Category:Jeremy Ecton of Gilbert AZ (US): Difference between revisions

Jeremy Ecton of Gilbert AZ (US)

Executive Summary

Jeremy Ecton of Gilbert AZ (US) is an inventor who has filed 10 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as Intel Corporation (10 patents). Their most frequent collaborators include (10 collaborations), (7 collaborations), (7 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 4 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
• H01L23/5383 ({Multilayer substrates (): 3 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 3 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/295 ({containing a filler (): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1703 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4821 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
• H01L2224/32146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1435 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/14 ({of a plurality of bump connectors}): 1 patents
• H01L2224/1403 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16152 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Intel Corporation: 10 patents

Collaborators

• Gang Duan of Chandler AZ (US) (10 collaborations)
• Brandon C. Marin of Gilbert AZ (US) (7 collaborations)
• Srinivas V. Pietambaram of Chandler AZ (US) (7 collaborations)
• Bohan Shan of Chandler AZ (US) (6 collaborations)
• Haobo Chen of Chandler AZ (US) (4 collaborations)
• Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US) (3 collaborations)
• Brandon Christian Marin of Gilbert AZ (US) (3 collaborations)
• Benjamin T. Duong of Phoenix AZ (US) (3 collaborations)
• Suddhasattwa Nad of Chandler AZ (US) (3 collaborations)
• Hiroki Tanaka of Gilbert AZ (US) (2 collaborations)
• Benjamin Taylor Duong of Phoenix AZ (US) (2 collaborations)
• Tarek A. Ibrahim of Mesa AZ (US) (2 collaborations)
• Yosuke Kanaoka of Chandler AZ (US) (2 collaborations)
• Minglu Liu of Chandler AZ (US) (2 collaborations)
• Jason Gamba of Gilbert AZ (US) (1 collaborations)
• Robert May of Chandler AZ (US) (1 collaborations)
• Bai Nie of Chandler AZ (US) (1 collaborations)
• Whitney Bryks of Tempe AZ (US) (1 collaborations)
• Wei Wei of Chandler AZ (US) (1 collaborations)
• Jose Fernando Waimin Almendares of Gilbert AZ (US) (1 collaborations)
• Ryan Joseph Carrazzone of Chandler AZ (US) (1 collaborations)
• Kyle Jordan Arrington of Gilbert AZ (US) (1 collaborations)
• Ziyin Lin of Chandler AZ (US) (1 collaborations)
• Dingying Xu of Chandler AZ (US) (1 collaborations)
• Hongxia Feng of Chandler AZ (US) (1 collaborations)
• Yiqun Bai of Chandler AZ (US) (1 collaborations)
• Rui Zhang of Chandler AZ (US) (1 collaborations)
• Mohit Gupta of Chandler AZ (US) (1 collaborations)