Difference between revisions of "Patent Applications Report for 24th Nov 2023"
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[[Samsung Electronics Co., Ltd.]]: 199 patent applications | [[Samsung Electronics Co., Ltd.]]: 199 patent applications | ||
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Samsung Electronics Co., Ltd.has filed patents in the areas of [[H04N19/176]] (14 applications), [[H04N19/119]] (12 applications), [[H04N19/105]] (12 applications), [[G06V10/82]] (10 applications), [[H04W48/18]] (10 applications) | Samsung Electronics Co., Ltd.has filed patents in the areas of [[H04N19/176]] (14 applications), [[H04N19/119]] (12 applications), [[H04N19/105]] (12 applications), [[G06V10/82]] (10 applications), [[H04W48/18]] (10 applications) | ||
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[[HUAWEI TECHNOLOGIES CO., LTD.]]: 113 patent applications | [[HUAWEI TECHNOLOGIES CO., LTD.]]: 113 patent applications | ||
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HUAWEI TECHNOLOGIES CO., LTD.has filed patents in the areas of [[H04L5/00]] (14 applications), [[H04L1/1812]] (12 applications), [[H04W72/0446]] (8 applications), [[H04W72/23]] (8 applications), [[H04W36/00]] (7 applications) | HUAWEI TECHNOLOGIES CO., LTD.has filed patents in the areas of [[H04L5/00]] (14 applications), [[H04L1/1812]] (12 applications), [[H04W72/0446]] (8 applications), [[H04W72/23]] (8 applications), [[H04W36/00]] (7 applications) | ||
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[[QUALCOMM Incorporated]]: 104 patent applications | [[QUALCOMM Incorporated]]: 104 patent applications | ||
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QUALCOMM Incorporatedhas filed patents in the areas of [[H04L5/00]] (19 applications), [[H04W24/10]] (16 applications), [[H04W72/232]] (12 applications), [[H04W72/21]] (12 applications), [[H04W72/23]] (12 applications) | QUALCOMM Incorporatedhas filed patents in the areas of [[H04L5/00]] (19 applications), [[H04W24/10]] (16 applications), [[H04W72/232]] (12 applications), [[H04W72/21]] (12 applications), [[H04W72/23]] (12 applications) | ||
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[[Taiwan Semiconductor Manufacturing Company, Ltd.]]: 99 patent applications | [[Taiwan Semiconductor Manufacturing Company, Ltd.]]: 99 patent applications | ||
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Taiwan Semiconductor Manufacturing Company, Ltd.has filed patents in the areas of [[H01L29/66]] (24 applications), [[H01L23/00]] (19 applications), [[H01L21/768]] (16 applications), [[H01L23/31]] (14 applications), [[H01L21/56]] (13 applications) | Taiwan Semiconductor Manufacturing Company, Ltd.has filed patents in the areas of [[H01L29/66]] (24 applications), [[H01L23/00]] (19 applications), [[H01L21/768]] (16 applications), [[H01L23/31]] (14 applications), [[H01L21/56]] (13 applications) | ||
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[[Apple Inc.]]: 79 patent applications | [[Apple Inc.]]: 79 patent applications | ||
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Apple Inc.has filed patents in the areas of [[H04W72/232]] (10 applications), [[H04L5/00]] (10 applications), [[G06F3/0488]] (10 applications), [[G06F3/04883]] (10 applications), [[G06F3/04845]] (9 applications) | Apple Inc.has filed patents in the areas of [[H04W72/232]] (10 applications), [[H04L5/00]] (10 applications), [[G06F3/0488]] (10 applications), [[G06F3/04883]] (10 applications), [[G06F3/04845]] (9 applications) | ||
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[[SAMSUNG DISPLAY CO., LTD.]]: 56 patent applications | [[SAMSUNG DISPLAY CO., LTD.]]: 56 patent applications | ||
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SAMSUNG DISPLAY CO., LTD.has filed patents in the areas of [[H10K59/131]] (20 applications), [[H10K59/40]] (14 applications), [[G09G3/32]] (10 applications), [[G09G3/3266]] (10 applications), [[H10K50/844]] (10 applications) | SAMSUNG DISPLAY CO., LTD.has filed patents in the areas of [[H10K59/131]] (20 applications), [[H10K59/40]] (14 applications), [[G09G3/32]] (10 applications), [[G09G3/3266]] (10 applications), [[H10K50/844]] (10 applications) | ||
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[[NEC Corporation]]: 49 patent applications | [[NEC Corporation]]: 49 patent applications | ||
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NEC Corporationhas filed patents in the areas of [[G06V20/52]] (22 applications), [[G06V40/16]] (15 applications), [[H04N7/18]] (8 applications), [[G06F18/40]] (8 applications), [[H04N5/76]] (8 applications) | NEC Corporationhas filed patents in the areas of [[G06V20/52]] (22 applications), [[G06V40/16]] (15 applications), [[H04N7/18]] (8 applications), [[G06F18/40]] (8 applications), [[H04N5/76]] (8 applications) | ||
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[[SONY GROUP CORPORATION]]: 49 patent applications | [[SONY GROUP CORPORATION]]: 49 patent applications | ||
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SONY GROUP CORPORATIONhas filed patents in the areas of [[H04W72/0453]] (6 applications), [[H04N25/79]] (6 applications), [[H04W72/23]] (6 applications), [[G10L15/26]] (4 applications), [[G09G3/3233]] (4 applications) | SONY GROUP CORPORATIONhas filed patents in the areas of [[H04W72/0453]] (6 applications), [[H04N25/79]] (6 applications), [[H04W72/23]] (6 applications), [[G10L15/26]] (4 applications), [[G09G3/3233]] (4 applications) | ||
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[[Google LLC]]: 46 patent applications | [[Google LLC]]: 46 patent applications | ||
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Google LLChas filed patents in the areas of [[G06N20/00]] (9 applications), [[G06T7/73]] (5 applications), [[G06V10/82]] (4 applications), [[G10L17/22]] (4 applications), [[G06T7/70]] (4 applications) | Google LLChas filed patents in the areas of [[G06N20/00]] (9 applications), [[G06T7/73]] (5 applications), [[G06V10/82]] (4 applications), [[G10L17/22]] (4 applications), [[G06T7/70]] (4 applications) | ||
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[[Telefonaktiebolaget LM Ericsson (PUBL)]]: 45 patent applications | [[Telefonaktiebolaget LM Ericsson (PUBL)]]: 45 patent applications | ||
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Telefonaktiebolaget LM Ericsson (PUBL)has filed patents in the areas of [[H04W72/23]] (6 applications), [[H04W36/00]] (4 applications), [[H04W72/0446]] (4 applications), [[H04W76/20]] (4 applications), [[H04W72/21]] (4 applications) | Telefonaktiebolaget LM Ericsson (PUBL)has filed patents in the areas of [[H04W72/23]] (6 applications), [[H04W36/00]] (4 applications), [[H04W72/0446]] (4 applications), [[H04W76/20]] (4 applications), [[H04W72/21]] (4 applications) | ||
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[[LG Electronics Inc.]]: 44 patent applications | [[LG Electronics Inc.]]: 44 patent applications | ||
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LG Electronics Inc.has filed patents in the areas of [[H04N19/132]] (6 applications), [[H04N19/176]] (6 applications), [[H04N19/105]] (6 applications), [[H04W72/23]] (6 applications), [[H04N19/70]] (6 applications) | LG Electronics Inc.has filed patents in the areas of [[H04N19/132]] (6 applications), [[H04N19/176]] (6 applications), [[H04N19/105]] (6 applications), [[H04W72/23]] (6 applications), [[H04N19/70]] (6 applications) | ||
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[[International Business Machines Corporation]]: 39 patent applications | [[International Business Machines Corporation]]: 39 patent applications | ||
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International Business Machines Corporationhas filed patents in the areas of [[G06N10/40]] (10 applications), [[G06N3/08]] (5 applications), [[G10L15/22]] (4 applications), [[G06N5/04]] (4 applications), [[G06F21/62]] (4 applications) | International Business Machines Corporationhas filed patents in the areas of [[G06N10/40]] (10 applications), [[G06N3/08]] (5 applications), [[G10L15/22]] (4 applications), [[G06N5/04]] (4 applications), [[G06F21/62]] (4 applications) | ||
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[[Taiwan Semiconductor Manufacturing Co., Ltd.]]: 39 patent applications | [[Taiwan Semiconductor Manufacturing Co., Ltd.]]: 39 patent applications | ||
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Taiwan Semiconductor Manufacturing Co., Ltd.has filed patents in the areas of [[H01L29/66]] (15 applications), [[H01L29/78]] (14 applications), [[H01L29/66795]] (10 applications), [[H01L29/66545]] (8 applications), [[H01L29/785]] (7 applications) | Taiwan Semiconductor Manufacturing Co., Ltd.has filed patents in the areas of [[H01L29/66]] (15 applications), [[H01L29/78]] (14 applications), [[H01L29/66795]] (10 applications), [[H01L29/66545]] (8 applications), [[H01L29/785]] (7 applications) | ||
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[[Capital One Services, LLC]]: 37 patent applications | [[Capital One Services, LLC]]: 37 patent applications | ||
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Capital One Services, LLChas filed patents in the areas of [[H04L9/40]] (7 applications), [[G06F21/32]] (6 applications), [[G06V20/20]] (6 applications), [[G06Q10/087]] (6 applications), [[G06N20/00]] (5 applications) | Capital One Services, LLChas filed patents in the areas of [[H04L9/40]] (7 applications), [[G06F21/32]] (6 applications), [[G06V20/20]] (6 applications), [[G06Q10/087]] (6 applications), [[G06N20/00]] (5 applications) | ||
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[[Intel Corporation]]: 36 patent applications | [[Intel Corporation]]: 36 patent applications | ||
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Intel Corporationhas filed patents in the areas of [[G06T1/20]] (6 applications), [[G06N3/08]] (6 applications), [[H01L23/00]] (5 applications), [[H01L23/535]] (4 applications), [[H01L21/768]] (4 applications) | Intel Corporationhas filed patents in the areas of [[G06T1/20]] (6 applications), [[G06N3/08]] (6 applications), [[H01L23/00]] (5 applications), [[H01L23/535]] (4 applications), [[H01L21/768]] (4 applications) | ||
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[[Micron Technology, Inc.]]: 36 patent applications | [[Micron Technology, Inc.]]: 36 patent applications | ||
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Micron Technology, Inc.has filed patents in the areas of [[G06F3/06]] (11 applications), [[G06F3/0679]] (9 applications), [[G11C16/08]] (6 applications), [[G06F3/0659]] (5 applications), [[G06F3/0604]] (5 applications) | Micron Technology, Inc.has filed patents in the areas of [[G06F3/06]] (11 applications), [[G06F3/0679]] (9 applications), [[G11C16/08]] (6 applications), [[G06F3/0659]] (5 applications), [[G06F3/0604]] (5 applications) | ||
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[[GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.]]: 33 patent applications | [[GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.]]: 33 patent applications | ||
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GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.has filed patents in the areas of [[H04W64/00]] (6 applications), [[H04W72/1263]] (6 applications), [[H04W74/08]] (5 applications), [[H04N19/172]] (4 applications), [[H04W76/28]] (4 applications) | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.has filed patents in the areas of [[H04W64/00]] (6 applications), [[H04W72/1263]] (6 applications), [[H04W74/08]] (5 applications), [[H04N19/172]] (4 applications), [[H04W76/28]] (4 applications) | ||
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[[Robert Bosch GmbH]]: 33 patent applications | [[Robert Bosch GmbH]]: 33 patent applications | ||
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Robert Bosch GmbHhas filed patents in the areas of [[G06N20/00]] (4 applications), [[G06Q20/32]] (4 applications), [[G06V10/82]] (4 applications), [[H01M8/0444]] (3 applications), [[G06V20/58]] (3 applications) | Robert Bosch GmbHhas filed patents in the areas of [[G06N20/00]] (4 applications), [[G06Q20/32]] (4 applications), [[G06V10/82]] (4 applications), [[H01M8/0444]] (3 applications), [[G06V20/58]] (3 applications) | ||
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[[MICROSOFT TECHNOLOGY LICENSING, LLC]]: 33 patent applications | [[MICROSOFT TECHNOLOGY LICENSING, LLC]]: 33 patent applications | ||
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MICROSOFT TECHNOLOGY LICENSING, LLChas filed patents in the areas of [[G06N20/00]] (6 applications), [[G06F9/54]] (4 applications), [[G06F9/45558]] (4 applications), [[G06F9/455]] (4 applications), [[G06F8/36]] (4 applications) | MICROSOFT TECHNOLOGY LICENSING, LLChas filed patents in the areas of [[G06N20/00]] (6 applications), [[G06F9/54]] (4 applications), [[G06F9/45558]] (4 applications), [[G06F9/455]] (4 applications), [[G06F8/36]] (4 applications) | ||
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[[LG INNOTEK CO., LTD.]]: 32 patent applications | [[LG INNOTEK CO., LTD.]]: 32 patent applications | ||
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LG INNOTEK CO., LTD.has filed patents in the areas of [[H02J7/02]] (44 applications), [[H02J50/12]] (44 applications), [[H02J50/60]] (44 applications), [[H02J50/90]] (38 applications), [[H02J50/80]] (38 applications) | LG INNOTEK CO., LTD.has filed patents in the areas of [[H02J7/02]] (44 applications), [[H02J50/12]] (44 applications), [[H02J50/60]] (44 applications), [[H02J50/90]] (38 applications), [[H02J50/80]] (38 applications) | ||
Revision as of 05:58, 30 November 2023
Patent Applications Report for 24th Nov 2023
Top 20 organizations
Samsung Electronics Co., Ltd.: 199 patent applications
Samsung Electronics Co., Ltd.has filed patents in the areas of H04N19/176 (14 applications), H04N19/119 (12 applications), H04N19/105 (12 applications), G06V10/82 (10 applications), H04W48/18 (10 applications)
With keywords such as: the, and, first, second, device, for, includes, information, from, one
HUAWEI TECHNOLOGIES CO., LTD.: 113 patent applications
HUAWEI TECHNOLOGIES CO., LTD.has filed patents in the areas of H04L5/00 (14 applications), H04L1/1812 (12 applications), H04W72/0446 (8 applications), H04W72/23 (8 applications), H04W36/00 (7 applications)
With keywords such as: the, first, and, device, second, information, method, includes, network, data
QUALCOMM Incorporated: 104 patent applications
QUALCOMM Incorporatedhas filed patents in the areas of H04L5/00 (19 applications), H04W24/10 (16 applications), H04W72/232 (12 applications), H04W72/21 (12 applications), H04W72/23 (12 applications)
With keywords such as: the, may, and, for, first, with, one, second, wireless, aspects
Taiwan Semiconductor Manufacturing Company, Ltd.: 99 patent applications
Taiwan Semiconductor Manufacturing Company, Ltd.has filed patents in the areas of H01L29/66 (24 applications), H01L23/00 (19 applications), H01L21/768 (16 applications), H01L23/31 (14 applications), H01L21/56 (13 applications)
With keywords such as: the, and, first, layer, structure, second, includes, semiconductor, substrate, disposed
Apple Inc.: 79 patent applications
Apple Inc.has filed patents in the areas of H04W72/232 (10 applications), H04L5/00 (10 applications), G06F3/0488 (10 applications), G06F3/04883 (10 applications), G06F3/04845 (9 applications)
With keywords such as: the, and, for, device, may, first, with, user, that, one
SAMSUNG DISPLAY CO., LTD.: 56 patent applications
SAMSUNG DISPLAY CO., LTD.has filed patents in the areas of H10K59/131 (20 applications), H10K59/40 (14 applications), G09G3/32 (10 applications), G09G3/3266 (10 applications), H10K50/844 (10 applications)
With keywords such as: the, and, first, second, layer, display, electrode, area, includes, light
NEC Corporation: 49 patent applications
NEC Corporationhas filed patents in the areas of G06V20/52 (22 applications), G06V40/16 (15 applications), H04N7/18 (8 applications), G06F18/40 (8 applications), H04N5/76 (8 applications)
With keywords such as: the, and, that, information, unit, first, image, for, data, second
SONY GROUP CORPORATION: 49 patent applications
SONY GROUP CORPORATIONhas filed patents in the areas of H04W72/0453 (6 applications), H04N25/79 (6 applications), H04W72/23 (6 applications), G10L15/26 (4 applications), G09G3/3233 (4 applications)
With keywords such as: the, and, device, first, that, information, second, data, with, unit
Google LLC: 46 patent applications
Google LLChas filed patents in the areas of G06N20/00 (9 applications), G06T7/73 (5 applications), G06V10/82 (4 applications), G10L17/22 (4 applications), G06T7/70 (4 applications)
With keywords such as: the, and, data, for, device, with, one, first, includes, method
Telefonaktiebolaget LM Ericsson (PUBL): 45 patent applications
Telefonaktiebolaget LM Ericsson (PUBL)has filed patents in the areas of H04W72/23 (6 applications), H04W36/00 (4 applications), H04W72/0446 (4 applications), H04W76/20 (4 applications), H04W72/21 (4 applications)
With keywords such as: the, network, and, for, method, first, node, device, second, comprises
LG Electronics Inc.: 44 patent applications
LG Electronics Inc.has filed patents in the areas of H04N19/132 (6 applications), H04N19/176 (6 applications), H04N19/105 (6 applications), H04W72/23 (6 applications), H04N19/70 (6 applications)
With keywords such as: the, and, first, for, second, wireless, unit, information, data, method
International Business Machines Corporation: 39 patent applications
International Business Machines Corporationhas filed patents in the areas of G06N10/40 (10 applications), G06N3/08 (5 applications), G10L15/22 (4 applications), G06N5/04 (4 applications), G06F21/62 (4 applications)
With keywords such as: the, and, one, data, more, first, for, second, may, with
Taiwan Semiconductor Manufacturing Co., Ltd.: 39 patent applications
Taiwan Semiconductor Manufacturing Co., Ltd.has filed patents in the areas of H01L29/66 (15 applications), H01L29/78 (14 applications), H01L29/66795 (10 applications), H01L29/66545 (8 applications), H01L29/785 (7 applications)
With keywords such as: the, first, and, layer, second, dielectric, includes, over, gate, semiconductor
Capital One Services, LLC: 37 patent applications
Capital One Services, LLChas filed patents in the areas of H04L9/40 (7 applications), G06F21/32 (6 applications), G06V20/20 (6 applications), G06Q10/087 (6 applications), G06N20/00 (5 applications)
With keywords such as: the, and, user, for, may, data, one, device, more, with
Intel Corporation: 36 patent applications
Intel Corporationhas filed patents in the areas of G06T1/20 (6 applications), G06N3/08 (6 applications), H01L23/00 (5 applications), H01L23/535 (4 applications), H01L21/768 (4 applications)
With keywords such as: the, and, may, for, are, first, plurality, network, one, include
Micron Technology, Inc.: 36 patent applications
Micron Technology, Inc.has filed patents in the areas of G06F3/06 (11 applications), G06F3/0679 (9 applications), G11C16/08 (6 applications), G06F3/0659 (5 applications), G06F3/0604 (5 applications)
With keywords such as: the, memory, first, and, data, second, may, device, system, for
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.: 33 patent applications
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.has filed patents in the areas of H04W64/00 (6 applications), H04W72/1263 (6 applications), H04W74/08 (5 applications), H04N19/172 (4 applications), H04W76/28 (4 applications)
With keywords such as: the, first, and, device, method, information, second, terminal, includes, for
Robert Bosch GmbH: 33 patent applications
Robert Bosch GmbHhas filed patents in the areas of G06N20/00 (4 applications), G06Q20/32 (4 applications), G06V10/82 (4 applications), H01M8/0444 (3 applications), G06V20/58 (3 applications)
With keywords such as: the, and, for, vehicle, first, method, device, one, second, sensor
MICROSOFT TECHNOLOGY LICENSING, LLC: 33 patent applications
MICROSOFT TECHNOLOGY LICENSING, LLChas filed patents in the areas of G06N20/00 (6 applications), G06F9/54 (4 applications), G06F9/45558 (4 applications), G06F9/455 (4 applications), G06F8/36 (4 applications)
With keywords such as: the, and, for, that, with, may, data, device, system, plurality
LG INNOTEK CO., LTD.: 32 patent applications
LG INNOTEK CO., LTD.has filed patents in the areas of H02J7/02 (44 applications), H02J50/12 (44 applications), H02J50/60 (44 applications), H02J50/90 (38 applications), H02J50/80 (38 applications)
With keywords such as: the, power, wireless, packet, and, foreign, object, transmitter, status, first
Top 20 inventors in patent applications
Jae Hee PARK of Seoul (KR): 17 patent applications for LG INNOTEK CO., LTD.
Dawei ZHANG of Saratoga CA (US): 16 patent applications for Apple Inc.
James A. Harding of Issaquah WA (US): 13 patent applications for Grokit Data, Inc.
Scott Thibault of Colchester VT (US): 13 patent applications for Grokit Data, Inc.
Jason A. Boatman of Georgetown TX (US): 13 patent applications for Grokit Data, Inc.
Tao LUO of San Diego CA (US): 13 patent applications for QUALCOMM Incorporated
Phillip A. Quinn of Seattle WA (US): 13 patent applications for Grokit Data, Inc.
Yushu ZHANG of Beijing (CN): 12 patent applications for Apple Inc.
Kanthaiah Koka of Valencia CA (US): 11 patent applications for Medtronic, Inc.
Maneesh Shrivastav of Blaine MN (US): 11 patent applications for Medtronic, Inc.
David John Miller of Austin TX (US): 11 patent applications for Medtronic, Inc.
Leonid M. Litvak of Los Angeles CA (US): 11 patent applications for Medtronic, Inc.
Wei ZENG of Saratoga CA (US): 11 patent applications for Apple Inc.
Suryakiran Vadrevu of Santa Clarita CA (US): 11 patent applications for Medtronic, Inc.
Steven M. Goetz of North Oaks MN (US): 11 patent applications for Medtronic, Inc.
Xiaoxia ZHANG of San Diego CA (US): 10 patent applications for QUALCOMM Incorporated
Rebecca K. Gottlieb of Culver City CA (US): 10 patent applications for Medtronic, Inc.
ShaileshKumar V. Musley of Brooklyn Park MN (US): 10 patent applications for Medtronic, Inc.
Haitong SUN of Cupertino CA (US): 9 patent applications for Apple Inc.
Fengyun LIAO of Shenzhen (CN): 9 patent applications for SHENZHEN SHOKZ CO., LTD.