SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Abstract: a semiconductor package includes a first insulating layer, a second insulating layer on the first insulating layer, the second insulating layer having an opening, a pad on the first insulating layer or the second insulating layer to at least partially vertically overlap the opening, and a pad surface layer on an upper surface of the pad to at least partially vertically overlap the opening, the pad surface layer including a conductive material different from that of the pad. the upper surface of the pad is recessed to have a shape more curved than that of a lower surface of the pad.

Inventor(s): Seungwan Shin, Junghyun Lee

CPC Classification: H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )})

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