Samsung electronics co., ltd. (20250062208). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Kyoung Lim Suk of Suwon-si (KR)

Kyung Don Mun of Suwon-si (KR)

Inhyung Song of Suwon-si (KR)

Yeonho Jang of Suwon-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250062208 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Original Abstract Submitted

a semiconductor package may include a first redistribution layer structure, a chiplet structure on the first redistribution layer structure, a plurality of first connection members on the first redistribution layer structure, a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members, and a second redistribution layer structure on the first molding material. the chiplet structure may include a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.