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== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2025 ==
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_February 2025.png|border|800px]]
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_May 2025.png|border|800px]]


== Top Technology Areas in Plasma Technology ==
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_February 2025.png|border|800px]]
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_May 2025.png|border|800px]]


=== Top CPC Codes ===
=== Top CPC Codes ===
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps)
** Count: 17 patents
** Count: 51 patents
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
** Example: [[20250118537. PLASMA PROCESSING APPARATUS AND HEATING APPARATUS (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 13 patents
** Count: 28 patents
** Example: [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 11 patents
** Count: 26 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 11 patents
** Count: 24 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250115522. JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES (Lam Research Corporation)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 10 patents
** Count: 22 patents
** Example: [[20250115522. JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES (Lam Research Corporation)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits})
** Count: 20 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 10 patents
** Count: 19 patents
** Example: [[20250069858. PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR (ULVAC, INC.)]]
** Example: [[20250118532. SYSTEM AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available)
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (Plasma etching; Reactive-ion etching)
** Count: 10 patents
** Count: 16 patents
** Example: [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]]
** Example: [[20250118532. SYSTEM AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 7 patents
** Count: 16 patents
** Example: [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L21/31116|H01L21/31116]] (No explanation available)
* [[:Category:CPC_H01L21/31116|H01L21/31116]] ({by dry-etching})
** Count: 7 patents
** Count: 14 patents
** Example: [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
** Count: 7 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]


== Top Companies in Plasma Technology 2025 ==
== Top Companies in Plasma Technology 2025 ==
Line 42: Line 42:


=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 28
* Number of Plasma Technology patents: 73
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 8 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 16 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 8 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 15 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 7 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 14 patents
* Recent patents:
* Recent patents:
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
* Number of Plasma Technology patents: 16
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 7 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 6 patents
** [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
* Recent patents:
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
** [[20250112029. SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID (Applied Materials, Inc.)]] (20250403)
** [[20250112076. GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20250403)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 13
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 9 patents
** [[:Category:CPC_H01J37/32522|H01J37/32522]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32724|H01J37/32724]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
* Recent patents:
** [[20250087497. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250313)
** [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 7
* Number of Plasma Technology patents: 7
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/31116|H01L21/31116]] ({by dry-etching}): 3 patents
** [[:Category:CPC_H01J2237/327|H01J2237/327]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 3 patents
* Recent patents:
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
** [[20250149294. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250508)
** [[20250062131. PLASMA ETCHING IN SEMICONDUCTOR PROCESSING (Applied Materials, Inc.)]] (20250220)
** [[20250149313. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20250508)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 4
* Number of Plasma Technology patents: 6
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L29/66545|H01L29/66545]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (Plasma etching; Reactive-ion etching): 3 patents
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available): 2 patents
** [[:Category:CPC_H10D30/43|H10D30/43]] (No explanation available): 2 patents
** [[:Category:CPC_G03F1/82|G03F1/82]] (No explanation available): 1 patents
** [[:Category:CPC_H10D30/6735|H10D30/6735]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
* Number of Plasma Technology patents: 5
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 3 patents
** [[:Category:CPC_H01J37/32091|H01J37/32091]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J9/34|H01J9/34]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 1 patents
* Recent patents:
** [[20250140528. YTTRIA COATING FOR PLASMA PROCESSING CHAMBER COMPONENTS (Lam Research Corporation)]] (20250501)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 4
* Top CPC codes:
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J2237/2007|H01J2237/2007]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
* Recent patents:
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250146917. METHOD OF MEASURING PARAMETERS OF PLASMA, APPARATUS FOR MEASURING PARAMETERS OF PLASMA, PLASMA PROCESSING SYSTEM, AND METHOD OF PROCESSING WAFER (SAMSUNG ELECTRONICS CO., LTD.)]] (20250508)
** [[20250149301. PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE (SAMSUNG ELECTRONICS CO., LTD.)]] (20250508)
=== [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32917|H01J37/32917]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32834|H01J37/32834]] (No explanation available): 1 patents
** [[:Category:CPC_G01J5/0018|G01J5/0018]] (Radiation pyrometry, e.g. infrared or optical thermometry): 1 patents
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 1 patents
** [[:Category:CPC_H01J2237/24592|H01J2237/24592]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 1 patents
* Recent patents:
* Recent patents:
** [[20250069867. PLASMA PROCESSING APPARATUS AND GAS EXHAUST METHOD (Hitachi High-Tech Corporation)]] (20250227)
** [[20250118542. MEASUREMENT SYSTEM, MEASUREMENT METHOD, AND PLASMA PROCESSING DEVICE (TOKYO ELECTRON LIMITED)]] (20250410)
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250096020. SUBSTRATE PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20250320)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
** [[20250149342. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20250508)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
=== [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32697|H01J37/32697]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32761|H01J37/32761]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
* Recent patents:
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250079136. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250306)
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/2007|H01J2237/2007]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/202|H01J2237/202]] (No explanation available): 2 patents
* Recent patents:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (No explanation available): 1 patents
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (No explanation available): 1 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (No explanation available): 1 patents
* Recent patents:
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250014868. ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
=== [[:Category:Impinj, Inc.|Impinj, Inc.]] ===
* Number of Plasma Technology patents: 1
* Top CPC codes:
** [[:Category:CPC_H01L24/05|H01L24/05]] (No explanation available): 1 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (No explanation available): 1 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (No explanation available): 1 patents
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)


== New Companies in Plasma Technology (Last Month) ==
== New Companies in Plasma Technology (Last Month) ==
Line 144: Line 149:
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]


* [[:Category:CPC_H01L29/7851|H01L29/7851]] (No explanation available)
* [[:Category:CPC_H01L21/32051|H01L21/32051]] (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers  (manufacture of electrodes)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (No explanation available)
* [[:Category:CPC_H01J37/3288|H01J37/3288]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (No explanation available)
* [[:Category:CPC_H01L21/67259|H01L21/67259]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere  (processes per se)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_C23C28/042|C23C28/042]] (No explanation available)
* [[:Category:CPC_H05H1/26|H05H1/26]] (Plasma torches)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/46|C23C14/46]] (No explanation available)
* [[:Category:CPC_A61P35/00|A61P35/00]] (Antineoplastic agents)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/30|C23C14/30]] (No explanation available)
* [[:Category:CPC_A61K47/6913|A61K47/6913]] ({the liposome being modified on its surface by an antibody})
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/26|C23C14/26]] (No explanation available)
* [[:Category:CPC_A61K47/6851|A61K47/6851]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (No explanation available)
* [[:Category:CPC_A61K47/42|A61K47/42]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/083|C23C14/083]] (No explanation available)
* [[:Category:CPC_A61K39/3955|A61K39/3955]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_B01J19/087|B01J19/087]] (No explanation available)
* [[:Category:CPC_A61K35/13|A61K35/13]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES  (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]


== Top Companies in Emerging Plasma Technology Technologies 2025==
== Top Companies in Emerging Plasma Technology Technologies 2025==
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]


* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 6 patents
* [[:Category:Wisconsin Alumni Research Foundation|Wisconsin Alumni Research Foundation]]: 7 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 1 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]]: 1 patents


== Top Inventors in Plasma Technology ==
== Top Inventors in Plasma Technology ==
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]


=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
* Number of Plasma Technology patents: 6
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
* Recent patents:
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250149296. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250508)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Daisuke YOSHIKOSHI|Daisuke YOSHIKOSHI]] ===
* Number of Plasma Technology patents: 6
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
* Recent patents:
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Nozomu NAGASHIMA|Nozomu NAGASHIMA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Kunihiko YAMAGATA|Kunihiko YAMAGATA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
* Number of Plasma Technology patents: 4
* Number of Plasma Technology patents: 4
Line 194: Line 238:
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 4
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 4 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Lifu LI|Lifu LI]] ===
* Number of Plasma Technology patents: 4
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
** [[20250174434. PLASMA PROCESSING APPARATUS AND POWER SUPPLY SYSTEM (Tokyo Electron Limited)]] (20250529)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Yusuke SHIMIZU|Yusuke SHIMIZU]] ===
* Number of Plasma Technology patents: 4
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250069863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250227)
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
** [[20250149291. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:YUAN-CHI LEE|YUAN-CHI LEE]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:PIN-CHUN LIU|PIN-CHUN LIU]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:MING-CHAN TSAI|MING-CHAN TSAI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Alok Ranjan|Alok Ranjan of Austin TX (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Nathan STAFFORD|Nathan STAFFORD of Newark DE (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude|L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250166974. SULFUR-CONTAINING MOLECULES FOR HIGH ASPECT RATIO PLASMA ETCHING PROCESSES (L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude)]] (20250522)
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Takashi ARAMAKI|Takashi ARAMAKI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Kenichi KUWAHARA|Kenichi KUWAHARA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 1 patents
* Recent patents:
** [[20250095963. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250320)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
** [[20250104972. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Satoru NAKAMURA|Satoru NAKAMURA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Toshihisa OZU|Toshihisa OZU]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Naoki MATSUMOTO|Naoki MATSUMOTO]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104971. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Tomoaki HYODO|Tomoaki HYODO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
=== [[:Category:Shintaro NAKATANI|Shintaro NAKATANI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
=== [[:Category:Takamasa ICHINO|Takamasa ICHINO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
=== [[:Category:Yuki TANAKA|Yuki TANAKA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 245: Line 472:
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
=== [[:Category:Kazuhiro ISHIKAWA|Kazuhiro ISHIKAWA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 2 patents
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
** [[20250129465. COMPONENT FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS INCLUDING COMPONENT (KYOCERA Corporation)]] (20250424)
=== [[:Category:Mohd Fairuz BIN BUDIMAN|Mohd Fairuz BIN BUDIMAN]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250046573. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250206)
** [[20250157799. MONITORING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250515)
=== [[:Category:Nicolas J. BRIGHT|Nicolas J. BRIGHT of Arlington WA (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Shin YAMAGUCHI|Shin YAMAGUCHI]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250132136. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250424)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
** [[20250140535. SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20250501)
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 301: Line 549:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Alok Ranjan|Alok Ranjan of Austin TX (US)]] ===
=== [[:Category:Peter Ventzek|Peter Ventzek of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
Line 307: Line 555:
* Recent patents:
* Recent patents:
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 315: Line 563:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Nathan STAFFORD|Nathan STAFFORD of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Colin JENNINGS|Colin JENNINGS of Newark DE (US)]] ===
=== [[:Category:Colin JENNINGS|Colin JENNINGS of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 2
Line 331: Line 571:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Scott BILTEK|Scott BILTEK of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Phong NGUYEN|Phong NGUYEN of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Maolin Long|Maolin Long of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Mattson Technology, Inc.|Mattson Technology, Inc.]]: 1 patents
** [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]]: 1 patents
* Recent patents:
** [[20250062103. Cooled Shield for ICP Source (Mattson Technology, Inc.)]] (20250220)
** [[20250014935. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20250109)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Tuqiang NI|Tuqiang NI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
=== [[:Category:Zhihao WANG|Zhihao WANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
=== [[:Category:Kailin WANG|Kailin WANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
=== [[:Category:David Coumou|David Coumou of Webster NY (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:Zhi Wang|Zhi Wang of Sunnyvale CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:Tao Zhang|Tao Zhang of San Ramon CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:David Peterson|David Peterson of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:Mina T. FARAG|Mina T. FARAG of Cupertino CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:Terry BLUCK|Terry BLUCK of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
=== [[:Category:James GUZZO|James GUZZO]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
=== [[:Category:Harley K. HEINRICH|Harley K. HEINRICH of Seattle WA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
=== [[:Category:Christopher J. DIORIO|Christopher J. DIORIO of Shoreline WA (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
=== [[:Category:Janne Lehtinen|Janne Lehtinen]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Joonas Govenius|Joonas Govenius]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Jukka-Pekka Kaikkonen|Jukka-Pekka Kaikkonen]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
=== [[:Category:Chun-Fu YANG|Chun-Fu YANG]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Pei-Cheng HSU|Pei-Cheng HSU]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Ta-Cheng LIEN|Ta-Cheng LIEN]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Hsin-Chang LEE|Hsin-Chang LEE]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
** [[20250068060. METHOD OF FABRICATING AND SERVICING A PHOTOMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250227)
=== [[:Category:Shinji HIMORI|Shinji HIMORI]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069851. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Justin Moses|Justin Moses of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Chelsea DuBose|Chelsea DuBose of Austin TX (US)]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* Recent patents:
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:You Bong LIM|You Bong LIM]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)
=== [[:Category:Jun Young KIM|Jun Young KIM]] ===
* Number of Plasma Technology patents: 1
* Top companies:
** [[:Category:PLASMAPP CO., LTD.|PLASMAPP CO., LTD.]]: 1 patents
* Recent patents:
** [[20250069855. PACKAGING CONTAINER, PLASMA PROCESSING APPARATUS AND PROCESSING METHOD (PLASMAPP CO., LTD.)]] (20250227)


== Top Collaborations in Plasma Technology ==
== Top Collaborations in Plasma Technology ==
Line 531: Line 582:
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]


* Miyagi: 31 inventors
* Miyagi: 116 inventors
* Tokyo: 26 inventors
* Tokyo: 77 inventors
* Suwon-si: 19 inventors
* Suwon-si: 33 inventors
* Austin: 15 inventors
* San Jose: 20 inventors
* Austin: 18 inventors
* Yamanashi: 17 inventors
* Shanghai: 17 inventors
* Hsinchu: 15 inventors
* Hsinchu: 15 inventors
* San Jose: 14 inventors
* Taoyuan City: 13 inventors
* Newark: 8 inventors
* Daejeon: 12 inventors
* Shanghai: 7 inventors
* Kurokawa-gun: 12 inventors
* Sunnyvale: 7 inventors
* Beijing: 12 inventors
* OSAKA: 6 inventors
* Newark: 12 inventors
* Chigasaki-shi: 5 inventors
* Hwaseong-si: 12 inventors
* Taoyuan: 5 inventors
* Sunnyvale: 11 inventors
* Osaka: 5 inventors
* Fremont: 11 inventors
* Santa Clara: 4 inventors
* Cheonan-si: 10 inventors
* Hsinchu City: 4 inventors
* Albany: 9 inventors
* Fremont: 4 inventors
* Hsinchu City: 9 inventors
* New Taipei: 4 inventors
* Newport: 8 inventors
* Espoo: 3 inventors
* Daejeon: 3 inventors
* Kurokawa-gun: 3 inventors


[[Category:Plasma Technology]]
[[Category:Plasma Technology]]
[[Category:Patent Application Trends by Technology in 2025]]
[[Category:Patent Application Trends by Technology in 2025]]

Latest revision as of 05:30, 4 June 2025

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Top Technology Areas in Plasma Technology

Top CPC Codes

Top Companies in Plasma Technology 2025

Tokyo Electron Limited

Applied Materials, Inc.

Hitachi High-Tech Corporation

HITACHI HIGH-TECH CORPORATION

Taiwan Semiconductor Manufacturing Company, Ltd.

Lam Research Corporation

SAMSUNG ELECTRONICS CO., LTD.

TOKYO ELECTRON LIMITED

UVAT TECHNOLOGY CO.,LTD.

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA

New Companies in Plasma Technology (Last Month)

File:New Companies in Plasma Technology Last Month.png

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Top Companies in Emerging Plasma Technology Technologies 2025

Top Inventors in Plasma Technology

Chishio KOSHIMIZU

Daisuke YOSHIKOSHI

Nozomu NAGASHIMA

Kunihiko YAMAGATA

Taro IKEDA

Barton Lane of Austin TX (US)

Kartik RAMASWAMY of San Jose CA (US)

Lifu LI

Yusuke SHIMIZU

Takahiro SHINDO

YUAN-CHI LEE

PIN-CHUN LIU

MING-CHAN TSAI

Yue GUO of Redwood City CA (US)

Yang YANG of San Diego CA (US)

A N M Wasekul AZAD of Santa Clara CA (US)

Alok Ranjan of Austin TX (US)

Nathan STAFFORD of Newark DE (US)

Mitsunori Ohata

Takashi ARAMAKI

Kenichi KUWAHARA

Eiki KAMATA

Satoru NAKAMURA

Toshihisa OZU

Naoki MATSUMOTO

Masaki HIRAYAMA

Tomoaki HYODO

Shintaro NAKATANI

Takamasa ICHINO

Yuki TANAKA

Merritt Funk of Austin TX (US)

Chih-Teng LIAO

Jonghwa LEE

Jawon KO

Taijo JEON

Yunsong JEONG

Kazushi KANEKO

Kazuhiro ISHIKAWA

Mohd Fairuz BIN BUDIMAN

Nicolas J. BRIGHT of Arlington WA (US)

Shin YAMAGUCHI

Shogo OKITA

Takahiro MIYAI

Naoaki TAKEDA

Toshiyuki TAKASAKI

Hisao NAGAI

Seiya NAGANO

Peter Ventzek of Austin TX (US)

Tzu-Ging Lin

Colin JENNINGS of Newark DE (US)

Top Collaborations in Plasma Technology

Top US States for Plasma Technology Inventors


Top Cities for Plasma Technology Inventors

  • Miyagi: 116 inventors
  • Tokyo: 77 inventors
  • Suwon-si: 33 inventors
  • San Jose: 20 inventors
  • Austin: 18 inventors
  • Yamanashi: 17 inventors
  • Shanghai: 17 inventors
  • Hsinchu: 15 inventors
  • Taoyuan City: 13 inventors
  • Daejeon: 12 inventors
  • Kurokawa-gun: 12 inventors
  • Beijing: 12 inventors
  • Newark: 12 inventors
  • Hwaseong-si: 12 inventors
  • Sunnyvale: 11 inventors
  • Fremont: 11 inventors
  • Cheonan-si: 10 inventors
  • Albany: 9 inventors
  • Hsinchu City: 9 inventors
  • Newport: 8 inventors
Retrieved from "https://wikipatents.org/index.php?title=Plasma_Technology_Patent_Application_Trends_2025&oldid=615084"

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