category:H01L23/498|H01L23/498]] (7), [[:Category:H01L21/48|H01L21/48]] (7), [[:Category:H04W72/232|H0 IPC Code(s): G06F9/50, G06F9/38, G06T1/20, G06T1/6090 KB (13,613 words) - 02:24, 10 June 2024
- ...oration has applied for patents in the areas of [[:Category:G06T1/60|G06T1/60]] (2), [[:Category:G06F15/173|G06F15/173]] (2), [[:Category:H04L67/1097|H04 ...CTRONICS CO., LTD. has filed patents in the areas of [[:Category:H01L23/00|H01L23/00]] (13 applications), [[:Category:H01L25/18|H01L25/18]] (10 applications)37 KB (4,614 words) - 06:35, 7 December 2023
- IPC Code(s): G06F12/14, G06F3/06, G06F21/60, H04L9/06 ...emory systems.[[Category:G06F12/14]][[Category:G06F3/06]][[Category:G06F21/60]][[Category:H04L9/06]][[Category:micron technology, inc.]]58 KB (8,941 words) - 03:04, 19 March 2024
- ...9]] (6), [[:Category:H01M4/133|H01M4/133]] (4), [[:Category:G06T7/60|G06T7/60]] (4), [[:Category:B60K1/04|B60K1/04]] (4), [[:Category:G06V10/82|G06V10/82 IPC Code(s): B60L15/20, B60L50/6060 KB (9,679 words) - 08:28, 11 April 2024
- ...:Category:H01L27/092|H01L27/092]] (7 applications), [[:Category:H01L23/498|H01L23/498]] (5 applications), [[:Category:H01L25/065|H01L25/065]] (5 applications [[:Category:H01L23/00|H01L23/00]]: 9737 KB (4,531 words) - 10:00, 7 December 2023
- IPC Code(s): B60K1/04, B60L50/60 ...ents through the connecting portion.[[Category:B60K1/04]][[Category:B60L50/60]][[Category:hyundai motor company]]53 KB (8,371 words) - 03:34, 10 June 2024
- IPC Code(s): H01L23/427, H01L25/16, H01L23/00 ...idic channel layer.[[Category:H01L23/427]][[Category:H01L25/16]][[Category:H01L23/00]][[Category:nokia technologies oy]]49 KB (7,284 words) - 04:36, 20 February 2024