Category:Thomas Wagner of Regelsbach DE: Difference between revisions
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= Thomas Wagner = | = Thomas Wagner = | ||
Thomas Wagner from Regelsbach DE has applied for patents in technology areas such as [[:Category: | Thomas Wagner from Regelsbach DE has applied for patents in technology areas such as [[:Category:Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}|Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}]] with [[:Category:Intel Corporation|Intel Corporation]]. | ||
== Patents == | == Patents == | ||
* [[ | * [[20250201605. ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE (Intel Corporation)|ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE (20250201605)]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category: | [[Category:Intel Corporation]] | ||
[[Category: | [[Category:Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}]] | ||
Latest revision as of 18:33, 22 June 2025
Thomas Wagner
Thomas Wagner from Regelsbach DE has applied for patents in technology areas such as [[:Category:Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}|Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}]] with Intel Corporation.
Patents
[[Category:Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)}]]
Pages in category "Thomas Wagner of Regelsbach DE"
The following 7 pages are in this category, out of 7 total.
1
I
- Intel corporation (20250006630). Routing and Passive Components in a Direct Bonding Layer
- Intel corporation (20250112139). VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE
- Intel corporation (20250112191). DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Intel corporation (20250112202). THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY