Category:Jongho Park of Suwon-si KR: Difference between revisions
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= Jongho Park = | = Jongho Park = | ||
Jongho Park from Suwon-si KR has applied for patents in technology areas such as [[:Category: | Jongho Park from Suwon-si KR has applied for patents in technology areas such as [[:Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}|Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] with [[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]. | ||
== Patents == | == Patents == | ||
* [[ | * [[20250174541. SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)|SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUFACTURING THE SAME (20250174541)]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category: | [[Category:Samsung Electronics Co., Ltd.]] | ||
[[Category: | [[Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] | ||
Latest revision as of 17:07, 29 May 2025
Jongho Park
Jongho Park from Suwon-si KR has applied for patents in technology areas such as [[:Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}|Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] with Samsung Electronics Co., Ltd..
Patents
[[Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]]
Pages in category "Jongho Park of Suwon-si KR"
The following 3 pages are in this category, out of 3 total.