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== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2025 ==
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_May 2025.png|border|800px]]


== Top Technology Areas in Plasma Technology ==
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_January 2025.png|border|800px]]
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_May 2025.png|border|800px]]


=== Top CPC Codes ===
=== Top CPC Codes ===
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps)
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps)
** Count: 10 patents
** Count: 51 patents
** Example: [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]]
** Example: [[20250118537. PLASMA PROCESSING APPARATUS AND HEATING APPARATUS (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits})
** Count: 9 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 9 patents
** Count: 28 patents
** Example: [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 8 patents
** Count: 26 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 6 patents
** Count: 24 patents
** Example: [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250115522. JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES (Lam Research Corporation)]]
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 5 patents
** Count: 22 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250115522. JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES (Lam Research Corporation)]]
* [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits})
** Count: 20 patents
** Example: [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]]
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 5 patents
** Count: 19 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
** Example: [[20250118532. SYSTEM AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01L21/3065|H01L21/3065]] (Plasma etching; Reactive-ion etching)
** Count: 4 patents
** Count: 16 patents
** Example: [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]]
** Example: [[20250118532. SYSTEM AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 4 patents
** Count: 16 patents
** Example: [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]]
** Example: [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L21/6833|H01L21/6833]] (for supporting or gripping  (for conveying)
* [[:Category:CPC_H01L21/31116|H01L21/31116]] ({by dry-etching})
** Count: 4 patents
** Count: 14 patents
** Example: [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
** Example: [[20250118566. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]]


== Top Companies in Plasma Technology 2025 ==
== Top Companies in Plasma Technology 2025 ==
Line 42: Line 42:


=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 19
* Number of Plasma Technology patents: 73
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (Gas-filled discharge tubes (heating by discharge): 5 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 16 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 5 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 15 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 14 patents
* Recent patents:
* Recent patents:
** [[20250014866. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250109)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
** [[20250014874. ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
* Number of Plasma Technology patents: 5
* Number of Plasma Technology patents: 16
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 2 patents
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 7 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 6 patents
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/321|H01J37/321]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250112029. SUPPRESSING HEATING OF A PLASMA PROCESSING CHAMBER LID (Applied Materials, Inc.)]] (20250403)
** [[20250022697. PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY (Applied Materials, Inc.)]] (20250116)
** [[20250112076. GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20250403)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 13
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01J37/32522|H01J37/32522]] (Gas-filled discharge tubes (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 9 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32522|H01J37/32522]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32201|H01J37/32201]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32724|H01J37/32724]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
* Recent patents:
* Recent patents:
** [[20250046580. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250206)
** [[20250087497. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250313)
** [[20250046582. REGENERATING METHOD FOR INNER MEMBER OF PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250206)
** [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 7
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L21/32136|H01L21/32136]] ({using plasmas}): 1 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 4 patents
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01L21/31116|H01L21/31116]] ({by dry-etching}): 3 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 3 patents
* Recent patents:
* Recent patents:
** [[20250046620. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250206)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
** [[20250149294. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20250508)
* Number of Plasma Technology patents: 2
** [[20250149313. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20250508)
* Top CPC codes:
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
** [[:Category:CPC_H01J37/3299|H01J37/3299]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 6
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (Plasma etching; Reactive-ion etching): 3 patents
** [[:Category:CPC_H01L21/30655|H01L21/30655]] (Plasma etching; Reactive-ion etching): 1 patents
** [[:Category:CPC_H10D30/43|H10D30/43]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/76232|H01L21/76232]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
** [[:Category:CPC_H10D30/6735|H10D30/6735]] (No explanation available): 2 patents
* Recent patents:
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
=== [[:Category:Research & Business Foundation SUNGKYUNKWAN UNIVERSITY|Research & Business Foundation SUNGKYUNKWAN UNIVERSITY]] ===
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 5
* Top CPC codes:
** [[:Category:CPC_H01J37/32183|H01J37/32183]] ({Matching circuits}): 3 patents
** [[:Category:CPC_H01J37/32091|H01J37/32091]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J9/34|H01J9/34]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 1 patents
* Recent patents:
** [[20250140528. YTTRIA COATING FOR PLASMA PROCESSING CHAMBER COMPONENTS (Lam Research Corporation)]] (20250501)
** [[20250087458. TUNING VOLTAGE SETPOINT IN A PULSED RF SIGNAL FOR A TUNABLE EDGE SHEATH SYSTEM (Lam Research Corporation)]] (20250313)
** [[20250054730. Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System (Lam Research Corporation)]] (20250213)
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 4
* Top CPC codes:
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01J2237/2007|H01J2237/2007]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS  (spark-gaps): 2 patents
* Recent patents:
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
** [[20250146917. METHOD OF MEASURING PARAMETERS OF PLASMA, APPARATUS FOR MEASURING PARAMETERS OF PLASMA, PLASMA PROCESSING SYSTEM, AND METHOD OF PROCESSING WAFER (SAMSUNG ELECTRONICS CO., LTD.)]] (20250508)
** [[20250149301. PLASMA PROCESSING APPARATUS INCLUDING GAS DISTRIBUTION PLATE (SAMSUNG ELECTRONICS CO., LTD.)]] (20250508)
=== [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] ===
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_A61K9/1271|A61K9/1271]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms): 1 patents
** [[:Category:CPC_H01J37/32917|H01J37/32917]] (Gas-filled discharge tubes (heating by discharge): 1 patents
** [[:Category:CPC_B01J19/087|B01J19/087]] (Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor  (application of shock waves): 1 patents
** [[:Category:CPC_G01J5/0018|G01J5/0018]] (Radiation pyrometry, e.g. infrared or optical thermometry): 1 patents
** [[:Category:CPC_H01J37/32422|H01J37/32422]] (Gas-filled discharge tubes (heating by discharge): 1 patents
** [[:Category:CPC_H01J2237/24592|H01J2237/24592]] (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
* Recent patents:
* Recent patents:
** [[20250009661. PLASMA COATING METHOD OF NANOVESICLE SURFACE AND PLASMA JET DEVICE FOR PLASMA COATING OF NANOVESICLE SURFACE (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250118542. MEASUREMENT SYSTEM, MEASUREMENT METHOD, AND PLASMA PROCESSING DEVICE (TOKYO ELECTRON LIMITED)]] (20250410)
** [[20250014868. ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER (Research & Business Foundation SUNGKYUNKWAN UNIVERSITY)]] (20250109)
** [[20250096020. SUBSTRATE PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20250320)
=== [[:Category:Impinj, Inc.|Impinj, Inc.]] ===
** [[20250149342. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20250508)
* Number of Plasma Technology patents: 1
=== [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]] ===
* Number of Plasma Technology patents: 3
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_G06K19/07722|G06K19/07722]] (Constructional details, e.g. mounting of circuits in the carrier): 1 patents
** [[:Category:CPC_H01J37/32761|H01J37/32761]] (Gas-filled discharge tubes  (heating by discharge): 2 patents
** [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]] ===
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
* Number of Plasma Technology patents: 1
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]] ===
* Number of Plasma Technology patents: 2
* Top CPC codes:
* Top CPC codes:
** [[:Category:CPC_H10N60/0912|H10N60/0912]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32082|H01J37/32082]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H10N60/12|H10N60/12]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
** [[:Category:CPC_H10N60/85|H10N60/85]] (No explanation available): 1 patents
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (Gas-filled discharge tubes  (heating by discharge): 1 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250109)


== New Companies in Plasma Technology (Last Month) ==
== New Companies in Plasma Technology (Last Month) ==
Line 140: Line 149:
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]


* [[:Category:CPC_H01L29/7851|H01L29/7851]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01L21/32051|H01L21/32051]] (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers  (manufacture of electrodes)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
* [[:Category:CPC_H01J37/3288|H01J37/3288]] (Gas-filled discharge tubes  (heating by discharge)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]]
** Example: [[20250104981. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]]
* [[:Category:CPC_H01J37/32981|H01J37/32981]] (Gas-filled discharge tubes (heating by discharge)
* [[:Category:CPC_H01L21/67259|H01L21/67259]] (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]]
* [[:Category:CPC_H01J37/32926|H01J37/32926]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_H05H1/26|H05H1/26]] (Plasma torches)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_H01J37/32165|H01J37/32165]] (Gas-filled discharge tubes  (heating by discharge)
* [[:Category:CPC_A61P35/00|A61P35/00]] (Antineoplastic agents)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C28/042|C23C28/042]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL  (making metal-coated products by extrusion)
* [[:Category:CPC_A61K47/6913|A61K47/6913]] ({the liposome being modified on its surface by an antibody})
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/46|C23C14/46]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
* [[:Category:CPC_A61K47/6851|A61K47/6851]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/30|C23C14/30]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
* [[:Category:CPC_A61K47/42|A61K47/42]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/26|C23C14/26]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
* [[:Category:CPC_A61K39/3955|A61K39/3955]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]
* [[:Category:CPC_C23C14/0694|C23C14/0694]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
* [[:Category:CPC_A61K35/13|A61K35/13]] (PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES (devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms)
** Count: 1 patents
** Count: 1 patents
** Example: [[20250011917. METHOD AND APPARATUS FOR FORMING A PLASMA RESISTANT COATING, COMPONENT, AND PLASMA PROCESSING APPARATUS (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]]
** Example: [[20250099391. Compositions and Methods for Treating Cancer (Wisconsin Alumni Research Foundation)]]


== Top Companies in Emerging Plasma Technology Technologies 2025==
== Top Companies in Emerging Plasma Technology Technologies 2025==
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]
[[File:Top_Companies_in_Emerging_Plasma_Technology_Technologies.png|border|800px]]


* [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 5 patents
* [[:Category:Wisconsin Alumni Research Foundation|Wisconsin Alumni Research Foundation]]: 7 patents
* [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents


Line 182: Line 190:
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]


=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
* Number of Plasma Technology patents: 3
* Number of Plasma Technology patents: 6
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
* Recent patents:
* Recent patents:
** [[20250037977. APPARATUS AND METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250130)
** [[20250062101. CONTROL METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250220)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
** [[20250149296. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250508)
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
** [[20250014872. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
=== [[:Category:Daisuke YOSHIKOSHI|Daisuke YOSHIKOSHI]] ===
* Number of Plasma Technology patents: 2
* Number of Plasma Technology patents: 6
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 2
=== [[:Category:Nozomu NAGASHIMA|Nozomu NAGASHIMA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 2
=== [[:Category:Kunihiko YAMAGATA|Kunihiko YAMAGATA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250149298. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250149307. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Takahiro MIYAI|Takahiro MIYAI]] ===
** [[20250149308. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 2
=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
* Number of Plasma Technology patents: 5
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250104974. Plasma Processing Device (Tokyo Electron Limited)]] (20250327)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250104975. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Naoaki TAKEDA|Naoaki TAKEDA]] ===
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 2
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250022688. PLASMA PROCESSING METHOD AND APPARATUS (Tokyo Electron Limited)]] (20250116)
=== [[:Category:Toshiyuki TAKASAKI|Toshiyuki TAKASAKI]] ===
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
* Number of Plasma Technology patents: 2
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
=== [[:Category:Hisao NAGAI|Hisao NAGAI]] ===
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
* Number of Plasma Technology patents: 2
=== [[:Category:Lifu LI|Lifu LI]] ===
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250174434. PLASMA PROCESSING APPARATUS AND POWER SUPPLY SYSTEM (Tokyo Electron Limited)]] (20250529)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
=== [[:Category:Seiya NAGANO|Seiya NAGANO]] ===
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 2
=== [[:Category:Yusuke SHIMIZU|Yusuke SHIMIZU]] ===
* Number of Plasma Technology patents: 4
* Top companies:
* Top companies:
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
* Recent patents:
* Recent patents:
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 2
=== [[:Category:Takahiro SHINDO|Takahiro SHINDO]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
** [[20250046575. Plasma Processing Device (Tokyo Electron Limited)]] (20250206)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
** [[20250149291. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 2
=== [[:Category:YUAN-CHI LEE|YUAN-CHI LEE]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:Tuqiang NI|Tuqiang NI]] ===
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
* Number of Plasma Technology patents: 1
=== [[:Category:PIN-CHUN LIU|PIN-CHUN LIU]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:Zhihao WANG|Zhihao WANG]] ===
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
* Number of Plasma Technology patents: 1
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:MING-CHAN TSAI|MING-CHAN TSAI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
=== [[:Category:Kailin WANG|Kailin WANG]] ===
** [[20250125121. TWO-ELECTRODE CONTINUOUS PLASMA PROCESSING SYSTEM (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
* Number of Plasma Technology patents: 1
** [[20250125127. CONTINUOUS PLASMA PROCESSING SYSTEM WITH ADJUSTABLE ELECTRODE (UVAT TECHNOLOGY CO.,LTD.)]] (20250417)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA|ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA]]: 1 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037971. PLASMA PROCESSING DEVICE (ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA)]] (20250130)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:David Coumou|David Coumou of Webster NY (US)]] ===
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
* Number of Plasma Technology patents: 1
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Zhi Wang|Zhi Wang of Sunnyvale CA (US)]] ===
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
* Number of Plasma Technology patents: 1
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Tao Zhang|Tao Zhang of San Ramon CA (US)]] ===
** [[20250140541. REAL-TIME PLASMA MEASUREMENT AND CONTROL (Applied Materials, Inc.)]] (20250501)
* Number of Plasma Technology patents: 1
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
=== [[:Category:Alok Ranjan|Alok Ranjan of Austin TX (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
=== [[:Category:David Peterson|David Peterson of San Jose CA (US)]] ===
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
* Number of Plasma Technology patents: 1
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Nathan STAFFORD|Nathan STAFFORD of Newark DE (US)]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude|L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250037973. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (Applied Materials, Inc.)]] (20250130)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
=== [[:Category:Mina T. FARAG|Mina T. FARAG of Cupertino CA (US)]] ===
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
* Number of Plasma Technology patents: 1
** [[20250166974. SULFUR-CONTAINING MOLECULES FOR HIGH ASPECT RATIO PLASMA ETCHING PROCESSES (L'Air Liquide, Societe Anonyme pour l'Etude et l’Exploitation des Procedes Georges Claude)]] (20250522)
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250079128. PROCESSING SUBSTRATES WITH PLASMA MODULATED BY DC MAGNETIC FIELDS (Tokyo Electron Limited)]] (20250306)
=== [[:Category:Terry BLUCK|Terry BLUCK of Santa Clara CA (US)]] ===
** [[20250079178. REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL (Tokyo Electron Limited)]] (20250306)
* Number of Plasma Technology patents: 1
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Takashi ARAMAKI|Takashi ARAMAKI]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250037979. RESILIENT RELEASE LAYER FOR LITHIUM FILM TRANSFER AND ATMOSPHERIC PLASMA ASSISTED REMOVAL OF RESIDUAL RELEASE LAYER (Applied Materials, Inc.)]] (20250130)
** [[20250079138. SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING (Tokyo Electron Limited)]] (20250306)
=== [[:Category:James GUZZO|James GUZZO]] ===
** [[20250112031. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD (Tokyo Electron Limited)]] (20250403)
* Number of Plasma Technology patents: 1
** [[20250104979. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Kenichi KUWAHARA|Kenichi KUWAHARA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
** [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250095963. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250320)
=== [[:Category:Harley K. HEINRICH|Harley K. HEINRICH of Seattle WA (US)]] ===
** [[20250029818. PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE (HITACHI HIGH-TECH CORPORATION)]] (20250123)
* Number of Plasma Technology patents: 1
** [[20250105020. PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20250327)
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
=== [[:Category:Christopher J. DIORIO|Christopher J. DIORIO of Shoreline WA (US)]] ===
** [[20250104972. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
* Number of Plasma Technology patents: 1
** [[20250104977. Plasma Source and Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Satoru NAKAMURA|Satoru NAKAMURA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Impinj, Inc.|Impinj, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250038139. ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT (Impinj, Inc.)]] (20250130)
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
=== [[:Category:Janne Lehtinen|Janne Lehtinen]] ===
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 1
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Toshihisa OZU|Toshihisa OZU]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
=== [[:Category:Joonas Govenius|Joonas Govenius]] ===
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 1
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Naoki MATSUMOTO|Naoki MATSUMOTO]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250166980. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250522)
=== [[:Category:Jukka-Pekka Kaikkonen|Jukka-Pekka Kaikkonen]] ===
** [[20250149315. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 1
** [[20250149316. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250508)
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
* Number of Plasma Technology patents: 3
* Top companies:
* Top companies:
** [[:Category:Teknologian tutkimuskeskus VTT Oy|Teknologian tutkimuskeskus VTT Oy]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
* Recent patents:
* Recent patents:
** [[20250040449. Superconducting device (Teknologian tutkimuskeskus VTT Oy)]] (20250130)
** [[20250014863. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
=== [[:Category:Taro HAYAKAWA|Taro HAYAKAWA]] ===
** [[20250014864. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250109)
* Number of Plasma Technology patents: 1
** [[20250104971. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250327)
=== [[:Category:Tomoaki HYODO|Tomoaki HYODO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006461. Plasma Processing Apparatus (Tokyo Electron Limited)]] (20250102)
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
* Number of Plasma Technology patents: 1
=== [[:Category:Shintaro NAKATANI|Shintaro NAKATANI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
=== [[:Category:Yohei ISHIDA|Yohei ISHIDA]] ===
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
* Number of Plasma Technology patents: 1
=== [[:Category:Takamasa ICHINO|Takamasa ICHINO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
=== [[:Category:Yang YANG|Yang YANG of Cupertino CA (US)]] ===
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
* Number of Plasma Technology patents: 1
=== [[:Category:Yuki TANAKA|Yuki TANAKA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250118541. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250410)
=== [[:Category:Fernando SILVEIRA|Fernando SILVEIRA of Livermore CA (US)]] ===
** [[20250140532. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20250501)
* Number of Plasma Technology patents: 1
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250069852. METHOD FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250227)
=== [[:Category:Imad YOUSIF|Imad YOUSIF of San Jose CA (US)]] ===
** [[20250014865. APPARATUS FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Chih-Teng LIAO|Chih-Teng LIAO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250006465. Remote Plasma Source and Plasma Processing Chamber Having Same (Applied Materials, Inc.)]] (20250102)
** [[20250069860. PLASMA PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]] (20250227)
=== [[:Category:Motohiro UMEHARA|Motohiro UMEHARA]] ===
** [[20250079177. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250306)
* Number of Plasma Technology patents: 1
=== [[:Category:Jonghwa LEE|Jonghwa LEE]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Wataru FUJITA|Wataru FUJITA]] ===
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
* Number of Plasma Technology patents: 1
=== [[:Category:Jawon KO|Jawon KO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Kazuhiro ISHIKAWA|Kazuhiro ISHIKAWA]] ===
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
* Number of Plasma Technology patents: 1
=== [[:Category:Taijo JEON|Taijo JEON]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 1 patents
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Takamichi KIKUCHI|Takamichi KIKUCHI]] ===
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
* Number of Plasma Technology patents: 1
=== [[:Category:Yunsong JEONG|Yunsong JEONG]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006471. NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250069869. PLASMA ANALYZER, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
=== [[:Category:Yuki ONODERA|Yuki ONODERA]] ===
** [[20250069871. SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]] (20250227)
* Number of Plasma Technology patents: 1
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250006464. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20250102)
=== [[:Category:Takamitsu TAKAYAMA|Takamitsu TAKAYAMA]] ===
** [[20250095973. Plasma Processing Apparatus and Method for Measuring Resonance Frequency (Tokyo Electron Limited)]] (20250320)
* Number of Plasma Technology patents: 1
=== [[:Category:Kazuhiro ISHIKAWA|Kazuhiro ISHIKAWA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:KYOCERA Corporation|KYOCERA Corporation]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006473. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250006468. PLASMA-RESISTANT LAMINATE, MANUFACTURING METHOD THEREFOR, AND PLASMA PROCESSING APPARATUS (KYOCERA Corporation)]] (20250102)
=== [[:Category:Noriiki MASUDA|Noriiki MASUDA]] ===
** [[20250129465. COMPONENT FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS INCLUDING COMPONENT (KYOCERA Corporation)]] (20250424)
* Number of Plasma Technology patents: 1
=== [[:Category:Mohd Fairuz BIN BUDIMAN|Mohd Fairuz BIN BUDIMAN]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006516. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250102)
** [[20250046573. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250206)
=== [[:Category:Adam S. BEACHEY|Adam S. BEACHEY]] ===
** [[20250157799. MONITORING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250515)
* Number of Plasma Technology patents: 1
=== [[:Category:Nicolas J. BRIGHT|Nicolas J. BRIGHT of Arlington WA (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:SPTS Technologies Limited|SPTS Technologies Limited]]: 1 patents
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250006537. Plasma Etching Method and Apparatus (SPTS Technologies Limited)]] (20250102)
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
=== [[:Category:Jhih-Yan HE|Jhih-Yan HE]] ===
** [[20250087462. RADIO-FREQUENCY (RF) MATCHING NETWORK AND TUNING TECHNIQUE (Applied Materials, Inc.)]] (20250313)
* Number of Plasma Technology patents: 1
=== [[:Category:Shin YAMAGUCHI|Shin YAMAGUCHI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
** [[20250132136. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20250424)
=== [[:Category:Li-Chun CHANG|Li-Chun CHANG]] ===
** [[20250140535. SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20250501)
* Number of Plasma Technology patents: 1
=== [[:Category:Shogo OKITA|Shogo OKITA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:Jyh-Wei LEE|Jyh-Wei LEE]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Takahiro MIYAI|Takahiro MIYAI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:Ming-Hung CHEN|Ming-Hung CHEN]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Naoaki TAKEDA|Naoaki TAKEDA]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Ming Chi University of Technology|Ming Chi University of Technology]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250008635. CONTROL CIRCUIT OF ATMOSPHERIC PLASMA GENERATING DEVICE AND ATMOSPHERIC PLASMA GENERATING SYSTEM (Ming Chi University of Technology)]] (20250102)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:Mohd Fairuz BIN BUDIMAN|Mohd Fairuz BIN BUDIMAN]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Toshiyuki TAKASAKI|Toshiyuki TAKASAKI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250046573. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20250206)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:YUAN-CHI LEE|YUAN-CHI LEE]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Hisao NAGAI|Hisao NAGAI]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:PIN-CHUN LIU|PIN-CHUN LIU]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Seiya NAGANO|Seiya NAGANO]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
** [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250022682. PLASMA PROCESSING APPARATUS (Panasonic Intellectual Property Management Co., Ltd.)]] (20250116)
=== [[:Category:MING-CHAN TSAI|MING-CHAN TSAI]] ===
** [[20250014877. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Panasonic Intellectual Property Management Co., Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Peter Ventzek|Peter Ventzek of Austin TX (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:UVAT TECHNOLOGY CO.,LTD.|UVAT TECHNOLOGY CO.,LTD.]]: 1 patents
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250046574. CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING (UVAT TECHNOLOGY CO.,LTD.)]] (20250206)
** [[20250022689. GAS CLUSTER ASSISTED PLASMA PROCESSING (Tokyo Electron Limited)]] (20250116)
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
** [[20250149295. SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING (Tokyo Electron Limited)]] (20250508)
* Number of Plasma Technology patents: 1
=== [[:Category:Tzu-Ging Lin|Tzu-Ging Lin]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 2 patents
* Recent patents:
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250022715. PLASMA ETCHING PROCESSES (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250116)
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
** [[20250015166. SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20250109)
* Number of Plasma Technology patents: 1
=== [[:Category:Colin JENNINGS|Colin JENNINGS of Newark DE (US)]] ===
* Number of Plasma Technology patents: 2
* Top companies:
* Top companies:
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
** [[:Category:L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude|L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude]]: 1 patents
* Recent patents:
* Recent patents:
** [[20250046576. PLASMA PROCESSING ASSEMBLY FOR RF AND PVT INTEGRATION (Applied Materials, Inc.)]] (20250206)
** [[20250079127. DIELECTRIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour L'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)
** [[20250079183. CRYOGENIC PLASMA ETCHING USING C2H2F2 (L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude)]] (20250306)


== Top Collaborations in Plasma Technology ==
== Top Collaborations in Plasma Technology ==
Line 505: Line 582:
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]


* Tokyo: 16 inventors
* Miyagi: 116 inventors
* Miyagi: 12 inventors
* Tokyo: 77 inventors
* Suwon-si: 11 inventors
* Suwon-si: 33 inventors
* San Jose: 8 inventors
* San Jose: 20 inventors
* Shanghai: 7 inventors
* Austin: 18 inventors
* Austin: 6 inventors
* Yamanashi: 17 inventors
* OSAKA: 6 inventors
* Shanghai: 17 inventors
* Taoyuan: 5 inventors
* Hsinchu: 15 inventors
* Hsinchu: 5 inventors
* Taoyuan City: 13 inventors
* Osaka: 5 inventors
* Daejeon: 12 inventors
* New Taipei: 4 inventors
* Kurokawa-gun: 12 inventors
* Santa Clara: 3 inventors
* Beijing: 12 inventors
* Espoo: 3 inventors
* Newark: 12 inventors
* Taoyuan City: 3 inventors
* Hwaseong-si: 12 inventors
* Fort Collins: 3 inventors
* Sunnyvale: 11 inventors
* Longmont: 3 inventors
* Fremont: 11 inventors
* Sunnyvale: 2 inventors
* Cheonan-si: 10 inventors
* Cupertino: 2 inventors
* Albany: 9 inventors
* Taipei: 2 inventors
* Hsinchu City: 9 inventors
* Kaohsiung: 2 inventors
* Newport: 8 inventors


[[Category:Plasma Technology]]
[[Category:Plasma Technology]]
[[Category:Patent Application Trends by Technology in 2025]]
[[Category:Patent Application Trends by Technology in 2025]]

Latest revision as of 05:30, 4 June 2025

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Top Technology Areas in Plasma Technology

Top CPC Codes

Top Companies in Plasma Technology 2025

Tokyo Electron Limited

Applied Materials, Inc.

Hitachi High-Tech Corporation

HITACHI HIGH-TECH CORPORATION

Taiwan Semiconductor Manufacturing Company, Ltd.

Lam Research Corporation

SAMSUNG ELECTRONICS CO., LTD.

TOKYO ELECTRON LIMITED

UVAT TECHNOLOGY CO.,LTD.

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA

New Companies in Plasma Technology (Last Month)

File:New Companies in Plasma Technology Last Month.png

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Top Companies in Emerging Plasma Technology Technologies 2025

Top Inventors in Plasma Technology

Chishio KOSHIMIZU

Daisuke YOSHIKOSHI

Nozomu NAGASHIMA

Kunihiko YAMAGATA

Taro IKEDA

Barton Lane of Austin TX (US)

Kartik RAMASWAMY of San Jose CA (US)

Lifu LI

Yusuke SHIMIZU

Takahiro SHINDO

YUAN-CHI LEE

PIN-CHUN LIU

MING-CHAN TSAI

Yue GUO of Redwood City CA (US)

Yang YANG of San Diego CA (US)

A N M Wasekul AZAD of Santa Clara CA (US)

Alok Ranjan of Austin TX (US)

Nathan STAFFORD of Newark DE (US)

Mitsunori Ohata

Takashi ARAMAKI

Kenichi KUWAHARA

Eiki KAMATA

Satoru NAKAMURA

Toshihisa OZU

Naoki MATSUMOTO

Masaki HIRAYAMA

Tomoaki HYODO

Shintaro NAKATANI

Takamasa ICHINO

Yuki TANAKA

Merritt Funk of Austin TX (US)

Chih-Teng LIAO

Jonghwa LEE

Jawon KO

Taijo JEON

Yunsong JEONG

Kazushi KANEKO

Kazuhiro ISHIKAWA

Mohd Fairuz BIN BUDIMAN

Nicolas J. BRIGHT of Arlington WA (US)

Shin YAMAGUCHI

Shogo OKITA

Takahiro MIYAI

Naoaki TAKEDA

Toshiyuki TAKASAKI

Hisao NAGAI

Seiya NAGANO

Peter Ventzek of Austin TX (US)

Tzu-Ging Lin

Colin JENNINGS of Newark DE (US)

Top Collaborations in Plasma Technology

Top US States for Plasma Technology Inventors


Top Cities for Plasma Technology Inventors

  • Miyagi: 116 inventors
  • Tokyo: 77 inventors
  • Suwon-si: 33 inventors
  • San Jose: 20 inventors
  • Austin: 18 inventors
  • Yamanashi: 17 inventors
  • Shanghai: 17 inventors
  • Hsinchu: 15 inventors
  • Taoyuan City: 13 inventors
  • Daejeon: 12 inventors
  • Kurokawa-gun: 12 inventors
  • Beijing: 12 inventors
  • Newark: 12 inventors
  • Hwaseong-si: 12 inventors
  • Sunnyvale: 11 inventors
  • Fremont: 11 inventors
  • Cheonan-si: 10 inventors
  • Albany: 9 inventors
  • Hsinchu City: 9 inventors
  • Newport: 8 inventors
Retrieved from "https://wikipatents.org/index.php?title=Plasma_Technology_Patent_Application_Trends_2025&oldid=615084"

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