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[[Organizations that have been involved in Patent Lawsuits]] - A list of organizations that have been involved, publicly, in patent lawsuits. | [[Organizations that have been involved in Patent Lawsuits]] - A list of organizations that have been involved, publicly, in patent lawsuits. | ||
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Revision as of 08:30, 18 March 2024
Contents
Welcome to WikiPatents!
Welcome to WikiPatents, the go-to Wiki for insights into the dynamic realm of patent applications. We specialize in delving into the latest trends in patent filings, offering insights into the evolving technology and intellectual property sectors. Explore the depth of patent applications across various industries, and understand the strategic innovations of leading-edge companies. Our platform highlights the newest directions in technological protection sought by corporations. Experience a clear understanding of patent abstracts, tailored for inventors, tech aficionados, or legal professionals. WikiPatents guides you through the intricate patent application landscape, revealing potential applications and problem-solving aspects of patents.
Weekly Reports
Weekly Reports 2024 - Weekly patent application reports in 2024.
Weekly Reports - Weekly reports on patent applications. Covering top technology areas, organizations, and inventors.
Trending Patent Areas
Trending Patents History - A list of trending patents.
All Patent Areas
Patents by Organization - Uncover a wealth of data encompassing patents, patent licensing, and patent transactions, while exploring our dynamic digital repository focused on patent applications and trends within the realm of intellectual property.
Patents by Technology - Patent insights categorized by specific technologies.
Patents by Inventor - Patent insights categorized by inventors.
Organizations that have been involved in Patent Lawsuits - A list of organizations that have been involved, publicly, in patent lawsuits.
Patent strategy - Articles about patent strategy, such as patent troll defense.
University Patents - Patent insights categorized by universities.
Rejected Patents - A catalog of rejected patents.
Patent Brokers - Patent brokers.
Questions about patents - A collection of questions about patents and explanations.
New Pages
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)
- 09:32, 27 September 2024 18606843. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,556 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18612137. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,675 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18601467. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,183 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18736075. INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,600 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18733705. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,940 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18419715. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,021 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18481872. SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,947 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18613414. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,379 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:31, 27 September 2024 18607907. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,711 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18607849. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [2,903 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18427614. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,576 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18735409. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [2,953 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18612492. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,444 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18492946. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [2,557 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18441327. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,087 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18428033. SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,476 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18394575. HEAT DISSIPATION STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,042 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18505670. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [4,480 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18514514. SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,407 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 09:30, 27 September 2024 18505412. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) (hist) [3,184 bytes] Wikipatents (talk | contribs) (Creating a new page)
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)