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== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2025 ==
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_February 2025.png|border|800px]]


== Top Technology Areas in Plasma Technology ==
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_February 2025.png|border|800px]]


=== Top CPC Codes ===
=== Top CPC Codes ===
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps)
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
** Count: 10 patents
** Count: 17 patents
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits})
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
** Count: 9 patents
** Count: 13 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
** Example: [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
** Count: 9 patents
** Count: 11 patents
** Example: [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 8 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
** Count: 6 patents
** Count: 11 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
** Count: 5 patents
** Count: 10 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
** Count: 5 patents
** Count: 10 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
** Example: [[20250069858. PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR (ULVAC, INC.)]]
* [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available)
** Count: 4 patents
** Count: 10 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]]
* [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
** Count: 4 patents
** Count: 7 patents
** Example: [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]]
** Example: [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_H01L21/6833|H01L21/6833]] (for supporting or gripping  (for conveying)
* [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available)
** Count: 4 patents
** Count: 7 patents
** Example: [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
** Count: 7 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]


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=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 19
* Number of Plasma Technology patents: 28
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge): 5 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 8 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 5 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 8 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 7 patents
* Recent patents:
* Recent patents:
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
Line 52: Line 52:
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
* Number of Plasma Technology patents: 5
* Number of Plasma Technology patents: 7
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 2 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/327|H01J2237/327]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
** [[20250062131. PLASMA ETCHING IN SEMICONDUCTOR PROCESSING (Applied Materials, Inc.)]] (20250220)
* Number of Plasma Technology patents: 2
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 4
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01L29/66545|H01L29/66545]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_G03F1/82|G03F1/82]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32522|H01J37/32522]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32834|H01J37/32834]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32201|H01J37/32201]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250069867. PLASMA PROCESSING APPARATUS AND GAS EXHAUST METHOD (Hitachi High-Tech Corporation)]] (20250227)
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L21/32136|H01L21/32136]] ({using plasmas}): 1 patents
** [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32697|H01J37/32697]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available): 1 patents
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/2007|H01J2237/2007]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/202|H01J2237/202]] (No explanation available): 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
** [[:Category:CPC_H01L21/30655|H01L21/30655]] (Plasma etching; Reactive-ion etching): 1 patents
** [[:Category:CPC_H01L21/76232|H01L21/76232]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms): 1 patents
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (No explanation available): 1 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor  (application of shock waves): 1 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
Line 118: Line 130:
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
** [[:Category:CPC_H01L24/05|H01L24/05]] (No explanation available): 1 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (Constructional details, e.g. mounting of circuits in the carrier): 1 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (No explanation available): 1 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (No explanation available): 1 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
=== [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]] ===
* Number of Plasma Technology patents: 1
* Top CPC codes:
** [[:Category:CPC_H10N60/0912|H10N60/0912]] (No explanation available): 1 patents
** [[:Category:CPC_H10N60/12|H10N60/12]] (No explanation available): 1 patents
** [[:Category:CPC_H10N60/85|H10N60/85]] (No explanation available): 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)


== New Companies in Plasma Technology (Last Month) ==
== New Companies in Plasma Technology (Last Month) ==
Line 140: Line 144:
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]


* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01L29/7851|H01L29/7851]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
* [[:Category:CPC_H01J37/32926|H01J37/32926]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_C23C28/042|C23C28/042]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_H01J37/32165|H01J37/32165]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_C23C14/46|C23C14/46]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_C23C28/042|C23C28/042]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_C23C14/30|C23C14/30]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_C23C14/46|C23C14/46]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_C23C14/26|C23C14/26]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_C23C14/30|C23C14/30]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_C23C14/26|C23C14/26]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_C23C14/083|C23C14/083]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]]


== Top Companies in Emerging Plasma Technology Technologies 2025==
== Top Companies in Emerging Plasma Technology Technologies 2025==
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]


* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 5 patents
* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 6 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 1 patents
* [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]]: 1 patents


== Top Inventors in Plasma Technology ==
== Top Inventors in Plasma Technology ==
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=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250130)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
* Number of Plasma Technology patents: 4
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
** [[20250069863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250227)
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Chih-Teng LIAO|Chih-Teng LIAO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250069860. PLASMA PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]] (20250227)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
=== [[:Category:Jonghwa LEE|Jonghwa LEE]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Jawon KO|Jawon KO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Taijo JEON|Taijo JEON]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Yunsong JEONG|Yunsong JEONG]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 246: Line 301:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Alok Ranjan|Alok Ranjan of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 253: Line 315:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Nathan STAFFORD|Nathan STAFFORD of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Colin JENNINGS|Colin JENNINGS of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Scott BILTEK|Scott BILTEK of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Phong NGUYEN|Phong NGUYEN of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Maolin Long|Maolin Long of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Mattson Technology, Inc.|Mattson Technology, Inc.]]: 1 patents
** [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]]: 1 patents
* Recent patents:
** [[20250062103. Cooled Shield for ICP Source (Mattson Technology, Inc.)]] (20250220)
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 350: Line 466:
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Taro HAYAKAWA|Taro HAYAKAWA]] ===
=== [[:Category:Chun-Fu YANG|Chun-Fu YANG]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250102)
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
=== [[:Category:Pei-Cheng HSU|Pei-Cheng HSU]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Yohei ISHIDA|Yohei ISHIDA]] ===
=== [[:Category:Ta-Cheng LIEN|Ta-Cheng LIEN]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Yang YANG|Yang YANG of Cupertino CA (US)]] ===
=== [[:Category:Hsin-Chang LEE|Hsin-Chang LEE]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Fernando SILVEIRA|Fernando SILVEIRA of Livermore CA (US)]] ===
=== [[:Category:Shinji HIMORI|Shinji HIMORI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
=== [[:Category:Imad YOUSIF|Imad YOUSIF of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
=== [[:Category:Motohiro UMEHARA|Motohiro UMEHARA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Wataru FUJITA|Wataru FUJITA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Kazuhiro ISHIKAWA|Kazuhiro ISHIKAWA]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Takamichi KIKUCHI|Takamichi KIKUCHI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Yuki ONODERA|Yuki ONODERA]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Takamitsu TAKAYAMA|Takamitsu TAKAYAMA]] ===
=== [[:Category:Justin Moses|Justin Moses of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Noriiki MASUDA|Noriiki MASUDA]] ===
=== [[:Category:Chelsea DuBose|Chelsea DuBose of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Adam S. BEACHEY|Adam S. BEACHEY]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:SPTS Technologies Limited|SPTS Technologies Limited]]: 1 patents
* Recent patents:
** [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]] (20250102)
=== [[:Category:Jhih-Yan HE|Jhih-Yan HE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Li-Chun CHANG|Li-Chun CHANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Jyh-Wei LEE|Jyh-Wei LEE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Ming-Hung CHEN|Ming-Hung CHEN]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
=== [[:Category:Mohd Fairuz BIN BUDIMAN|Mohd Fairuz BIN BUDIMAN]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250046573. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250206)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:YUAN-CHI LEE|YUAN-CHI LEE]] ===
=== [[:Category:You Bong LIM|You Bong LIM]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)
=== [[:Category:PIN-CHUN LIU|PIN-CHUN LIU]] ===
=== [[:Category:Jun Young KIM|Jun Young KIM]] ===
* Number of Plasma Technology patents: 1
* Number of Plasma Technology patents: 1
* Top companies:
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)
=== [[:Category:MING-CHAN TSAI|MING-CHAN TSAI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)


== Top Collaborations in Plasma Technology ==
== Top Collaborations in Plasma Technology ==
Line 505: Line 531:
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]


* Tokyo: 16 inventors
* Miyagi: 31 inventors
* Miyagi: 12 inventors
* Tokyo: 26 inventors
* Suwon-si: 11 inventors
* Suwon-si: 19 inventors
* San Jose: 8 inventors
* Austin: 15 inventors
* Hsinchu: 15 inventors
* San Jose: 14 inventors
* Newark: 8 inventors
* Shanghai: 7 inventors
* Shanghai: 7 inventors
* Austin: 6 inventors
* Sunnyvale: 7 inventors
* OSAKA: 6 inventors
* OSAKA: 6 inventors
* Chigasaki-shi: 5 inventors
* Taoyuan: 5 inventors
* Taoyuan: 5 inventors
* Hsinchu: 5 inventors
* Osaka: 5 inventors
* Osaka: 5 inventors
* Santa Clara: 4 inventors
* Hsinchu City: 4 inventors
* Fremont: 4 inventors
* New Taipei: 4 inventors
* New Taipei: 4 inventors
* Santa Clara: 3 inventors
* Espoo: 3 inventors
* Espoo: 3 inventors
* Taoyuan City: 3 inventors
* Daejeon: 3 inventors
* Fort Collins: 3 inventors
* Kurokawa-gun: 3 inventors
* Longmont: 3 inventors
* Sunnyvale: 2 inventors
* Cupertino: 2 inventors
* Taipei: 2 inventors
* Kaohsiung: 2 inventors


[[Category:Plasma Technology]]
[[Category:Plasma Technology]]
[[Category:Patent Application Trends by Technology in 2025]]
[[Category:Patent Application Trends by Technology in 2025]]

Revision as of 09:05, 11 March 2025

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Top Technology Areas in Plasma Technology

Top CPC Codes

Top Companies in Plasma Technology 2025

Tokyo Electron Limited

Applied Materials, Inc.

Taiwan Semiconductor Manufacturing Company, Ltd.

Hitachi High-Tech Corporation

HITACHI HIGH-TECH CORPORATION

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA

SAMSUNG ELECTRONICS CO., LTD.

Panasonic Intellectual Property Management Co., Ltd.

Research & Business Foundation SUNGKYUNKWAN UNIVERSITY

Impinj, Inc.

New Companies in Plasma Technology (Last Month)

File:New Companies in Plasma Technology Last Month.png

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Top Companies in Emerging Plasma Technology Technologies 2025

Top Inventors in Plasma Technology

Barton Lane of Austin TX (US)

Chishio KOSHIMIZU

Merritt Funk of Austin TX (US)

Chih-Teng LIAO

Jonghwa LEE

Jawon KO

Taijo JEON

Yunsong JEONG

Kartik RAMASWAMY of San Jose CA (US)

Takahiro SHINDO

Shogo OKITA

Takahiro MIYAI

Naoaki TAKEDA

Toshiyuki TAKASAKI

Hisao NAGAI

Seiya NAGANO

Alok Ranjan of Austin TX (US)

Tzu-Ging Lin

Nathan STAFFORD of Newark DE (US)

Colin JENNINGS of Newark DE (US)

Scott BILTEK of Newark DE (US)

Phong NGUYEN of Newark DE (US)

Peter Lowell George Ventzek of Austin TX (US)

Mitsunori Ohata

Maolin Long of Santa Clara CA (US)

Masaki HIRAYAMA

Tuqiang NI

Zhihao WANG

Kailin WANG

David Coumou of Webster NY (US)

Zhi Wang of Sunnyvale CA (US)

Tao Zhang of San Ramon CA (US)

David Peterson of San Jose CA (US)

Mina T. FARAG of Cupertino CA (US)

Terry BLUCK of Santa Clara CA (US)

James GUZZO

Harley K. HEINRICH of Seattle WA (US)

Christopher J. DIORIO of Shoreline WA (US)

Janne Lehtinen

Joonas Govenius

Jukka-Pekka Kaikkonen

Chun-Fu YANG

Pei-Cheng HSU

Ta-Cheng LIEN

Hsin-Chang LEE

Shinji HIMORI

Justin Moses of Austin TX (US)

Chelsea DuBose of Austin TX (US)

You Bong LIM

Jun Young KIM

Top Collaborations in Plasma Technology

Top US States for Plasma Technology Inventors


Top Cities for Plasma Technology Inventors

  • Miyagi: 31 inventors
  • Tokyo: 26 inventors
  • Suwon-si: 19 inventors
  • Austin: 15 inventors
  • Hsinchu: 15 inventors
  • San Jose: 14 inventors
  • Newark: 8 inventors
  • Shanghai: 7 inventors
  • Sunnyvale: 7 inventors
  • OSAKA: 6 inventors
  • Chigasaki-shi: 5 inventors
  • Taoyuan: 5 inventors
  • Osaka: 5 inventors
  • Santa Clara: 4 inventors
  • Hsinchu City: 4 inventors
  • Fremont: 4 inventors
  • New Taipei: 4 inventors
  • Espoo: 3 inventors
  • Daejeon: 3 inventors
  • Kurokawa-gun: 3 inventors
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