Samsung electronics co., ltd. (20250062208). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kyoung Lim Suk of Suwon-si (KR)
Kyung Don Mun of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250062208 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Original Abstract Submitted
a semiconductor package may include a first redistribution layer structure, a chiplet structure on the first redistribution layer structure, a plurality of first connection members on the first redistribution layer structure, a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members, and a second redistribution layer structure on the first molding material. the chiplet structure may include a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.
