Category:Junghyun Lee of Suwon-si KR: Difference between revisions
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= Junghyun Lee = | = Junghyun Lee = | ||
Junghyun Lee from Suwon-si KR has applied for patents in technology areas such as [[:Category: | Junghyun Lee from Suwon-si KR has applied for patents in technology areas such as [[:Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}|Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] with [[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]. | ||
== Patents == | == Patents == | ||
* [[ | * [[20250218916. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)|SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE (20250218916)]] | ||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category: | [[Category:Samsung Electronics Co., Ltd.]] | ||
[[Category: | [[Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] | ||
Latest revision as of 17:25, 3 July 2025
Junghyun Lee
Junghyun Lee from Suwon-si KR has applied for patents in technology areas such as [[:Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}|Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]] with Samsung Electronics Co., Ltd..
Patents
[[Category:Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )}]]
Pages in category "Junghyun Lee of Suwon-si KR"
The following 5 pages are in this category, out of 5 total.