Category:JHIH-WEI LAI: Difference between revisions

Latest revision as of 03:08, 2 April 2025

JHIH-WEI LAI

Executive Summary

JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

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List of Technology Areas

C04B35/581 (based on aluminium nitride): 1 patents
C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
C04B35/6261 ({Milling}): 1 patents
C04B35/638 (Removal thereof): 1 patents
C04B35/64 (Burning or sintering processes (): 1 patents
C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
C04B2235/386 (Boron nitrides): 1 patents
C04B2235/3865 (Aluminium nitrides): 1 patents
C04B2235/528 (Spheres): 1 patents
C04B2235/5292 (Flakes, platelets or plates): 1 patents
C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
C04B2235/612 (Machining): 1 patents
C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
C04B2235/668 (Pressureless sintering): 1 patents
C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
H10H20/857 (No explanation available): 1 patents
H10H20/853 (No explanation available): 1 patents
H10H20/0362 (No explanation available): 1 patents
H10H20/0364 (No explanation available): 1 patents

Companies

List of Companies

TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents

Collaborators

SHIH-HAN WU (3 collaborations)
JIAN-YU SHIH (3 collaborations)
MING-YEN PAN (2 collaborations)
KAI-MOU CHOU (1 collaborations)
YU-HSIEN LIAO (1 collaborations)
HAO-EN HUNG (1 collaborations)

Subcategories

This category has the following 7 subcategories, out of 7 total.

C

► CHIA-SHUAI CHANG‎ (2 C)

D

► DEI-CHENG LIU‎ (2 C)

J

► JHIH-WEI LAI‎ (7 C)
► JIAN-YU SHIH‎ (7 C)

K

► KAI-MOU CHOU‎ (4 C)

M

► MING-YEN PAN‎ (6 C)

S

► SHIH-HAN WU‎ (7 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-JHIH-WEI LAI is an inventor who has filed 2 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include [[Category:DEI-CHENG LIU|DEI-CHENG LIU]] (2 collaborations), [[Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]] (1 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (1 collaborations).
+JHIH-WEI LAI is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include [[Category:SHIH-HAN WU|SHIH-HAN WU]] (3 collaborations), [[Category:JIAN-YU SHIH|JIAN-YU SHIH]] (3 collaborations), [[Category:MING-YEN PAN|MING-YEN PAN]] (2 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L21/481|H01L21/481]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_C04B35/581|C04B35/581]] (based on aluminium nitride): 1 patents
-* [[:Category:CPC_H01L21/486|H01L21/486]] (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_C04B35/62218|C04B35/62218]] ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
-* [[:Category:CPC_H01L21/50|H01L21/50]] (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
+* [[:Category:CPC_C04B35/6261|C04B35/6261]] ({Milling}): 1 patents
-* [[:Category:CPC_H01L27/14618|H01L27/14618]] ({Containers}): 1 patents
+* [[:Category:CPC_C04B35/638|C04B35/638]] (Removal thereof): 1 patents
-* [[:Category:CPC_H01L33/486|H01L33/486]] ({adapted for surface mounting}): 1 patents
+* [[:Category:CPC_C04B35/64|C04B35/64]] (Burning or sintering processes  (): 1 patents
-* [[:Category:CPC_H01L33/60|H01L33/60]] (Reflective elements): 1 patents
+* [[:Category:CPC_C04B2235/3225|C04B2235/3225]] (Yttrium oxide or oxide-forming salts thereof): 1 patents
-* [[:Category:CPC_H01L33/62|H01L33/62]] (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
+* [[:Category:CPC_C04B2235/386|C04B2235/386]] (Boron nitrides): 1 patents
-* [[:Category:CPC_H01L2933/0058|H01L2933/0058]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_C04B2235/3865|C04B2235/3865]] (Aluminium nitrides): 1 patents
-* [[:Category:CPC_H01L2933/0066|H01L2933/0066]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_C04B2235/528|C04B2235/528]] (Spheres): 1 patents
-* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
+* [[:Category:CPC_C04B2235/5292|C04B2235/5292]] (Flakes, platelets or plates): 1 patents
-* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
+* [[:Category:CPC_C04B2235/5436|C04B2235/5436]] (micrometer sized, i.e. from 1 to 100 micron): 1 patents
-* [[:Category:CPC_H01L23/552|H01L23/552]] (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
+* [[:Category:CPC_C04B2235/5445|C04B2235/5445]] (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
-* [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_C04B2235/5454|C04B2235/5454]] (nanometer sized, i.e. below 100 nm): 1 patents
-* [[:Category:CPC_H01L25/13|H01L25/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_C04B2235/6025|C04B2235/6025]] (Tape casting, e.g. with a doctor blade): 1 patents
-* [[:Category:CPC_H01L2224/16227|H01L2224/16227]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
+* [[:Category:CPC_C04B2235/604|C04B2235/604]] (Pressing at temperatures other than sintering temperatures): 1 patents
+* [[:Category:CPC_C04B2235/612|C04B2235/612]] (Machining): 1 patents
+* [[:Category:CPC_C04B2235/6581|C04B2235/6581]] (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
+* [[:Category:CPC_C04B2235/667|C04B2235/667]] (Sintering using wave energy, e.g. microwave sintering): 1 patents
+* [[:Category:CPC_C04B2235/668|C04B2235/668]] (Pressureless sintering): 1 patents
+* [[:Category:CPC_C04B2235/78|C04B2235/78]] (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
+* [[:Category:CPC_H05K3/12|H05K3/12]] (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
+* [[:Category:CPC_H05K1/18|H05K1/18]] (Printed circuits structurally associated with non-printed electric components  ({): 1 patents
+* [[:Category:CPC_H05K2201/10984|H05K2201/10984]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
+* [[:Category:CPC_H10H20/857|H10H20/857]] (No explanation available): 1 patents
+* [[:Category:CPC_H10H20/853|H10H20/853]] (No explanation available): 1 patents
+* [[:Category:CPC_H10H20/0362|H10H20/0362]] (No explanation available): 1 patents
+* [[:Category:CPC_H10H20/0364|H10H20/0364]] (No explanation available): 1 patents
 === Companies ===
@@ Line 31: / Line 43: @@
 ==== List of Companies ====
-* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents
+* TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents
 === Collaborators ===
-* [[:Category:DEI-CHENG LIU|DEI-CHENG LIU]][[Category:DEI-CHENG LIU]] (2 collaborations)
+* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (3 collaborations)
-* [[:Category:CHIA-SHUAI CHANG|CHIA-SHUAI CHANG]][[Category:CHIA-SHUAI CHANG]] (1 collaborations)
+* [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (3 collaborations)
-* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (1 collaborations)
+* [[:Category:MING-YEN PAN|MING-YEN PAN]][[Category:MING-YEN PAN]] (2 collaborations)
-* [[:Category:JIAN-YU SHIH|JIAN-YU SHIH]][[Category:JIAN-YU SHIH]] (1 collaborations)
+* [[:Category:KAI-MOU CHOU|KAI-MOU CHOU]][[Category:KAI-MOU CHOU]] (1 collaborations)
-* [[:Category:SHIH-HAN WU|SHIH-HAN WU]][[Category:SHIH-HAN WU]] (1 collaborations)
+* [[:Category:YU-HSIEN LIAO|YU-HSIEN LIAO]][[Category:YU-HSIEN LIAO]] (1 collaborations)
+* [[:Category:HAO-EN HUNG|HAO-EN HUNG]][[Category:HAO-EN HUNG]] (1 collaborations)
 [[Category:JHIH-WEI LAI]]
 [[Category:Inventors]]
 [[Category:Inventors filing patents with TONG HSING ELECTRONIC INDUSTRIES, LTD.]]