Difference between revisions of "Plasma Technology Patent Application Trends 2024"

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== Plasma Technology Patent Application Filing Activity ==
 
== Plasma Technology Patent Application Filing Activity ==
−
== Plasma Technology patent applications in 2024 ==
+
== Plasma Technology patent applications in 2025 ==
−
[[File:Plasma_Technology_Monthly_Patent_Applications_2024_-_Up_to_June 2024.png|border|800px]]
+
[[File:Plasma_Technology_Monthly_Patent_Applications_2025_-_Up_to_ 2025.png|border|800px]]
  
 
== Top Technology Areas in Plasma Technology ==
 
== Top Technology Areas in Plasma Technology ==
−
[[File:Top_Technology_Areas_in_Plasma_Technology_2024_-_Up_to_June 2024.png|border|800px]]
+
[[File:Top_Technology_Areas_in_Plasma_Technology_2025_-_Up_to_ 2025.png|border|800px]]
  
 
=== Top CPC Codes ===
 
=== Top CPC Codes ===
 
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
 
* [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available)
−
** Count: 49 patents
+
** Count: 83 patents
−
** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240234097. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
 
* [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available)
−
** Count: 45 patents
+
** Count: 66 patents
−
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
 
* [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available)
−
** Count: 31 patents
+
** Count: 50 patents
−
** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240234113. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
 
* [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available)
−
** Count: 27 patents
+
** Count: 46 patents
−
** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240234092. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available)
 
* [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available)
−
** Count: 25 patents
+
** Count: 42 patents
−
** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE simplified abstract (Lam Research Corporation)]]
+
** Example: [[20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)]]
 +
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
 +
** Count: 38 patents
 +
** Example: [[20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)]]
 
* [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available)
 
* [[:Category:CPC_H01J37/32091|H01J37/32091]] (No explanation available)
−
** Count: 24 patents
+
** Count: 35 patents
−
** Example: [[20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS simplified abstract (Applied Materials, Inc.)]]
+
** Example: [[20240234087. PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS (Applied Materials, Inc.)]]
 +
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (No explanation available)
 +
** Count: 34 patents
 +
** Example: [[20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
 
* [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available)
−
** Count: 22 patents
+
** Count: 34 patents
−
** Example: [[20240105424. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240429027. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
−
* [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available)
+
* [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available)
−
** Count: 20 patents
+
** Count: 33 patents
−
** Example: [[20240234096. PLASMA PROCESSING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)]]
+
** Example: [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]]
−
* [[:Category:CPC_H01J37/32724|H01J37/32724]] (No explanation available)
 
−
** Count: 20 patents
 
−
** Example: [[20240234099. FORMING METHOD OF COMPONENT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
 
−
* [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available)
 
−
** Count: 20 patents
 
−
** Example: [[20240105424. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Tokyo Electron Limited)]]
 
  
 
== Top Companies in Plasma Technology ==
 
== Top Companies in Plasma Technology ==
Line 42: Line 42:
  
 
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
 
=== [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]] ===
−
* Number of Plasma Technology patents: 110
+
* Number of Plasma Technology patents: 167
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 30 patents
+
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 40 patents
−
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 28 patents
+
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 39 patents
−
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 20 patents
+
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 29 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK simplified abstract (Tokyo Electron Limited)]] (20240208)
+
** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208)
−
** [[20240047184. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]] (20240208)
+
** [[20240047184. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208)
−
** [[20240049379. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]] (20240208)
+
** [[20240049379. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208)
 
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
 
=== [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] ===
 +
* Number of Plasma Technology patents: 36
 +
* Top CPC codes:
 +
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 11 patents
 +
** [[:Category:CPC_H01J37/32128|H01J37/32128]] (No explanation available): 10 patents
 +
** [[:Category:CPC_H01J2237/3341|H01J2237/3341]] (No explanation available): 8 patents
 +
* Recent patents:
 +
** [[20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.)]] (20240926)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240208)
 +
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
 
* Number of Plasma Technology patents: 22
 
* Number of Plasma Technology patents: 22
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H01J37/32128|H01J37/32128]] (No explanation available): 9 patents
+
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 7 patents
−
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 8 patents
+
** [[:Category:CPC_H01L21/6833|H01L21/6833]] (No explanation available): 7 patents
−
** [[:Category:CPC_H01J37/32146|H01J37/32146]] (No explanation available): 7 patents
+
** [[:Category:CPC_H01L21/67109|H01L21/67109]] (No explanation available): 5 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING simplified abstract (Applied Materials, Inc.)]] (20240509)
+
** [[20240363311. RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS (Lam Research Corporation)]] (20241031)
−
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER simplified abstract (Applied Materials, Inc.)]] (20240125)
+
** [[20240218509. MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA (Lam Research Corporation)]] (20240704)
−
** [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)]] (20240208)
+
** [[20240322781. Multiple-Output Radiofrequency Matching Module and Associated Methods (Lam Research Corporation)]] (20240926)
 
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
 
=== [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]] ===
−
* Number of Plasma Technology patents: 11
+
* Number of Plasma Technology patents: 17
 
* Top CPC codes:
 
* Top CPC codes:
 +
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 4 patents
 
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/32715|H01J37/32715]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 3 patents
 
 
* Recent patents:
 
* Recent patents:
−
** [[20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation)]] (20240208)
+
** [[20240047181. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20240208)
−
** [[20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation)]] (20240208)
+
** [[20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD (Hitachi High-Tech Corporation)]] (20240208)
−
** [[20240047258. PLASMA PROCESSING APPARATUS simplified abstract (Hitachi High-Tech Corporation)]] (20240208)
+
** [[20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]] (20240208)
 
=== [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] ===
 
=== [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]] ===
−
* Number of Plasma Technology patents: 9
+
* Number of Plasma Technology patents: 14
 
* Top CPC codes:
 
* Top CPC codes:
 
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/32247|H01J37/32247]] (No explanation available): 3 patents
 
** [[:Category:CPC_H01J37/32247|H01J37/32247]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01J37/3222|H01J37/3222]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01J37/32513|H01J37/32513]] (No explanation available): 2 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED)]] (20240523)
+
** [[20240331977. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20241003)
−
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED)]] (20240125)
+
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
−
** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED)]] (20240125)
+
** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
−
=== [[:Category:Lam Research Corporation|Lam Research Corporation]] ===
+
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
−
* Number of Plasma Technology patents: 8
+
* Number of Plasma Technology patents: 11
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 6 patents
−
** [[:Category:CPC_H01J37/32568|H01J37/32568]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01J37/32449|H01J37/32449]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01J37/32972|H01J37/32972]] (No explanation available): 3 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240055285. CONTROL OF WAFER BOW IN MULTIPLE STATIONS simplified abstract (Lam Research Corporation)]] (20240215)
+
** [[20240194461. PLASMA PROCESSING METHOD (HITACHI HIGH-TECH CORPORATION)]] (20240613)
−
** [[20240167161. SPATIALLY TUNABLE DEPOSITION TO COMPENSATE WITHIN WAFER DIFFERENTIAL BOW simplified abstract (Lam Research Corporation)]] (20240523)
+
** [[20240222096. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20240704)
−
** [[20240218509. MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA simplified abstract (Lam Research Corporation)]] (20240704)
+
** [[20240331974. PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)]] (20241003)
−
=== [[:Category:HITACHI HIGH-TECH CORPORATION|HITACHI HIGH-TECH CORPORATION]] ===
+
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
 
* Number of Plasma Technology patents: 8
 
* Number of Plasma Technology patents: 8
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 5 patents
+
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 4 patents
−
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 3 patents
+
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01J37/32972|H01J37/32972]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 3 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240194453. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION)]] (20240613)
+
** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240627)
−
** [[20240194461. PLASMA PROCESSING METHOD simplified abstract (HITACHI HIGH-TECH CORPORATION)]] (20240613)
+
** [[20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240321)
−
** [[20240222096. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION)]] (20240704)
+
** [[20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD (SAMSUNG ELECTRONICS CO., LTD.)]] (20240201)
−
=== [[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]] ===
+
=== [[:Category:DISCO CORPORATION|DISCO CORPORATION]] ===
−
* Number of Plasma Technology patents: 6
+
* Number of Plasma Technology patents: 7
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H01J37/3244|H01J37/3244]] (No explanation available): 3 patents
+
** [[:Category:CPC_H01L21/304|H01L21/304]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01J37/3211|H01J37/3211]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01L21/3065|H01L21/3065]] (No explanation available): 3 patents
−
** [[:Category:CPC_H01J37/32642|H01J37/32642]] (No explanation available): 2 patents
+
** [[:Category:CPC_H01L24/80|H01L24/80]] (No explanation available): 2 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240212992. PLASMA PROCESSING APPARATUS AND METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)]] (20240627)
+
** [[20240136193. METHOD OF PROCESSING WAFER (DISCO CORPORATION)]] (20240425)
−
** [[20240096649. SEMICONDUCTOR PROCESS SYSTEM AND GAS TREATMENT METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)]] (20240321)
+
** [[20240058898. WAFER PROCESSING METHOD (DISCO CORPORATION)]] (20240222)
−
** [[20240038536. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)]] (20240201)
+
** [[20240112955. MANUFACTURING METHOD OF CHIPS (DISCO CORPORATION)]] (20240404)
 
=== [[:Category:Advanced Energy Industries, Inc.|Advanced Energy Industries, Inc.]] ===
 
=== [[:Category:Advanced Energy Industries, Inc.|Advanced Energy Industries, Inc.]] ===
−
* Number of Plasma Technology patents: 6
+
* Number of Plasma Technology patents: 7
 
* Top CPC codes:
 
* Top CPC codes:
 +
** [[:Category:CPC_H01J37/32174|H01J37/32174]] (No explanation available): 2 patents
 
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 2 patents
 
** [[:Category:CPC_H01J37/32935|H01J37/32935]] (No explanation available): 2 patents
 
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 2 patents
 
** [[:Category:CPC_H01L21/67069|H01L21/67069]] (No explanation available): 2 patents
−
** [[:Category:CPC_G05B13/0275|G05B13/0275]] (No explanation available): 1 patents
 
 
* Recent patents:
 
* Recent patents:
−
** [[20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS simplified abstract (Advanced Energy Industries, Inc.)]] (20240229)
+
** [[20240071721. SYSTEM, METHOD, AND APPARATUS FOR CONTROLLING ION ENERGY DISTRIBUTION IN PLASMA PROCESSING SYSTEMS (Advanced Energy Industries, Inc.)]] (20240229)
−
** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING simplified abstract (Advanced Energy Industries, Inc.)]] (20240613)
+
** [[20240194452. BIAS SUPPLY WITH RESONANT SWITCHING (Advanced Energy Industries, Inc.)]] (20240613)
−
** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH simplified abstract (Advanced Energy Industries, Inc.)]] (20240125)
+
** [[20240030001. BIAS SUPPLY WITH A SINGLE CONTROLLED SWITCH (Advanced Energy Industries, Inc.)]] (20240125)
−
=== [[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]] ===
+
=== [[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]] ===
−
* Number of Plasma Technology patents: 4
+
* Number of Plasma Technology patents: 6
−
* Top CPC codes:
 
−
** [[:Category:CPC_H01J37/32183|H01J37/32183]] (No explanation available): 2 patents
 
−
** [[:Category:CPC_H01J2237/334|H01J2237/334]] (No explanation available): 2 patents
 
−
** [[:Category:CPC_H01J37/321|H01J37/321]] (No explanation available): 1 patents
 
−
* Recent patents:
 
−
** [[20240014009. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)]] (20240111)
 
−
** [[20240038511. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)]] (20240201)
 
−
** [[20240112892. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)]] (20240404)
 
−
=== [[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]] ===
 
−
* Number of Plasma Technology patents: 3
 
 
* Top CPC codes:
 
* Top CPC codes:
−
** [[:Category:CPC_H02M7/539|H02M7/539]] (No explanation available): 1 patents
+
** [[:Category:CPC_H01L21/32136|H01L21/32136]] (No explanation available): 2 patents
−
** [[:Category:CPC_H01J37/241|H01J37/241]] (No explanation available): 1 patents
+
** [[:Category:CPC_H01L21/0337|H01L21/0337]] (No explanation available): 2 patents
−
** [[:Category:CPC_H02M1/088|H02M1/088]] (No explanation available): 1 patents
+
** [[:Category:CPC_H01L29/66795|H01L29/66795]] (No explanation available): 2 patents
 
* Recent patents:
 
* Recent patents:
−
** [[20240128892. POWER GENERATOR WITH PARTIAL SINUSOIDAL WAVEFORM, PLASMA PROCESSING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)]] (20240418)
+
** [[20240404860. PLASMA PROCESSING APPARATUS AND METHOD (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20241205)
−
** [[20240162014. PROCESS CHAMBER, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND OPERATING METHOD OF THE SUBSTRATE TREATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)]] (20240516)
+
** [[20240168371. SELECTIVE HARDMASK ON HARDMASK (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20240523)
−
** [[20240038505. PLASMA PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)]] (20240201)
+
** [[20240363450. METHOD OF DETECTING PHOTORESIST SCUM, METHOD OF FORMING SEMICONDUCTOR PACKAGE AND PHOTORESIST SCUM DETECTION APPARATUS (Taiwan Semiconductor Manufacturing Company, Ltd.)]] (20241031)
  
 
== New Companies in Plasma Technology (Last Month) ==
 
== New Companies in Plasma Technology (Last Month) ==
Line 150: Line 150:
 
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
 
[[File:Emerging_Technology_Areas_in_Plasma_Technology.png|border|800px]]
  
−
* [[:Category:CPC_H05H1/4652|H05H1/4652]] (No explanation available)
 
−
** Count: 1 patents
 
−
** Example: [[20240049379. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
 
 
* [[:Category:CPC_H01L21/67063|H01L21/67063]] (No explanation available)
 
* [[:Category:CPC_H01L21/67063|H01L21/67063]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240047258. PLASMA PROCESSING APPARATUS simplified abstract (Hitachi High-Tech Corporation)]]
+
** Example: [[20240047258. PLASMA PROCESSING APPARATUS (Hitachi High-Tech Corporation)]]
−
* [[:Category:CPC_H01L21/67109|H01L21/67109]] (No explanation available)
+
* [[:Category:CPC_C23C4/04|C23C4/04]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240047246. ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)]]
+
** Example: [[20240043982. THERMAL SPRAY MATERIAL, THERMAL SPRAY COATING, METHOD FOR FORMING THERMAL SPRAY COATING, AND COMPONENT FOR PLASMA ETCHING DEVICE (TOCALO Co., Ltd.)]]
−
* [[:Category:CPC_H01L21/67115|H01L21/67115]] (No explanation available)
+
* [[:Category:CPC_G03F7/70633|G03F7/70633]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240047239. PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD simplified abstract (Hitachi High-Tech Corporation)]]
+
** Example: [[20240030073. ETCH MONITORING AND PERFORMING (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)]]
 
* [[:Category:CPC_H01J2237/24578|H01J2237/24578]] (No explanation available)
 
* [[:Category:CPC_H01J2237/24578|H01J2237/24578]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED)]]
+
** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]]
 
* [[:Category:CPC_G05B15/02|G05B15/02]] (No explanation available)
 
* [[:Category:CPC_G05B15/02|G05B15/02]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD simplified abstract (TOKYO ELECTRON LIMITED)]]
+
** Example: [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]]
 
* [[:Category:CPC_G01N25/72|G01N25/72]] (No explanation available)
 
* [[:Category:CPC_G01N25/72|G01N25/72]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_G01M3/002|G01M3/002]] (No explanation available)
 
* [[:Category:CPC_G01M3/002|G01M3/002]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H01J2237/3342|H01J2237/3342]] (No explanation available)
 
* [[:Category:CPC_H01J2237/3342|H01J2237/3342]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]]
 
* [[:Category:CPC_H05B6/62|H05B6/62]] (No explanation available)
 
* [[:Category:CPC_H05B6/62|H05B6/62]] (No explanation available)
 
** Count: 1 patents
 
** Count: 1 patents
−
** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD simplified abstract (Tokyo Electron Limited)]]
+
** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)]]
 +
* [[:Category:CPC_H05B6/54|H05B6/54]] (No explanation available)
 +
** Count: 1 patents
 +
** Example: [[20240030009. PLASMA PROCESSING APPARATUS AND TEMPERATURE CONTROLLING METHOD (Tokyo Electron Limited)]]
  
 
== Top Companies in Emerging Plasma Technology Technologies ==
 
== Top Companies in Emerging Plasma Technology Technologies ==
Line 186: Line 186:
 
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 
* [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 
* [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
 
* [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
−
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 2 patents
+
* [[:Category:Hitachi High-Tech Corporation|Hitachi High-Tech Corporation]]: 1 patents
−
* [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 1 patents
+
* [[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]: 1 patents
 +
* [[:Category:TOCALO Co., Ltd.|TOCALO Co., Ltd.]]: 1 patents
 +
 
 +
== Top Inventors in Plasma Technology ==
 +
[[File:Top_50_Inventors_in_Plasma_Technology.png|border|800px]]
 +
 
 +
=== [[:Category:Kartik RAMASWAMY|Kartik RAMASWAMY of San Jose CA (US)]] ===
 +
* Number of Plasma Technology patents: 13
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 13 patents
 +
* Recent patents:
 +
** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613)
 +
** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:Yue GUO|Yue GUO of Redwood City CA (US)]] ===
 +
* Number of Plasma Technology patents: 11
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 11 patents
 +
* Recent patents:
 +
** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613)
 +
** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:Chishio KOSHIMIZU|Chishio KOSHIMIZU]] ===
 +
* Number of Plasma Technology patents: 11
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 11 patents
 +
* Recent patents:
 +
** [[20240112895. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240404)
 +
** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314)
 +
** [[20240331978. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20241003)
 +
=== [[:Category:Taro IKEDA|Taro IKEDA]] ===
 +
* Number of Plasma Technology patents: 11
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 9 patents
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
 +
* Recent patents:
 +
** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523)
 +
** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201)
 +
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 +
=== [[:Category:Sergey Voronin|Sergey Voronin of Albany NY (US)]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents
 +
* Recent patents:
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
** [[20240096600. Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control (Tokyo Electron Limited)]] (20240321)
 +
** [[20240331979. Apparatus and Methods for Plasma Processing (Tokyo Electron Limited)]] (20241003)
 +
=== [[:Category:Yang YANG|Yang YANG of San Diego CA (US)]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 8 patents
 +
* Recent patents:
 +
** [[20240177969. SOLID-STATE SWITCH BASED HIGH-SPEED PULSER WITH PLASMA IEDF MODIFICATION CAPABILITY THROUGH MULTILEVEL OUTPUT FUNCTIONALITY (Applied Materials, Inc.)]] (20240530)
 +
** [[20240194447. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613)
 +
** [[20240152114. RADIO FREQUENCY IMPEDANCE MATCHING NETWORK WITH FLEXIBLE TUNING ALGORITHMS (Applied Materials, Inc.)]] (20240509)
 +
=== [[:Category:Kazushi KANEKO|Kazushi KANEKO]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 3 patents
 +
* Recent patents:
 +
** [[20240203692. PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD (Tokyo Electron Limited)]] (20240620)
 +
** [[20240371603. PLASMA PROCESSING APPARATUS, ANALYSIS APPARATUS, PLASMA PROCESSING METHOD, ANALYSIS METHOD, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20241107)
 +
** [[20240136154. FREQUENCY-VARIABLE POWER SUPPLY AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240425)
 +
=== [[:Category:Eiki KAMATA|Eiki KAMATA]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 4 patents
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240170260. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240523)
 +
** [[20240030008. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 +
** [[20240030015. PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD (TOKYO ELECTRON LIMITED)]] (20240125)
 +
=== [[:Category:Peter Lowell George Ventzek|Peter Lowell George Ventzek of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 8
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 8 patents
 +
* Recent patents:
 +
** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017)
 +
** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
 +
** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031)
 +
=== [[:Category:Maju TOMURA|Maju TOMURA]] ===
 +
* Number of Plasma Technology patents: 7
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 7 patents
 +
* Recent patents:
 +
** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
=== [[:Category:Masaki HIRAYAMA|Masaki HIRAYAMA]] ===
 +
* Number of Plasma Technology patents: 7
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 1 patents
 +
* Recent patents:
 +
** [[20240071730. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229)
 +
** [[20240087849. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240314)
 +
** [[20240321550. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
=== [[:Category:Barton Lane|Barton Lane of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 6
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 6 patents
 +
* Recent patents:
 +
** [[20240203713. IN-SITU DIAGNOSIS OF PLASMA SYSTEM (Tokyo Electron Limited)]] (20240620)
 +
** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627)
 +
** [[20240038506. Plasma Processing with Magnetic Ring X Point (Tokyo Electron Limited)]] (20240201)
 +
=== [[:Category:Blaze Messer|Blaze Messer of Albany NY (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Yan Chen|Yan Chen of Fremont CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Joel Ng|Joel Ng of Fremont CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Ashawaraya Shalini|Ashawaraya Shalini of Fremont CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Ying Zhu|Ying Zhu of Fremont CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240136164. Method for OES Data Collection and Endpoint Detection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Merritt Funk|Merritt Funk of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114)
 +
** [[20240203713. IN-SITU DIAGNOSIS OF PLASMA SYSTEM (Tokyo Electron Limited)]] (20240620)
 +
** [[20240213005. System and Method for Plasma Processing (Tokyo Electron Limited)]] (20240627)
 +
=== [[:Category:Keren J. KANARIK|Keren J. KANARIK of Los Altos CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents
 +
* Recent patents:
 +
** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530)
 +
=== [[:Category:Samantha SiamHwa TAN|Samantha SiamHwa TAN of Newark CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents
 +
* Recent patents:
 +
** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530)
 +
=== [[:Category:Yang PAN|Yang PAN of Los Altos CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents
 +
* Recent patents:
 +
** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530)
 +
=== [[:Category:Jeffrey MARKS|Jeffrey MARKS of Saratoga CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Lam Research Corporation|Lam Research Corporation]]: 5 patents
 +
* Recent patents:
 +
** [[20240203759. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240203760. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240620)
 +
** [[20240178014. PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECTRICS (Lam Research Corporation)]] (20240530)
 +
=== [[:Category:Linying CUI|Linying CUI of Cupertino CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents
 +
* Recent patents:
 +
** [[20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613)
 +
** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:James ROGERS|James ROGERS of Los Gatos CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents
 +
* Recent patents:
 +
** [[20240194446. CHAMBER IMPEDANCE MANAGEMENT IN A PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240613)
 +
** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:Rajinder DHINDSA|Rajinder DHINDSA of Pleasanton CA (US)]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 5 patents
 +
* Recent patents:
 +
** [[20240153741. MULTI-SHAPE VOLTAGE PULSE TRAINS FOR UNIFORMITY AND ETCH PROFILE TUNING (Applied Materials, Inc.)]] (20240509)
 +
** [[20240321610. SENSORS AND SYSTEM FOR IN-SITU EDGE RING EROSION MONITOR (Applied Materials, Inc.)]] (20240926)
 +
** [[20240030002. PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY POWER (Applied Materials, Inc.)]] (20240125)
 +
=== [[:Category:Koki MUKAIYAMA|Koki MUKAIYAMA]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240213032. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627)
 +
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
=== [[:Category:Yoshihide KIHARA|Yoshihide KIHARA]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240203698. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240620)
 +
** [[20240321562. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240926)
 +
** [[20240030010. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
=== [[:Category:Shinji HIMORI|Shinji HIMORI]] ===
 +
* Number of Plasma Technology patents: 5
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 5 patents
 +
* Recent patents:
 +
** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321)
 +
** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229)
 +
** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
=== [[:Category:A N M Wasekul AZAD|A N M Wasekul AZAD of Santa Clara CA (US)]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]: 4 patents
 +
* Recent patents:
 +
** [[20240290578. RADIO FREQUENCY DIVERTER ASSEMBLY ENABLING ON-DEMAND DIFFERENT SPATIAL OUTPUTS (Applied Materials, Inc.)]] (20240829)
 +
** [[20240079212. SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER (Applied Materials, Inc.)]] (20240307)
 +
** [[20240177968. SYSTEM AND METHODS FOR IMPLEMENTING A MICRO PULSING SCHEME USING DUAL INDEPENDENT PULSERS (Applied Materials, Inc.)]] (20240530)
 +
=== [[:Category:Atsushi TAKAHASHI|Atsushi TAKAHASHI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240112918. PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING METHOD (Tokyo Electron Limited)]] (20240404)
 +
** [[20240112922. ETCHING METHOD AND PLASMA PROCESSING SYSTEM (Tokyo Electron Limited)]] (20240404)
 +
** [[20240153744. ETCHING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
=== [[:Category:Kazuki MOYAMA|Kazuki MOYAMA]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240213000. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627)
 +
** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240047184. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240208)
 +
=== [[:Category:Mitsunori Ohata|Mitsunori Ohata]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240339297. PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS (Tokyo Electron Limited)]] (20241010)
 +
** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017)
 +
** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031)
 +
=== [[:Category:Gen TAMAMUSHI|Gen TAMAMUSHI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240170258. PLASMA PROCESSING SYSTEM AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240523)
 +
** [[20240222078. PLASMA PROCESSING APPARATUS, POWER SUPPLY SYSTEM, CONTROL METHOD, PROGRAM, AND STORAGE MEDIUM (Tokyo Electron Limited)]] (20240704)
 +
** [[20240153742. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
=== [[:Category:Hiroyuki MATSUURA|Hiroyuki MATSUURA]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240014013. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240111)
 +
** [[20240018660. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD (Tokyo Electron Limited)]] (20240118)
 +
** [[20240170265. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240523)
 +
=== [[:Category:Satoru KAWAKAMI|Satoru KAWAKAMI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 2 patents
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
 +
* Recent patents:
 +
** [[20240203692. PLASMA PROCESSING APPARATUS AND PLASMA CONTROL METHOD (Tokyo Electron Limited)]] (20240620)
 +
** [[20240038500. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240201)
 +
** [[20240331977. PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD (TOKYO ELECTRON LIMITED)]] (20241003)
 +
=== [[:Category:Shota YOSHIMURA|Shota YOSHIMURA]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240212987. GAS SUPPLY SYSTEM, GAS CONTROL SYSTEM, PLASMA PROCESSING APPARATUS, AND GAS CONTROL METHOD (Tokyo Electron Limited)]] (20240627)
 +
** [[20240071727. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229)
 +
** [[20240071728. SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240229)
 +
=== [[:Category:Jianping Zhao|Jianping Zhao of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240203706. ALD PROCESS WITH PLASMA TREATMENT (Tokyo Electron Limited)]] (20240620)
 +
** [[20240021410. Plasma Processing with Broadband RF Waveforms (Tokyo Electron Limited)]] (20240118)
 +
** [[20240170256. VHF Broadband Coaxial Adapter (Tokyo Electron Limited)]] (20240523)
 +
=== [[:Category:Qiang Wang|Qiang Wang of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240339297. PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS (Tokyo Electron Limited)]] (20241010)
 +
** [[20240347317. Method and System for Plasma Processing (Tokyo Electron Limited)]] (20241017)
 +
** [[20240363310. Balanced RF Resonant Antenna System (Tokyo Electron Limited)]] (20241031)
 +
=== [[:Category:Shin YAMAGUCHI|Shin YAMAGUCHI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
=== [[:Category:Makoto KATO|Makoto KATO]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240194514. SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240087857. PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT (Tokyo Electron Limited)]] (20240314)
 +
** [[20240047182. PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)]] (20240208)
 +
=== [[:Category:Hajime TAMURA|Hajime TAMURA]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
=== [[:Category:Kazuya NAGASEKI|Kazuya NAGASEKI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321)
 +
** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229)
 +
** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
=== [[:Category:Satoru TERUUCHI|Satoru TERUUCHI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240096608. PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240321)
 +
** [[20240068921. PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE (Tokyo Electron Limited)]] (20240229)
 +
** [[20240194459. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
=== [[:Category:Yasuharu SASAKI|Yasuharu SASAKI]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240194457. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240194458. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240613)
 +
** [[20240153749. STAGE AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240509)
 +
=== [[:Category:Naoki MATSUMOTO|Naoki MATSUMOTO]] ===
 +
* Number of Plasma Technology patents: 4
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 4 patents
 +
* Recent patents:
 +
** [[20240222075. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240704)
 +
** [[20240030012. DETECTION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
** [[20240030014. SEASONING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240125)
 +
=== [[:Category:Da Song|Da Song of Albany NY (US)]] ===
 +
* Number of Plasma Technology patents: 3
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
 +
* Recent patents:
 +
** [[20240230409. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240711)
 +
** [[20240133742. Time-Resolved OES Data Collection (Tokyo Electron Limited)]] (20240425)
 +
** [[20240094056. Optical Emission Spectroscopy for Advanced Process Characterization (Tokyo Electron Limited)]] (20240321)
 +
=== [[:Category:Shin MATSUURA|Shin MATSUURA]] ===
 +
* Number of Plasma Technology patents: 3
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 2 patents
 +
** [[:Category:TOKYO ELECTRON LIMITED|TOKYO ELECTRON LIMITED]]: 1 patents
 +
* Recent patents:
 +
** [[20240234102. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] (20240711)
 +
** [[20240371609. PLASMA PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)]] (20241107)
 +
** [[20240136158. PLASMA PROCESSING SYSTEM AND EDGE RING REPLACEMENT METHOD (Tokyo Electron Limited)]] (20240425)
 +
=== [[:Category:Chelsea DuBose|Chelsea DuBose of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 3
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
 +
* Recent patents:
 +
** [[20240258074. Antenna Plane Magnets for Improved Performance (Tokyo Electron Limited)]] (20240801)
 +
** [[20240162619. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20240516)
 +
** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114)
 +
=== [[:Category:Justin Moses|Justin Moses of Austin TX (US)]] ===
 +
* Number of Plasma Technology patents: 3
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
 +
* Recent patents:
 +
** [[20240258074. Antenna Plane Magnets for Improved Performance (Tokyo Electron Limited)]] (20240801)
 +
** [[20240162619. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20240516)
 +
** [[20240380114. Parallel Resonance Antenna for Radial Plasma Control (Tokyo Electron Limited)]] (20241114)
 +
=== [[:Category:Hiroyuki MIYASHITA|Hiroyuki MIYASHITA]] ===
 +
* Number of Plasma Technology patents: 3
 +
* Top companies:
 +
** [[:Category:Tokyo Electron Limited|Tokyo Electron Limited]]: 3 patents
 +
* Recent patents:
 +
** [[20240297018. DISTRIBUTOR AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240905)
 +
** [[20240297020. PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240905)
 +
** [[20240212985. FILTER CIRCUIT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)]] (20240627)
 +
 
 +
== Top Collaborations in Plasma Technology ==
 +
[[File:Top_20_Collaborations_in_Plasma_Technology.png|border|800px]]
 +
 
 +
== Top US States for Plasma Technology Inventors ==
 +
[[File:Top_10_US_States_for_Plasma_Technology_Inventors.png|border|800px]]
 +
 
 +
 
 +
== Top Cities for Plasma Technology Inventors ==
 +
[[File:Top_20_Cities_for_Plasma_Technology_Inventors.png|border|800px]]
 +
 
 +
* Miyagi: 188 inventors
 +
* Tokyo: 121 inventors
 +
* Kurokawa-gun: 72 inventors
 +
* Suwon-si: 64 inventors
 +
* Austin: 51 inventors
 +
* Yamanashi: 44 inventors
 +
* Fremont: 43 inventors
 +
* Santa Clara: 41 inventors
 +
* San Jose: 41 inventors
 +
* Albany: 40 inventors
 +
* Hsinchu: 22 inventors
 +
* Seoul: 20 inventors
 +
* Nirasaki City: 18 inventors
 +
* Sunnyvale: 15 inventors
 +
* Pleasanton: 13 inventors
 +
* Portland: 13 inventors
 +
* Redwood City: 12 inventors
 +
* Nirasaki City, Yamanashi: 11 inventors
 +
* Shanghai: 11 inventors
 +
* Saratoga: 10 inventors
  
 
[[Category:Plasma Technology]]
 
[[Category:Plasma Technology]]
 
[[Category:Patent Application Trends by Technology in 2024]]
 
[[Category:Patent Application Trends by Technology in 2024]]

Latest revision as of 17:27, 6 January 2025

Contents

Plasma Technology Patent Application Filing Activity

Plasma Technology patent applications in 2025

Plasma Technology Monthly Patent Applications 2025 - Up to 2025.png

Top Technology Areas in Plasma Technology

Top Technology Areas in Plasma Technology 2025 - Up to 2025.png

Top CPC Codes

Top Companies in Plasma Technology

Top Companies in Plasma Technology.png

Tokyo Electron Limited

Applied Materials, Inc.

Lam Research Corporation

Hitachi High-Tech Corporation

TOKYO ELECTRON LIMITED

HITACHI HIGH-TECH CORPORATION

SAMSUNG ELECTRONICS CO., LTD.

DISCO CORPORATION

Advanced Energy Industries, Inc.

Taiwan Semiconductor Manufacturing Company, Ltd.

New Companies in Plasma Technology (Last Month)

800px

No new companies detected in the last month.

Emerging Technology Areas in Plasma Technology

Emerging Technology Areas in Plasma Technology.png

Top Companies in Emerging Plasma Technology Technologies

Top Companies in Emerging Plasma Technology Technologies.png

Top Inventors in Plasma Technology

Top 50 Inventors in Plasma Technology.png

Kartik RAMASWAMY of San Jose CA (US)

Yue GUO of Redwood City CA (US)

Chishio KOSHIMIZU

Taro IKEDA

Sergey Voronin of Albany NY (US)

Yang YANG of San Diego CA (US)

Kazushi KANEKO

Eiki KAMATA

Peter Lowell George Ventzek of Austin TX (US)

Maju TOMURA

Masaki HIRAYAMA

Barton Lane of Austin TX (US)

Blaze Messer of Albany NY (US)

Yan Chen of Fremont CA (US)

Joel Ng of Fremont CA (US)

Ashawaraya Shalini of Fremont CA (US)

Ying Zhu of Fremont CA (US)

Merritt Funk of Austin TX (US)

Keren J. KANARIK of Los Altos CA (US)

Samantha SiamHwa TAN of Newark CA (US)

Yang PAN of Los Altos CA (US)

Jeffrey MARKS of Saratoga CA (US)

Linying CUI of Cupertino CA (US)

James ROGERS of Los Gatos CA (US)

Rajinder DHINDSA of Pleasanton CA (US)

Koki MUKAIYAMA

Yoshihide KIHARA

Shinji HIMORI

A N M Wasekul AZAD of Santa Clara CA (US)

Atsushi TAKAHASHI

Kazuki MOYAMA

Mitsunori Ohata

Gen TAMAMUSHI

Hiroyuki MATSUURA

Satoru KAWAKAMI

Shota YOSHIMURA

Jianping Zhao of Austin TX (US)

Qiang Wang of Austin TX (US)

Shin YAMAGUCHI

Makoto KATO

Hajime TAMURA

Kazuya NAGASEKI

Satoru TERUUCHI

Yasuharu SASAKI

Naoki MATSUMOTO

Da Song of Albany NY (US)

Shin MATSUURA

Chelsea DuBose of Austin TX (US)

Justin Moses of Austin TX (US)

Hiroyuki MIYASHITA

Top Collaborations in Plasma Technology

Top 20 Collaborations in Plasma Technology.png

Top US States for Plasma Technology Inventors

Top 10 US States for Plasma Technology Inventors.png


Top Cities for Plasma Technology Inventors

Top 20 Cities for Plasma Technology Inventors.png

  • Miyagi: 188 inventors
  • Tokyo: 121 inventors
  • Kurokawa-gun: 72 inventors
  • Suwon-si: 64 inventors
  • Austin: 51 inventors
  • Yamanashi: 44 inventors
  • Fremont: 43 inventors
  • Santa Clara: 41 inventors
  • San Jose: 41 inventors
  • Albany: 40 inventors
  • Hsinchu: 22 inventors
  • Seoul: 20 inventors
  • Nirasaki City: 18 inventors
  • Sunnyvale: 15 inventors
  • Pleasanton: 13 inventors
  • Portland: 13 inventors
  • Redwood City: 12 inventors
  • Nirasaki City, Yamanashi: 11 inventors
  • Shanghai: 11 inventors
  • Saratoga: 10 inventors
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