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Category:Chung-Shi Liu: Difference between revisions - WikiPatents Jump to content

Category:Chung-Shi Liu: Difference between revisions

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=== Executive Summary ===
=== Executive Summary ===
Chung-Shi Liu is an inventor who has filed 6 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate (3 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents). Their most frequent collaborators include [[Category:Chen-Hua Yu|Chen-Hua Yu]] (5 collaborations), [[Category:Hao-Yi Tsai|Hao-Yi Tsai]] (4 collaborations), [[Category:Chung-Ming Weng|Chung-Ming Weng]] (2 collaborations).
Chung-Shi Liu is an inventor who has filed 11 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate (3 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (9 patents), Taiwan Semiconductor Manufacturing Company Limited (2 patents). Their most frequent collaborators include [[Category:Chen-Hua Yu|Chen-Hua Yu]] (10 collaborations), [[Category:Hao-Yi Tsai|Hao-Yi Tsai]] (4 collaborations), [[Category:Tsung-Fu Tsai|Tsung-Fu Tsai]] (3 collaborations).


=== Patent Filing Activity ===
=== Patent Filing Activity ===
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* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 2 patents
* [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 2 patents
* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L21/76254|H01L21/76254]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 2 patents
* [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H05K1/0298|H05K1/0298]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4202|G02B6/4202]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4274|G02B6/4274]] (Coupling light guides with opto-electronic elements): 1 patents
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* [[:Category:CPC_H01L2224/16148|H01L2224/16148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/16148|H01L2224/16148]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/19033|H01L2924/19033]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/19033|H01L2924/19033]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_G02B6/4283|G02B6/4283]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4291|G02B6/4291]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4293|G02B6/4293]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L23/49833|H01L23/49833]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 1 patents
* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
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* [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 1 patents
* [[:Category:CPC_H01L21/266|H01L21/266]] (using masks {(): 1 patents
* [[:Category:CPC_H01L21/266|H01L21/266]] (using masks {(): 1 patents
* [[:Category:CPC_H01L21/76254|H01L21/76254]] (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 1 patents
* [[:Category:CPC_G02F1/0113|G02F1/0113]] ({in optical waveguides, not otherwise provided for in this subclass}): 1 patents
* [[:Category:CPC_G02F1/0102|G02F1/0102]] (for the control of the intensity, phase, polarisation or colour   (): 1 patents
* [[:Category:CPC_G02F2201/02|G02F2201/02]] (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
* [[:Category:CPC_G02F2201/128|G02F2201/128]] (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
* [[:Category:CPC_G02F2201/302|G02F2201/302]] (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/83896|H01L2224/83896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3185|H01L23/3185]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3185|H01L23/3185]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates  (): 1 patents
* [[:Category:CPC_H01L23/5383|H01L23/5383]] ({Multilayer substrates  (): 1 patents
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/17|H01L24/17]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
* [[:Category:CPC_H01L25/50|H01L25/50]] ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
* [[:Category:CPC_H05K1/0271|H05K1/0271]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K1/0271|H05K1/0271]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K1/0298|H05K1/0298]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H01L2224/02373|H01L2224/02373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/02373|H01L2224/02373]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/568|H01L21/568]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3128|H01L23/3128]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/4006|H01L23/4006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/4006|H01L23/4006]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
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* [[:Category:CPC_H01L2023/4087|H01L2023/4087]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2023/4087|H01L2023/4087]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/211|H01L2224/211]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3135|H01L23/3135]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/3142|H01L23/3142]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/02335|H01L2224/02335]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/12105|H01L2224/12105]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H05K3/4046|H05K3/4046]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H01L23/3735|H01L23/3735]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
* [[:Category:CPC_H05K1/113|H05K1/113]] (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
* [[:Category:CPC_H05K3/0061|H05K3/0061]] (Apparatus or processes for manufacturing printed circuits): 1 patents
* [[:Category:CPC_Y10T29/49165|Y10T29/49165]] (No explanation available): 1 patents


=== Companies ===
=== Companies ===
Line 59: Line 80:


==== List of Companies ====
==== List of Companies ====
* Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents
* Taiwan Semiconductor Manufacturing Company, Ltd.: 9 patents
* Taiwan Semiconductor Manufacturing Company Limited: 2 patents


=== Collaborators ===
=== Collaborators ===
* [[:Category:Chen-Hua Yu|Chen-Hua Yu]][[Category:Chen-Hua Yu]] (5 collaborations)
* [[:Category:Chen-Hua Yu|Chen-Hua Yu]][[Category:Chen-Hua Yu]] (10 collaborations)
* [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (4 collaborations)
* [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (4 collaborations)
* [[:Category:Tsung-Fu Tsai|Tsung-Fu Tsai]][[Category:Tsung-Fu Tsai]] (3 collaborations)
* [[:Category:Szu-Wei Lu|Szu-Wei Lu]][[Category:Szu-Wei Lu]] (3 collaborations)
* [[:Category:Jiun-Yi Wu|Jiun-Yi Wu]][[Category:Jiun-Yi Wu]] (3 collaborations)
* [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (2 collaborations)
* [[:Category:Chung-Ming Weng|Chung-Ming Weng]][[Category:Chung-Ming Weng]] (2 collaborations)
* [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations)
* [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations)
Line 69: Line 94:
* [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (2 collaborations)
* [[:Category:Tsung-Yuan Yu|Tsung-Yuan Yu]][[Category:Tsung-Yuan Yu]] (2 collaborations)
* [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (2 collaborations)
* [[:Category:Hua-Kuei Lin|Hua-Kuei Lin]][[Category:Hua-Kuei Lin]] (2 collaborations)
* [[:Category:Chien-Hsun Lee|Chien-Hsun Lee]][[Category:Chien-Hsun Lee]] (2 collaborations)
* [[:Category:Jih-Churng Twu|Jih-Churng Twu]][[Category:Jih-Churng Twu]] (2 collaborations)
* [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (2 collaborations)
* [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (2 collaborations)
* [[:Category:Hsiu-Jen Lin|Hsiu-Jen Lin]][[Category:Hsiu-Jen Lin]] (1 collaborations)
* [[:Category:Hsiu-Jen Lin|Hsiu-Jen Lin]][[Category:Hsiu-Jen Lin]] (1 collaborations)
Line 75: Line 102:
* [[:Category:Chewn-Pu Jou|Chewn-Pu Jou]][[Category:Chewn-Pu Jou]] (1 collaborations)
* [[:Category:Chewn-Pu Jou|Chewn-Pu Jou]][[Category:Chewn-Pu Jou]] (1 collaborations)
* [[:Category:Cheng-Tse Tang|Cheng-Tse Tang]][[Category:Cheng-Tse Tang]] (1 collaborations)
* [[:Category:Cheng-Tse Tang|Cheng-Tse Tang]][[Category:Cheng-Tse Tang]] (1 collaborations)
* [[:Category:Chao-Jen Wang|Chao-Jen Wang]][[Category:Chao-Jen Wang]] (1 collaborations)
* [[:Category:Chien-Hsun Chen|Chien-Hsun Chen]][[Category:Chien-Hsun Chen]] (1 collaborations)
* [[:Category:Chien-Hsun Chen|Chien-Hsun Chen]][[Category:Chien-Hsun Chen]] (1 collaborations)
* [[:Category:Chien-Hsun Lee|Chien-Hsun Lee]][[Category:Chien-Hsun Lee]] (1 collaborations)
* [[:Category:Jiun-Yi Wu|Jiun-Yi Wu]][[Category:Jiun-Yi Wu]] (1 collaborations)
* [[:Category:Shou-Yi Wang|Shou-Yi Wang]][[Category:Shou-Yi Wang]] (1 collaborations)
* [[:Category:Shou-Yi Wang|Shou-Yi Wang]][[Category:Shou-Yi Wang]] (1 collaborations)
* [[:Category:Tsung-Ding Wang|Tsung-Ding Wang]][[Category:Tsung-Ding Wang]] (1 collaborations)
* [[:Category:Tsung-Ding Wang|Tsung-Ding Wang]][[Category:Tsung-Ding Wang]] (1 collaborations)
Line 83: Line 109:
* [[:Category:Su-Chun Yang|Su-Chun Yang]][[Category:Su-Chun Yang]] (1 collaborations)
* [[:Category:Su-Chun Yang|Su-Chun Yang]][[Category:Su-Chun Yang]] (1 collaborations)
* [[:Category:Jui Hsuan Tsai|Jui Hsuan Tsai]][[Category:Jui Hsuan Tsai]] (1 collaborations)
* [[:Category:Jui Hsuan Tsai|Jui Hsuan Tsai]][[Category:Jui Hsuan Tsai]] (1 collaborations)
* [[:Category:Jih-Churng Twu|Jih-Churng Twu]][[Category:Jih-Churng Twu]] (1 collaborations)
* [[:Category:Shuen-Shin Liang|Shuen-Shin Liang]][[Category:Shuen-Shin Liang]] (1 collaborations)
* [[:Category:Chen-Chiang Yu|Chen-Chiang Yu]][[Category:Chen-Chiang Yu]] (1 collaborations)
* [[:Category:Yu-Chia Lai|Yu-Chia Lai]][[Category:Yu-Chia Lai]] (1 collaborations)
* [[:Category:Yu-Chia Lai|Yu-Chia Lai]][[Category:Yu-Chia Lai]] (1 collaborations)
* [[:Category:Po-Yuan Teng|Po-Yuan Teng]][[Category:Po-Yuan Teng]] (1 collaborations)
* [[:Category:Po-Yuan Teng|Po-Yuan Teng]][[Category:Po-Yuan Teng]] (1 collaborations)
* [[:Category:Yu-Min Liang|Yu-Min Liang]][[Category:Yu-Min Liang]] (1 collaborations)


[[Category:Chung-Shi Liu]]
[[Category:Chung-Shi Liu]]
[[Category:Inventors]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]]
[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company, Ltd.]]
[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Company Limited]]

Latest revision as of 08:39, 2 May 2025

Chung-Shi Liu

Executive Summary

Chung-Shi Liu is an inventor who has filed 11 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (3 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (9 patents), Taiwan Semiconductor Manufacturing Company Limited (2 patents). Their most frequent collaborators include (10 collaborations), (4 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

  • H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
  • H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 3 patents
  • H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
  • H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
  • H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 2 patents
  • H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
  • H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
  • G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
  • H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
  • H01L2224/16055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/19033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents
  • G02B6/4291 (Coupling light guides with opto-electronic elements): 1 patents
  • G02B6/4293 (Coupling light guides with opto-electronic elements): 1 patents
  • H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
  • H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
  • H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1811 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
  • H01L21/266 (using masks {(): 1 patents
  • G02F1/0113 ({in optical waveguides, not otherwise provided for in this subclass}): 1 patents
  • G02F1/0102 (for the control of the intensity, phase, polarisation or colour  (): 1 patents
  • G02F2201/02 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
  • G02F2201/128 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
  • G02F2201/302 (OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS): 1 patents
  • H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
  • H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5383 ({Multilayer substrates (): 1 patents
  • H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
  • H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2023/4031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2023/405 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2023/4087 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/02335 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H05K3/4046 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
  • H05K1/113 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H05K3/0061 (Apparatus or processes for manufacturing printed circuits): 1 patents
  • Y10T29/49165 (No explanation available): 1 patents

Companies

List of Companies

  • Taiwan Semiconductor Manufacturing Company, Ltd.: 9 patents
  • Taiwan Semiconductor Manufacturing Company Limited: 2 patents

Collaborators

Subcategories

This category has the following 10 subcategories, out of 10 total.

C

H

J

K

S

W

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