Samsung electronics co., ltd. (20250129267). POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Fedosya Kalinina of Suwon-si KR
POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250129267 titled 'POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Original Abstract Submitted
a polishing slurry, and a method of manufacturing a semiconductor device using the polishing slurry are provided. the polishing slurry includes nano-abrasive particles having a mohs hardness greater than about 5, and soft particles having a mohs hardness lower than the mohs hardness of the nano-abrasive particles, and wherein the nano-abrasive particles and the soft particles have a same sign of zeta potentials as each other in the polishing slurry.