Ping-Wei Wang

Executive Summary

Ping-Wei Wang is an inventor who has filed 14 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (9 patents), ELECTRONIC MEMORY DEVICES (4 patents), No explanation available (4 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents). Their most frequent collaborators include (13 collaborations), (9 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H10B10/125 (ELECTRONIC MEMORY DEVICES): 9 patents
• H10B10/18 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10D30/43 (No explanation available): 4 patents
• H10D30/6735 (No explanation available): 4 patents
• H10D30/6757 (No explanation available): 4 patents
• H10D62/121 (No explanation available): 4 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H10B20/25 (One-time programmable ROM [OTPROM] devices, e.g. using electrically-fusible links): 2 patents
• H10B10/12 (ELECTRONIC MEMORY DEVICES): 2 patents
• H10D84/83 (No explanation available): 2 patents
• H10D84/038 (No explanation available): 2 patents
• H10D30/014 (No explanation available): 2 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5256 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0649 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823878 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G11C11/412 (using field-effect transistors only): 1 patents
• G11C11/417 (forming {static} cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H10D64/254 (No explanation available): 1 patents
• H10D84/0151 (No explanation available): 1 patents
• H10D30/024 (No explanation available): 1 patents
• H10D30/6211 (No explanation available): 1 patents
• H10D64/017 (No explanation available): 1 patents
• H10D84/013 (No explanation available): 1 patents
• H10D84/0135 (No explanation available): 1 patents
• H10D84/0149 (No explanation available): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents

Collaborators

• Jui-Lin Chen (13 collaborations)
• Feng-Ming Chang (9 collaborations)
• Yu-Bey Wu (5 collaborations)
• Lien-Jung Hung (3 collaborations)
• Jui-Wen Chang (2 collaborations)
• Gu-Huan Li (2 collaborations)
• Chih-Ching Wang (1 collaborations)
• Meng-Sheng Chang (1 collaborations)
• Chen-Ming Lee (1 collaborations)
• Chia-Hao Pao (1 collaborations)
• Yu-Kuan Lin (1 collaborations)
• Choh Fei Yeap (1 collaborations)