Difference between revisions of "Plasma Technology Patent Application Trends 2024"

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== Plasma Technology Patent Application Filing Activity ==
 
== Plasma Technology Patent Application Filing Activity ==
== Plasma Technology patent applications in 2024 ==
+
== Plasma Technology patent applications in 2025 ==
[[File:Plasma_Technology_Monthly_Patent_Applications_2024_-_Up_to_November 2024.png|border|800px]]
+
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_ 2025.png|border|800px]]
  
 
== Top Technology Areas in Plasma Technology ==
 
== Top Technology Areas in Plasma Technology ==
[[File:Top_Technology_Areas_in_Plasma_Technology_2024_-_Up_to_November 2024.png|border|800px]]
+
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_ 2025.png|border|800px]]
  
 
=== Top CPC Codes ===
 
=== Top CPC Codes ===
 
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
 
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
** Count: 78 patents
+
** Count: 83 patents
 
** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
 
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
Line 14: Line 14:
 
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
 
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
 
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
** Count: 48 patents
+
** Count: 50 patents
 
** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
 
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
** Count: 45 patents
+
** Count: 46 patents
 
** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available)
 
* [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available)
** Count: 39 patents
+
** Count: 42 patents
 
** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)]]
 
** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)]]
 
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
 
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
** Count: 36 patents
+
** Count: 38 patents
 
** Example: [[20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]]
 
** Example: [[20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]]
 
* [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available)
 
* [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available)
Line 32: Line 32:
 
** Example: [[20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
** Example: [[20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
 
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
 +
** Count: 34 patents
 +
** Example: [[20240429027. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 +
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
 
** Count: 33 patents
 
** Count: 33 patents
** Example: [[20240258070. PLASMA UNIFORMITY CONTROL SYSTEM AND METHODS (Applied Materials, Inc.)]]
 
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
 
** Count: 31 patents
 
 
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
 
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
  
Line 42: Line 42:
  
 
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
 
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
* Number of Plasma Technology patents: 162
+
* Number of Plasma Technology patents: 167
 
* Top CPC codes:
 
* Top CPC codes:
 +
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 40 patents
 
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 39 patents
 
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 39 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 38 patents
+
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 29 patents
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 28 patents
 
 
* Recent patents:
 
* Recent patents:
 
** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208)
 
** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208)
Line 62: Line 62:
 
** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240208)
 
** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240208)
 
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
 
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
* Number of Plasma Technology patents: 21
+
* Number of Plasma Technology patents: 22
 
* Top CPC codes:
 
* Top CPC codes:
 
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 7 patents
 
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 7 patents
Line 102: Line 102:
 
** [[20240331974. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20241003)
 
** [[20240331974. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20241003)
 
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
 
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
* Number of Plasma Technology patents: 7
+
* Number of Plasma Technology patents: 8
 
* Top CPC codes:
 
* Top CPC codes:
 +
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 4 patents
 
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents
+
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 3 patents
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents
 
 
* Recent patents:
 
* Recent patents:
 
** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240627)
 
** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240627)
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** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING (Advanced Energy Industries, Inc.)]] (20240613)
 
** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING (Advanced Energy Industries, Inc.)]] (20240613)
 
** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH (Advanced Energy Industries, Inc.)]] (20240125)
 
** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH (Advanced Energy Industries, Inc.)]] (20240125)
=== [[:Category:Beijing E-Town Semiconductor Technology Co., Ltd.|Beijing E-Town Semiconductor Technology Co., Ltd.]] ===
+
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
 
* Number of Plasma Technology patents: 6
 
* Number of Plasma Technology patents: 6
 
* Top CPC codes:
 
* Top CPC codes:
** [[:Category:CPC_H01J37/32119|H01J37/32119]] (No explanation available): 3 patents
+
** [[:Category:CPC_H01L21/32136|H01L21/32136]] (No explanation available): 2 patents
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01L21/0337|H01L21/0337]] (No explanation available): 2 patents
** [[:Category:CPC_H01L21/6833|H01L21/6833]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01L29/66795|H01L29/66795]] (No explanation available): 2 patents
 
* Recent patents:
 
* Recent patents:
** [[20240055242. Workpiece Processing Apparatus with Thermal Processing Systems (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240215)
+
** [[20240404860. PLASMA PROCESSING APPARATUS AND METHOD (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20241205)
** [[20240096680. ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240321)
+
** [[20240168371. SELECTIVE HARDMASK ON HARDMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20240523)
** [[20240071754. Enhanced Ignition in Inductively Coupled Plasmas For Workpiece Processing (Beijing E-Town Semiconductor Technology Co., Ltd.)]] (20240229)
+
** [[20240363450. METHOD OF DETECTING PHOTORESIST SCUM, METHOD OF FORMING SEMICONDUCTOR PACKAGE AND PHOTORESIST SCUM DETECTION APPARATUS (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20241031)
  
 
== New Companies in Plasma Technology (Last Month) ==
 
== New Companies in Plasma Technology (Last Month) ==
Line 209: Line 209:
 
** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509)
 
** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509)
 
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
 +
* Number of Plasma Technology patents: 11
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 11 patents
 +
* Recent patents:
 +
** [[20240112895. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240404)
 +
** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314)
 +
** [[20240331978. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20241003)
 
=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
 
=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
* Number of Plasma Technology patents: 10
+
* Number of Plasma Technology patents: 11
 
* Top companies:
 
* Top companies:
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents
+
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 9 patents
 
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
 
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
 
* Recent patents:
 
* Recent patents:
Line 218: Line 226:
 
** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201)
 
** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201)
 
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
 
* Number of Plasma Technology patents: 10
 
* Top companies:
 
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 10 patents
 
* Recent patents:
 
** [[20240112895. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240404)
 
** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314)
 
** [[20240331978. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20241003)
 
 
=== [[:Category:Sergey Voronin|Sergey Voronin of Albany NY (US)]] ===
 
=== [[:Category:Sergey Voronin|Sergey Voronin of Albany NY (US)]] ===
 
* Number of Plasma Technology patents: 8
 
* Number of Plasma Technology patents: 8
Line 251: Line 251:
 
** [[20240371603. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, PLASMA PROCESSING METHOD, ANALYSIS METHOD, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20241107)
 
** [[20240371603. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, PLASMA PROCESSING METHOD, ANALYSIS METHOD, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20241107)
 
** [[20240136154. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240425)
 
** [[20240136154. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240425)
 +
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 4 patents
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523)
 +
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 +
** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
 
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
 
* Number of Plasma Technology patents: 8
 
* Number of Plasma Technology patents: 8
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** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
 
** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
 
** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031)
 
** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031)
 +
=== [[:Category:Maju TOMURA|Maju TOMURA]] ===
 +
* Number of Plasma Technology patents: 7
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 7 patents
 +
* Recent patents:
 +
** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
 
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
 
* Number of Plasma Technology patents: 7
 
* Number of Plasma Technology patents: 7
Line 268: Line 285:
 
** [[20240087849. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240314)
 
** [[20240087849. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240314)
 
** [[20240321550. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 
** [[20240321550. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
 
* Number of Plasma Technology patents: 7
 
* Top companies:
 
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 4 patents
 
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
 
* Recent patents:
 
** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523)
 
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 
** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 
 
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
 
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
 
* Number of Plasma Technology patents: 6
 
* Number of Plasma Technology patents: 6
Line 285: Line 293:
 
** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627)
 
** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627)
 
** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
 
** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
=== [[:Category:Maju TOMURA|Maju TOMURA]] ===
 
* Number of Plasma Technology patents: 6
 
* Top companies:
 
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
 
* Recent patents:
 
** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 
 
=== [[:Category:Blaze Messer|Blaze Messer of Albany NY (US)]] ===
 
=== [[:Category:Blaze Messer|Blaze Messer of Albany NY (US)]] ===
 
* Number of Plasma Technology patents: 5
 
* Number of Plasma Technology patents: 5
Line 403: Line 403:
 
* Recent patents:
 
* Recent patents:
 
** [[20240213032. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627)
 
** [[20240213032. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627)
 +
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
=== [[:Category:Yoshihide KIHARA|Yoshihide KIHARA]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240203698. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240620)
 
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
Line 453: Line 461:
 
** [[20240222078. PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, CONTROL METHOD, PROGRAM, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20240704)
 
** [[20240222078. PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, CONTROL METHOD, PROGRAM, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20240704)
 
** [[20240153742. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 
** [[20240153742. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
=== [[:Category:Yoshihide KIHARA|Yoshihide KIHARA]] ===
 
* Number of Plasma Technology patents: 4
 
* Top companies:
 
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 
* Recent patents:
 
** [[20240203698. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240620)
 
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 
 
=== [[:Category:Hiroyuki MATSUURA|Hiroyuki MATSUURA]] ===
 
=== [[:Category:Hiroyuki MATSUURA|Hiroyuki MATSUURA]] ===
 
* Number of Plasma Technology patents: 4
 
* Number of Plasma Technology patents: 4
Line 610: Line 610:
 
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
 
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
  
* Miyagi: 177 inventors
+
* Miyagi: 188 inventors
* Tokyo: 120 inventors
+
* Tokyo: 121 inventors
 
* Kurokawa-gun: 72 inventors
 
* Kurokawa-gun: 72 inventors
* Suwon-si: 63 inventors
+
* Suwon-si: 64 inventors
 
* Austin: 51 inventors
 
* Austin: 51 inventors
* Fremont: 41 inventors
+
* Yamanashi: 44 inventors
* Yamanashi: 41 inventors
+
* Fremont: 43 inventors
 +
* Santa Clara: 41 inventors
 +
* San Jose: 41 inventors
 
* Albany: 40 inventors
 
* Albany: 40 inventors
* Santa Clara: 40 inventors
+
* Hsinchu: 22 inventors
* San Jose: 40 inventors
 
 
* Seoul: 20 inventors
 
* Seoul: 20 inventors
 
* Nirasaki City: 18 inventors
 
* Nirasaki City: 18 inventors
* Hsinchu: 16 inventors
+
* Sunnyvale: 15 inventors
* Sunnyvale: 14 inventors
 
 
* Pleasanton: 13 inventors
 
* Pleasanton: 13 inventors
 
* Portland: 13 inventors
 
* Portland: 13 inventors

Latest revision as of 17:27, 6 January 2025

Contents

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Plasma Technology Monthly Patent Applications 2025 - Up to 2025.png

Top Technology Areas in Plasma Technology

Top Technology Areas in Plasma Technology 2025 - Up to 2025.png

Top CPC Codes

Top Companies in Plasma Technology

Top Companies in Plasma Technology.png

Tokyo Electron Limited

Applied Materials, Inc.

Lam Research Corporation

Hitachi High-Tech Corporation

TOKYO ELECTRON LIMITED

HITACHI HIGH-TECH CORPORATION

SAMSUNG ELECTRONICS CO., LTD.

DISCO CORPORATION

Advanced Energy Industries, Inc.

Taiwan Semiconductor Manufacturing Company, Ltd.

New Companies in Plasma Technology (Last Month)

800px

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Emerging Technology Areas in Plasma Technology.png

Top Companies in Emerging Plasma Technology Technologies

Top Companies in Emerging Plasma Technology Technologies.png

Top Inventors in Plasma Technology

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Kartik RAMASWAMY of San Jose CA (US)

Yue GUO of Redwood City CA (US)

Chishio KOSHIMIZU

Taro IKEDA

Sergey Voronin of Albany NY (US)

Yang YANG of San Diego CA (US)

Kazushi KANEKO

Eiki KAMATA

Peter Lowell George Ventzek of Austin TX (US)

Maju TOMURA

Masaki HIRAYAMA

Barton Lane of Austin TX (US)

Blaze Messer of Albany NY (US)

Yan Chen of Fremont CA (US)

Joel Ng of Fremont CA (US)

Ashawaraya Shalini of Fremont CA (US)

Ying Zhu of Fremont CA (US)

Merritt Funk of Austin TX (US)

Keren J. KANARIK of Los Altos CA (US)

Samantha SiamHwa TAN of Newark CA (US)

Yang PAN of Los Altos CA (US)

Jeffrey MARKS of Saratoga CA (US)

Linying CUI of Cupertino CA (US)

James ROGERS of Los Gatos CA (US)

Rajinder DHINDSA of Pleasanton CA (US)

Koki MUKAIYAMA

Yoshihide KIHARA

Shinji HIMORI

A N M Wasekul AZAD of Santa Clara CA (US)

Atsushi TAKAHASHI

Kazuki MOYAMA

Mitsunori Ohata

Gen TAMAMUSHI

Hiroyuki MATSUURA

Satoru KAWAKAMI

Shota YOSHIMURA

Jianping Zhao of Austin TX (US)

Qiang Wang of Austin TX (US)

Shin YAMAGUCHI

Makoto KATO

Hajime TAMURA

Kazuya NAGASEKI

Satoru TERUUCHI

Yasuharu SASAKI

Naoki MATSUMOTO

Da Song of Albany NY (US)

Shin MATSUURA

Chelsea DuBose of Austin TX (US)

Justin Moses of Austin TX (US)

Hiroyuki MIYASHITA

Top Collaborations in Plasma Technology

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Top US States for Plasma Technology Inventors

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Top Cities for Plasma Technology Inventors

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  • Miyagi: 188 inventors
  • Tokyo: 121 inventors
  • Kurokawa-gun: 72 inventors
  • Suwon-si: 64 inventors
  • Austin: 51 inventors
  • Yamanashi: 44 inventors
  • Fremont: 43 inventors
  • Santa Clara: 41 inventors
  • San Jose: 41 inventors
  • Albany: 40 inventors
  • Hsinchu: 22 inventors
  • Seoul: 20 inventors
  • Nirasaki City: 18 inventors
  • Sunnyvale: 15 inventors
  • Pleasanton: 13 inventors
  • Portland: 13 inventors
  • Redwood City: 12 inventors
  • Nirasaki City, Yamanashi: 11 inventors
  • Shanghai: 11 inventors
  • Saratoga: 10 inventors