Samsung electronics co., ltd. (20250129267). POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE: Difference between revisions
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=POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE= | =POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE= | ||
Latest revision as of 15:24, 29 April 2025
POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Fedosya Kalinina of Suwon-si KR
POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250129267 titled 'POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Original Abstract Submitted
a polishing slurry, and a method of manufacturing a semiconductor device using the polishing slurry are provided. the polishing slurry includes nano-abrasive particles having a mohs hardness greater than about 5, and soft particles having a mohs hardness lower than the mohs hardness of the nano-abrasive particles, and wherein the nano-abrasive particles and the soft particles have a same sign of zeta potentials as each other in the polishing slurry.
